Post Job Free
Sign in

Design Engineer Hardware

Location:
Hyderabad, Telangana, India
Posted:
May 22, 2024

Contact this candidate

Resume:

VINAY KUMAR

(Sr. HARDWARE ENGINEER)

ad5vfi@r.postjobfree.com

91-812*******.

Highly experienced embedded hardware engineer with a wide exposure to various electronics technology as well as in end-to-end product development life cycle is seeking a suitable position with a reputed company and add value to the organization by being an integral part of a Research and Development team with complete perfection and professionalism.

Hardware Design Engineer with 7.5 years of experience in Mixed signal Board design, Testing and Debugging of Embedded systems, component Engineering, Board Bring up, Concept to manufacturing cycle experience. Currently working as a Senior Hardware Design Engineer for Capgemini Engineering Services from June 2022 to till date.

Experience in design and development for various design environments like Aerospace and Medical & Electric Mechanical Controlled systems.

Hands on design and testing experience with Micro Processor, ADC & DAC, and various types of communication buses like I2C, SPI, RS232, RS422, Mil-std-1553 & UART.

Experience on schematic capture as per the company specification, Component selection, Net list review, Component sourcing, selection and BOM finalization, Hierarchical Schematic design and test reports preparation

Experience with Memory’s like NOR and EEPROM

Knowledge about High speed, USB and Display interfaces.

Hands on experience on EMI/ EMC tests like Emission tests, Susceptibility level tests, ESD

Component Engineering, good experience in worst case Analysis and Reliability.

Experience on Board Bring-up, Debugging and Testing.

Experience on Interfacing Controller with sensors like Temperature sensor and current sensors.

Selection of power supply design like switching regulators and Linear Regulator.

Product Re-engineering and cost reduction

Experience on 16- and 32-bit Microcontrollers, Microprocessor & FPGAs

Working on Product life cycle assessment tools like HIS MARKIT & Team center, Silicon Expert.

Hands on experience on PCB level thermal and high temperature tests and equipment level tests like Vibration, High and Low Temperatures.

Documentation of Power, Derating calculations, and MTBF Calculations.

Experience on Signal Integrity & PCB Layout Routing Validation.

Experience in design documentation with compliance to ISO, IEC, and EU Standards and knowledge on

Experience on Worst case circuit analysis and knowledge on DFMEA.

Experience in the design and development of Analog, Digital and Embedded board design

Involved in complete Board design cycle.

Good at circuit trouble shooting, rework.

Component validation using the directives of ROHS (2011/65/EU & 2015/863/EU), WEEE (2012/19/EU) and REACH and Battery directive.

Experience on Mechanical Product validation using COC or Fabrication drawing with representation to Material Composition.

Carrying of BLDC motor Tests like Speed and Back EMF, Speed & Torque.

Executed tests using sophisticated instrumentation such as Logic Analyzer, Digital and Storage oscilloscopes, Function Generators, SMPS, Mulitmeter and rework system (soldering station).

Solving Hardware debugs (working with software engineers to resolve functional issues in lab). EXPERIENCES

PROFESSIONAL SYNOPSIS &

RESPONSIBILITIES

Knowledge on Tools & Instruments:

Simulation Tools : PSpice A/D, LTspice, TINA

Schematic Entry : ORCAD & Altium Designer.

Layout tools : Altium Designer.

Testing Tools : Digital multi meter, Oscilloscope, Logic analyzer and Function Generator and Digital Scope Corders.

PLM Tools : One PDM, TCU, IHS Markit, Silicon Expert. Qualifications

2015 B-Tech (EEE) from JNTU (Vignan’s Lara Institute of Technology) with 79.36%.

2012 DIPLOMA (EEE) from SBTET (GOVT POLYTECHNIC VIJAYAWADA) with 88.48%.

2009 Secondary Education from Geethanjali EM School (GUNTUR DT) with 86%. Experience

• June (2022) –Till: Sr. Embedded Hardware Engineer in Capgemini Engineering Services.

• 2019 (Sept)-June 2022: Embedded Hardware Engineer / Lead Engineer in HCL Technologies

• 2019 (Apr)-2019(Aug): Hardware Design Engineer in Tata Consultancy Services (HYD) with Third party Payroll.

• 2016(May) – 2019 (Apr): R&D Engineer in Nucon Aerospace Pvt LTD. PROJECTS HANDLED

Project Experience Description

Role: Sr. Hardware Engineer in

Capgemini Engineering Services

Duration: June 2022 to Till Date

Role: Hardware Design

Engineer in HCL Technologies

Duration: Sep 2019 to June 2022

Client: Electrolux

Role: Sr. Hardware Engineer

Responsibilities:

Analyzing the circuit.

