Vito Adragna

Professional Summary

A Senior Printed Circuit Board Designer utilizing my broad-based knowledge, from concept to prototype through production. To ensure & reinforce your company’s needs for on time delivery and cost reduction. Always staying current with updated Webinars and white paper articles.

Skills

*Extensive PCB Design knowledge *Able to handle multiple projects *Well organized

*Advanced critical thinking *Team player/communicator *Time management

*Design process tool methodology *Professional Engineering Attitude

PCB Design Experience Includes: Digital, Analog, Power Supply, RF, Microwave, Differential Pairs, HDMI, BGA, High Speed, EMI, Strip Line/Micro Strip, Matched Impedance, Flex, Power/Ground Fan Outs, Trace Widths, Net Rules, Micro Blind/Buried Vias, Shielding, DDR, ECL Routing, DFM, DFA, DFT, Reverse Engineering of older legacy designs. Ethernet, SATA, PCI, USB. LVDS, LDO, DDR4.

EDA Tools: ALTIUM V23, MENTOR XPEDITION (VX2.2), MENTOR GRAPHICS PADS, CAM350. I have used Altium full time for the past 15 years. I was an expert MENTOR PADS user with Motorola for 12 years. I am now currently training myself on the Cadence/Allegro software suite.

Work History:

FreedomCAD Design Service Bureau: 5/22/2023 to 7/24/2023: Various Companies and Industry’s: 16 Layer 126 Diff Pair Design. Large High/Low Power TESLA Test Board. Dense 8 layer Double Sided Laser Current Sense Designs. Was let go after 8 weeks due to company downsizing along with 2 other designers.

Teledyne Controls & Aircraft, CA: 12/2022 to 4/2023 and 9/2023 to Current

Designed a 6 Layer dense/double sided Power Supply Board. Designed 2 very dense 8 Layer Ethernet Boards, consisting of matched length 50ohm, 75ohm, 90ohm and 100-ohm diff pairs mating to a very large/dense double sided 16-layer board. Designed 2 16-layer boards, consisting of multiple Micros, 50, 75, 80, 90, and 100ohm matched length diff pairs. Solid and split plane creation. Library part creation of footprints and logic symbols. All output files for fab house and assembly house. Attended many design review meetings. Designed 2 large Test boards using some of the above circuitry for proof of concept.

Various Companies: Contract work from 4/2023 to Current. All Sr. PCB Design Engineering Requirements using Altium V20 thru V23.

Senior Printed Circuit Board Design Engineer, 08/09/2019 to 07/2022.

Working contract at Curtiss-Wright

Using ALTIUM V19. Designed various circuits from simple to highly complex. Responsible for release and documentation of final product including schematic, production supplier approval, & assembly board drawings. Librarian, Logic Symbol & PCB Footprint creation, documentation, & verification for accuracy. Layouts, Schematics, BOM’s, & all MFG & Assembly files. Single Layer/Single Sided. 2 Layer Double Sided SMT & Thru Hole. Multi 4-10 Layer, High to Extremely High Density, SMT & Thru Hole/Digital/Analog/RF/SWITCHING POWER SUPPLIES Thermally Sensitive Circuits. USB2.

Senior Printed Circuit Board Design Engineer 03/2019 to 08/06/2019 for

NOKIA, Naperville Il

Designing large, 14- 18-layer pcbs. Large FPGA/digital/RF (Strip Line & Micro Strip)/Shielding circuitry. Responsible only for layout & design (part placement, routing, PWR/GND planes, via stitching/shielding.

Working remotely from home as a contractor. Worked for NuCurrent Tech,

OSSIA, Milwaukee Tools, & Optimum Design Associates.

Using ALTIUM 18.1.7 designer software.

Designed various circuits from simple to highly complex. Responsible for release and documentation of final product including schematic, production supplier approval, & assembly board drawings. Librarian, Logic Symbol & PCB Footprint creation, documentation, & verification for accuracy. Layouts, Schematics, BOM’s, & all MFG & Assembly files.

Single Layer/Single Sided. 2 Layer Double Sided SMT & Thru Hole. Multi 4-10 Layer, High to Extremely High Density, SMT & Thru Hole/Digital/Analog/RF/SWITCHING POWER SUPPLIES Thermally Sensitive Circuits. USB2.DDR2/DDR3 Routing. Fixed/Matched Length Routing.Fine Line Routing/Micro Vias/BGA Technology. Blind/Buried Vias. HDI/HS Designs. Critical/Sensitive/Diff Pair Routing. HS Switching Designs. Blue Tooth Circuitry. PCB Design peer to peer checking to insure accurate output. Actively taking, at home, Certified HS/HDI PCB Design video training courses. Offered by FEDEVEL Academy, Altium, & Cadence/Allegro.

