Design Engineer Hardware

NAM HOANG

Hardware Design Engineer

******.**********@*****.*** - Phone number:

0907020396HCMC, Vietnam

SUMMARY

I am an experienced Hardware Engineer who has worked on multiple product lines throughout my career. I have a passion for designing and developing security operation. As a member of the SOC Security team (Front-end design 11, Renesas Electronic), I am excited to work on the forefront of physical security and contribute to the mission of creating safer communities. EXPERIENCE

R/D Engineer 03/2021 - 09/2021

Schafer VN Amata, Bien Hoa

Working on the Hardware development for warehouse integrated Drone project, data digitalization specialist.

• SolidWorks task which created 3D models, assemblies, and detailed drawings for machine and plastic parts for the Drone project.

Hardware Design Engineer 2021 - 2023

Renesas Electronics HCMC, VN

Security Design Group.

• Designed and validated all aspects of EE design, collaborating with Japan partners to ensure successful product launches.

• PIC for the relevant IPs: Life Cycle Manage, ICUMX, Secure ROM

• Technologies familiar: Been working with 3nm technology and 7nm technology for SOC products from R-Car gen 4 till R-Car gen 5 (RENESAS)

• Verification: PIC for LIFEC, ICUMX verification

• Performed the Functional Verification for both CT( Combination Test) and UT (Unit Test) for security IP relevant (LIFEC, SECROM and ICUMX)

• Design Synthesis: PIC for LIFEC, ICUMX synthesize

• Performed the Synthesis for LIFEC and ICUMX,

• Processed from flattened gate level, through several gate checkers (FM, DFTcheck, STAcheck, Formality, MetaFF, Amateras, ...)

• Familiar with JP working flow from DN (Dirty Netlist) till CN (Clean Netlist), 5-why, Peer review, Redmine user, ...

• TESTER phase

• Handle the tester phase for LIFEC and ICUD module since Gen4 product SOC:

• EVCD, stil2sim, vtb, ...

R/D Senior Expert Engineer

Sharp Electronic (09/2023-On going) Binh Duong

• As a Development Engineer at Sharp Electronics, I specialize in camera module development for iPhones. My daily responsibilities include managing the FPC (Flexible Printed Circuit), coordinating with the Project Manager for mass production, and overseeing the NPI (New Product Introduction) process.

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• Checking VCM (Voice Coil Motor), Substrate, and IFCF components for quality and functionality.

• Analyzing substrate warpage and its correlation with performance.

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• Collaborating with the FACA (Failure Analysis) team to optimize the SMT (Surface Mount Technology) manufacturing process.

EDUCATION

Bachelor of Electrical and Electronic (Honors) 2016 - 2018 RMIT University, Melbourne Melbourne, AUS

Bachelor of Electrical and Electronic (Honors) 2019 - 2021 RMIT International University Vietnam HCMC, Vietnam Diploma of TESOL 2021 - 2022

STRENGTH:

International Student from AUS education,

therefore, communication and presenting

skills would be a plus. Experience working

for several DFI (Direct foreign Investment

companies) as well as Australian

companies as part-time jobs.

SKILLS

Circuit Design PCB Layout Programming

and scripting language SOC knowledge

Product Validation Debugging Project

Management. UVM SVA System Verilog

SolidWorks EDA tools familiar.

Contact this candidate