Redesign of Circuit due to Microcontroller.

Alternate components selection and BOM preparation

Interface Microcontroller to Peripherals using UART, I2C & SPI

Selection of power supply design like switching regulators and Linear Regulator.

Doing Power Analysis, Stress analysis for Components

Component’s library creation and schematic entry

EMI/EMC Testing, Board brings up.

PCB Layout Review.

Client: Microsoft, Redmond

Role: Hardware Design Engineer

Responsibilities:

Analyzing the circuit.

Alternate components selection and BOM preparation

Selection of power supply design like switching regulators and Linear Regulator.

Product Re-engineering and cost reduction.

Work in Azure Devops automation.

Provide Engineering Change management, Bill of Material (BOM) process to support product data release.

Work in concert with Component and Design engineering community for parts, documents and engineering change creation and management.

BOM auditing, writing, and implementing Engineering Change Requests (ECRs), Engineering Change Orders (ECOs), and Deviations

Work on SKU for all the SSD, HDDS and DIMM- Memory Modules.

Built New SKU, Add Allowable substitute, or Alternatives to enhance MSPNs (Microsoft Part numbers) and ease Supply Chain process.

Assignment of SKU Demand Mapping via ADO automated Tickets.

Update Firmware (FW) Versions as per the change request. Client: BAXTER

Role: Hardware Design Engineer

Responsibilities:

Component selection and validation using manufacturer datasheet, material Declaration, COCS from the manufacturer for all the Electrical & Electronic Equipment’s.

Components selection & identifying alternates to obsolete Parts.

Doing Redline Creation for the Revision Change files and Releases Final revision to customer.

Creating the BOM and BOM Alternates in TCU.

Analyze the part change history and sequence of events.

Creating Redline to the old revision by comparing the new revision.

Requirements understanding & Involved in the Board design based on the Specification.

Suggested on placing the components considering Board. parameters, schematic entry.

Layout review.

Doing Power Analysis, Worst case Analysis, DE rating Analysis for the Active and Passive components.

Board bring up and testing.

Alternate part recommendation, part availability and EOL conformation from manufacturers.

Project Name: Triconex

Client Name: Schneider Electric.

Role: Hardware Design

Engineer in Tata Consultancy

Services (on third party payroll).

Duration: Apr’19– Aug’2019

Responsibilities:

Hardware Design and Development of project.

Component’s library creation and schematic entry

Working on Product life cycle assessment tools like IHS MARKIT & Teamcenter.

Documentation of Power, Derating calculations,

and MTBF Calculations.

Experience in design documentation with compliance to ISO, IEC, and EU Standards

Experience in the design and development of Mixed Signal and Embedded board design

Creating Schematics in Orcad and providing support to all designers to perform component research and participate in component life cycle and evaluate all components for various processes. Its controller designed for controlling the Electromechanical Rotator Actuators of 4 Channels at a time of a Next Generation Anti-Radiation Surface to Air Missile (NGARM) based on BLDC motors and Feed Back element as an LVDT. The

controller is designed as position servo system with velocity feedback was in LVDTacts as position sensor and 3- phase alternator works as velocity sensor. The controller is built on the DSP Controller & FPGA that calculates the velocity magnitude as per the designed algorithm and output in direction format to generatenecessary PWM Signals which are optically isolated and buffered to drive the midgets and supports I2C, SPI & 1553 interfaces

Project Name:

NGARM (Next Generation

Anti- Radiation Missile) Client

Name: RCI

/DRDO Hyderabad.

Role: R&D Engineer in Nucon

Aerospace Pvt Ltd.

Duration: Jun’18 – Apr’2019

Component Selection & Schematics Design with the help of Orcad capturesand compares schematic Bom with PCB Bom and Net list Verification.

Power dissipation Calculations, Derating, Thermal and MTBF Calculations

Preparation of PDR and CDR Documents.

Involved in Signal Integrity and PCB layout and Routing.

Closely worked with PCB Layout teams for 4/12 Layer boards and Expertise in PCB layout placement design architect and Layout review in Allegro and Altium Designer

Component’s obsolescence management.

EMI/EMC Testing & Proto Unit Avionics Environmental Testing.

Involved in QT and AT Tests of the Product as per the Costumer Requirement according to EMI EMC (MIL STD- 461E) and Environmental tests (MIL STD- 810G).

Boardbring up and testing Carrying of BLDC motor tests like Speed and Back EMF, Speed & Torque.

Debugging of board with the interaction of Software team.