Senior Printed Circuit Board Design Engineer,

10/06/2017 to 4/20/2018

STERLING ENGINEERING working for COLE PARMER SCIENTIFIC INSTRUMENTS – Barrington, IL

Using ALTIUM 16 designer software. Same requirements as Milwaukee Tools Company below.

A Senior Printed Circuit Board Design Engineer, 02/15/2017 to 10/02/2017

Jell-Tech Agency working for MILWAUKEE TOOLS COMPANY – Brook Field, WI

Using ALTIUM 17 designer software.

Designed various circuits from simple to highly complex. Responsible for release and documentation of final product including schematic, production supplier approval, & assembly board drawings. Librarian, Logic Symbol & PCB Footprint creation, documentation, & verification for accuracy. Reverse Engineered many older legacy Gerber files into Full ALTIUM projects. Layouts, Schematics, BOM’s, & all MFG & Assembly files.

*Single Layer/Single Sided. 2 Layer Double Sided SMT & Thru Hole. Multi 4-8 Layer, High to Extremely High Density, SMT & Thru Hole. Multi 4-8 Layer, High to Extremely High Density,

*SMT & Thru Hole. Digital/Analog/RF/SWITCHING POWER SUPPLIES /Thermally Sensitive Circuits.

*Fine Line Routing/Micro Vias/BGA Technology/HS Designs. Critical/Sensitive/Diff Pair

Senior Printed Circuit Board Design Engineer, 12/2007 to 01/2017

TRIPPLITE MFG – Chicago, IL. Using ALTIUM 17 designer software.

Designed various circuits from simple to highly complex. Responsible for release and documentation of final product including schematic, production supplier approval, & assembly board drawings. Librarian, Logic Symbol & PCB Footprint creation, documentation, & verification for accuracy. Layouts, Schematics, BOM’s, & all MFG & Assembly files.

Single Layer/Single Sided. 2 Layer Double Sided SMT & Thru Hole. Multi 4-10 Layer, High to Extremely High Density, SMT & Thru Hole/Digital/Analog/RF/SWITCHING POWER SUPPLIES Thermally Sensitive Circuits. DDR2/DDR3 Routing. Fixed/Matched Length Routing.

Fine Line Routing/Micro Vias/BGA Technology. Blind/Buried Vias. HDI/HS Designs. Critical/Sensitive/Diff Pair Routing. HS Switching Designs. Blue Tooth Circuitry. PCB Design peer to peer checking to insure accurate output.

For 7.5 years I was the PCB Design Team leader. Was responsible for attending all design meetings, from initial concept all the way thru the design layout/review process. Created pcb designs, schematic updates, and released all files to our oversea vendors for fabrication and assembly. Other responsibilities included footprint & logic symbol creation. Update & maintain master ALTIUM libraries.

Senior Printed Circuit Board Designer /Flex Circuit Board Designer, 05/1995 to 02/2007

MOTOROLA – Lawrenceville, GA.

Using MENTOR GRAPHICS PADS designer software.

Designed various RIGID & FLEX circuits from simple to highly complex. Responsible for release and documentation of final product including schematic, production supplier approval, & assembly board drawings. Librarian, Logic Symbol & PCB Footprint creation, documentation, & verification for accuracy. Layouts, Schematics, BOM’s, & all MFG & Assembly files.

Single Layer/Single Sided. 2 Layer Double Sided SMT & Thru Hole. Multi 4-10 Layer, High to Extremely High Density, SMT & Thru Hole/Digital/Analog/RF/SWITCHING POWER SUPPLIES Thermally Sensitive Circuits. DDR Routing. Fixed/Matched Length Routing.

Fine Line Routing/BGA Technology HDI/HS Designs. Critical/Sensitive/ HS Switching Designs.

NY CAD Corporation – Massapequa Park, NY

Owner & Lead Circuit Board Designer using PADS & CALAY software, 03/1987 to 02/1995

Responsibilities included phone calls, meetings with customers, RFQ's, and design and layout. Pick up & delivery of specs, drawings, and the final release package. Large & small Military Companies. Small to midsize industrial/telecom

Education: AAS: Electro-Mechanical Design & Drafting, 1979. Delhi Technical, Delhi NY

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