JOHN K. HEACOX
Wichita Falls, Texas
Email: **********@*****.***
SUMMARY:
Project Management, Electro-mechanical Design Engineering, IC Packaging & Process Engineering. Over 38K hours computer aided design experience. Software proficiencies: Solidworks, AutoCAD, Microsoft Office, PADs PCB, Orcad PCB layout EXPERIENCE:
BW Sinclair – Mechanical Engineer 11/2019 to 5/2024 - Designing bulk material handling equipment to include trough and screw conveyors, hoppers and drive components. Sager Electronics – Mechanical Engineer 10/2003 to 11/2019 Responsibilities include Overall project management to design, cost and build electro- mechanical enclosures and AC/DC power supplies. Design and build projects from concept to production by utilizing prototyping and design review processes & budgetary analysis. Created Bills of Materials (BOMs). Utilized Solidworks since 1997 to design rack mounted and hot swap power supplies. Used PadsPCB to layout PCBs and cross check for mechanical fit. Generated all documentation for assembly and wire harnesses.
Link World Trade - Product Engineer - 11/2002 - 9/2003 Key person in an engineering group to develop “smart” traffic signals, enclosures and LED replacement bulbs. Performed mold design for reflectors and housing parts as well as laying out critical PCBs.
Substrate Technologies, Inc., Product Engineer - 4/2001 - 7/2002 Was responsible for product development and process definition. Also, designed high density PCBs and BGAs for production.
Infinitec Networks - Sr. PCB Designer- 3/99 to 2/01 Responsible to capture schematics and drive them forward to create Printed Circuit Board designs for Telecom products. AVO International - PCB Design & Layout, Document control 12/96 to 3/99 Responsible to make corrections to over 20,000 drawings in both board drawn and AutoCAD generated formats. AVO manufactures instrumentation for the utility industry. A.K. TECHNOLOGY - Process Engineer, Tooling design Engineer 9/93 TO 10/96 Responsible for the Engineering effort to develop methods and tooling to produce BGA Packaging.
HEACOX DESIGN SERVICES - Consultant and Contract Design Services to the I.C. Industry 10/91 TO 9/93. Serviced four clients during this period. Sought positions with AK Technology. Also, designed a raised platform for chemical processing in 3D and piping/valves for Mary Kay Cosmetics.
MICROSUN Dallas & MICROSUN Singapore - Manager Cad Division 03/91 TO 10/91 Responsible for the recruitment, training and management of CAD personnel. Provided Engineering support to 12 Designers & cultivate new business opportunities. AMKOR Electronics - Package Design Engineer 11/84 TO 03/91 Responsible for the engineering effort required to bring online several I.C. Packages. Traveled to Seoul, South Korea to interface with corporate engineering and to set up delivered process equipment. Was instrumental in mold design, buy-off and commissioning. INDY Electronics - Packaging Engineer 04/84 TO 11/84 Backend Process Engineering UTMC - Package Technician 08/82 TO 04/84 Mold room equipment Technician. INDY ELECTRONICS - Mold Tech 04/81 to 08/82 also used AutoCAD to design mold room fixtures.
Oakland Public Schools - Journeyman Electrician 01/81 to 04/81 BENKISER ELECTRIC – Electrician & Motor re-winder 04/79 TO 01/81 U.S.NAVY - Nuclear Power Plant Electrician 01/74 TO 04/79 EDUCATION:
Coursework towards a BSME (1979-1996)
US NAVY Nuclear Power Training 1975
US NAVY Electrician’s Mate “A” school 1974
PERSONAL:
US Patent #5,965,433 – 1 of 3 Inventors listed on a device to aid in the transport of donated human organs