Interfacing ADC to Processor using I2C & SPI and Interfacing Current Sensor, motor drivers to Processor.

Prepared Technical Architecture documents & Single Line Block Diagram for Easy Understand of Schematics and Process.

Testing of Electromechanical appliances manually and by using Automation tools like NI & GUI Based Systems. Project Name:

.

Dual Channel Digital Controller

of Garuthma and Garuda.

Client Name: RCI /DRDO

Hyderabad.

It is a FPGA based 1553 mill controller designed for controlling the Electromechanical Linear actuators based on BLDC motors. It is used in air- to-surface anti-radiation missile Garuthma and Garuda. The controller is designed as position servo system with

Role: R&D Junior Engineer in

Nucon Aerospace Pvt Ltd

Velocity feedback was in LVDT acts as position sensor and 3phase alternator works as velocity sensor. The controller is built on the DSP Controller that calculates the velocity Duration: May’17 – May’18

Responsibilities:

Component Selection & Schematics Design with the help of Orcad capturesand compares schematic Bom with PCB Bom and Net list Verification.

Power dissipation Calculations, Derating, Thermal and MTBF Calculations

Preparation of PDR and CDR Documents.

Closely worked with PCB Layout teams for 4/12 Layer boards and Expertise in PCB layout placement design architect and Layout review in Allegro and Altium Designer.

Interfacing Controller with sensors like Temperature sensor and current sensors.

Selection of power supply design like switching regulators and Linear Regulator.

Product Re-engineering and cost reduction.

Component’s library creation and schematic entry

Requirement according to EMI EMC (MIL STD-461E) and Environmental tests (MIL STD-810G).

Interfacing ADC to Processor using I2C & SPI and Interfacing Current Sensors, motor drivers to Processor.

Prepared Technical Architecture documents & Single Line Block Diagrams for Easy Understand of Schematics and Process.

Testing of Electromechanical appliances manually and by using Automation tools like NI & GUI Based Systems.

It is a DSP based RS422 controller designed for controlling the Electromechanical Rotator Actuators of 4 Channels at a time of a Medium Project Name:

Rear Servo Actuation System

Range Surface to Air Missile (MRSAM) based on BLDC motors and Feed Back element as an LVDT. QRSAM used as the rear servo actuator

(RSA) missile level. RSA has four channels EMA with controller, major Client Name: RCI

/DRDOHyderabad.

Role: R&D GET in Nucon

Aerospace Pvt Ltd.

parts in this RSA is ADSP, ADC, DAC, LVDT, BLDC motor, RS422, I/p signal given through RS422 to ADC is compare with LVDT feedback signal fed to ADSP isprocessing signal fed to DAC.O/p of the DAC error signal is given to motor Controller IC (MC33035). High power MOSFET circuit drives the motor based on the hall sensing i/p signals to motor controller IC, direction signal from Processor. Motor along with ball Duration: May’16 – Apr’17 screw link with torque shaft rotates 25 Responsibilities:

Component Selection & Schematics Design with the help of Orcad

captures and compares schematic Bom with PCB Bom and Net list Verification.

Power dissipation Calculations, Derating, Thermal and MTBF Calculations,

Component’s obsolescence management.

EMI/EMC Testing & Proto Unit Avionics Environmental Testing. Involved in QT and AT Tests of the Product as per the Costumer Requirement according to EMI EMC (MIL STD-461E) and Environmental tests (MIL STD-810G).

Boardbring up and testing Carrying of BLDC motor tests like Speed and Back EMF, Speed & Torque.

Interfacing Current Sensors, motor drivers to Processor.

Prepared Technical Architecture documents & Single Line Block Diagrams for Easy Understand of Schematics and Process.

Strengths:

Committed and dedicated to work.

Ability to work independently and be self-motivated.

Ability to work effectively in a team environment

Strong oral and written communication skills

Ability to work under pressure and heavy workload.

Able to handle team and maintaining scrum daily.

Ability to the manage resource.

Achievements:

Awarded “Excellent Performance and Outstanding Performance” in Annual Rating in HCL Technologies

Awarded Outstanding Employee of the Year in Successive two Years in Nucon Aero Space Pvt Ltd

PERSONAL DETAILS:

Name : Bhavanasi Vinay kumar

Fathers Name : Bhavanasi Samba Siva Rao

Date of Birth : 12-08-1994

Gender : Male

Marital status : Unmarried

Language : English, Telugu, and Hindi.

Passport : Yes (Validity up to 2029)

DECLARATION

I do hereby confirm that the facts given by me in this bio-data is true to the best of my knowledge. Place : yours sincerely,

Date : Vinay Kumar



Contact this candidate