David Terramagra

Bedford, Massachusetts, United States

978-***-****

ad4nzo@r.postjobfree.com

WORK EXPERIENCE

August 2021-Current

Repair Technician

MTUnirepair

Wilmington, Massachusetts, United States

March 2021-July 2021

Assembly Technician

Performance Motion Devices

Westford, Massachusetts, United States

Responsible for assembly and soldering of production area. IPC Certified

• IPC Certification

February 2019-July 2019

E/M Assembler

Schleifring NA

United States

• Assembled slip rings used for military helicopters

• Soldered wires onto connectors

• Potted rings once wires connected

November 2018-February 2019

Rework Specialist

Neurometrix

United States

• Soldered SMT and THT

• Soldered pins and connectors

• Crimped wires

• Worked under a microscope

• Worked with oscilloscopes and multimeters

June 2017-November 2018

2nd Shift Group Lead

Nova Biomedical

United States

• Soldered components for electronics used in medical devices

• Reworked boards and cables used in medical

• Soldered under a microscope

• Ensured that assembly teams at the necessary parts needed to complete the job at hand. August 2016-June 2017

Electronics Assembler

Physical Sciences

United States

• Built mechanical assemblies for drones

• Soldered pins and connectors

• Crimped wires

• Soldered SMT and THT under a microscope

• Tested drones once assemblies were built

March 2014-March 2014

Inspector

D6 Industries

United States

• Worked with CMM to measure the dimensions of the materials.

• Inspected from blueprints and customers specs.

• Worked with hand tools to inspect.

December 2011-January 2012

Solderer/Inspector

MC Assembly

United States

• Performed SMT and thru-hole soldering.

• Reworked cables when necessary

• Conducted final/incoming/in-process SMT inspection.

• Soldered to Mil-Specs

• IPC 610 A Certification.

• Trained in ISO 9000.

• Worked with AOI machine to inspect components.

• Inspected under a microscope.

• Helped assemble new prototype boards along with testing and putting upgrades to them.

• Used oscilloscopes and multimeters for testing

2007-2009

Group Lead

SPS Tech

United States

• Group Leader position acquired after short period of time.

• Duties included Thru-Hole soldering-lead free-no clean solder.

• Conducted ECO changes, wiring, upgrading, troubleshooting and rework and repair.

• Duties included shipping and ordering parts and materials.

• Worked on prototypes for LED boards doing soldering, assembly, troubleshooting and packing.

• Inspected under a microscope.

• Worked with oscilloscopes and multmeter

2006-2007

Assembler

ECRM

United States

• Responsible for upgrading and ECO changes, also performed on thru-hole circuit boards.

• Duties included building sub-assemblies for printers and press machines. 2001-2006

Solderer/Assembler

Zoll Medical

United States

• Duties include rework, repair and potting of HV modules.

• Responsible for upgrading and ECO changes, also performed on circuit boards.

• Used a microscope to inspect.

• Worked on different subassemblies for the portable defibrillators. 1998-2001

Solderer/Assembler

Circuit Technology Center

United States

• Duties included upgrading and REV updating on printed circuit boards.

• Wiring and troubleshooting were also included.

• Group Leader position acquired after short period of time and also job planning performed.

• Inspected PCBs under a microscope.

1997-1998

Solderer/Assembler

CPI/ASTEX

United States

• Responsibilities included the soldering, assembly and testing of digital projection power supplies for Sony.

• Rework and ECO changes also performed on PC boards.

• Incoming and final inspection were also required.

• Inspected under a microscope.

1994-1996

Assembler

CPI/ASTEX

United States

• Assembled ozone cell generators conducted in clean room environment.

• Assisted in the development of assembly and test procedures for these assemblies.

• Tested and troubleshot product using oscilloscope and multimeter.

• Inspected under a microscope.

1991-1994

Solderer/Assembler

Data Technologies

United States

• Duties included the soldering and assembly of power cables for plotters and color jet printers.

• Worked in other assembly areas where man power was needed.

• Surface mount and point to point wiring was also performed.

• Used a microscope to inspect.

SKILLS

MULTIMETER MULTIMETERS OSCILLOSCOPE OSCILLOSCOPES BLUEPRINTS HAND TOOLS IPC SUB-ASSEMBLIES FINAL INSPECTION MICROSCOPE PCBS PRINTED CIRCUIT BOARDS SOLDER SOLDERING THROUGH HOLE SMT SOLDERING ASSEMBLY CABLE ASSEMBLY SUBASSEMBLIES WAVE SOLDER GENERATORS POWER SUPPLIES WIRING ECO CIRCUIT BOARD PRINTED CIRCUIT CIRCUIT BOARDS CIRCUIT TESTING COGNEX SMT BGA CLEAN ROOM NPI SURFACE MOUNT APQP NEW PRODUCT INTRODUCTION SURFACE MOUNT TECHNOLOGY MEDICAL DEVICES MRI PROTOTYPES PROTOTYPE CYCLE COUNTS ORDERING AOI AOI MACHINE TEST PROCEDURES ISO STANDARDS ISO 9000 BIOMEDICAL PACKING SHIPPING CMM SPS ISO MEDICAL INSTRUMENTS PRINTERS PRESS MACHINES

CERTIFICATIONS

Certified IPC 610A & JSTD (rcvd )

LANGUAGES

English - Intermediate

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