CH. Pavan

Mobile: +1-404-***-****

E-mail: ad4kmz@r.postjobfree.com

Having 8 Years professional PCB Design experience and testing in RF, High Speed Digital, Mixed signal, and power supply PCB designs. Domain knowledge on Telecom, Aerospace-Defense and Wireless with DFM, DFA concepts. And 3 years of experience in PCB Assembly process.

Summary:

Proficiency in CAD tools like Cadence Allegro17.4, Altium Designer 21.2, PADS 9.5, and Zuken CR5000 and Xpedition.

Expertise in RF, Analog, Digital, and Mixed-Signal Designs.

Skilled in Rigid-Flex PCBs, DDR interfaces, and high-speed routing.

Experience in constraint management, power distribution optimization, and DFM/DFA/DFT.

Proficiency in advanced HDI concepts, including blind and buried vias.

Extensive experience with various BGA designs (0.5 mm, 0.65 mm, 0.8 mm).

Expertise in high-speed interfaces (DDR3, DDR4, HDMI, PCIe, USB, etc.).

Designing PCB layouts optimized for high-frequency operations, including impedance control and EMI mitigation.

Familiarity with symbol and PCB land pattern standards from leading companies.

Experience in PCB reverse engineering, including schematic and layout extraction.

Effective project management skills, handling multiple projects concurrently.

Expertise in signal integrity (grouping, pin-pair settings, length matching).

Proficiency in Gerber file analysis and CAM350 for net-list comparison.

Creating detailed schematic diagrams adhering to industry standards.

Expertise in selecting and specifying high-quality, durable components and materials that meet or exceed industry standards for reliability.

Ensured components are sourced from reputable suppliers with a proven track record for reliability.

Knowledge of IEEE standards for schematic symbols.

A seasoned RF and high-speed digital layout professional with 10 years of experience in designing and optimizing complex PCB layouts for high-frequency applications.

Extensive experience with Ansys HFSS and Keysight ADS for simulation and analysis.

Skilled in designing multilayer PCBs, RF circuits, and high-speed digital interfaces.

Knowledgeable in signal integrity analysis and EMI/EMC compliance.

Familiar with thermal analysis and power integrity considerations.

Designed and optimized PCB layouts for RF and high-speed digital circuits, ensuring signal integrity and minimizing interference.

Implemented best practices for high-frequency routing, impedance matching, and controlled impedance traces.

Expertise in Mentor Graphics Xpedition (formerly known as Expedition PCB) for PCB layout and design, including component placement, routing, and layout optimization.

Designed RF amplifiers, filters, antennas, and matching networks for wireless communication systems.

Integrated RF components into PCB layouts, optimizing for performance and minimizing interference.

Designed high-speed digital interfaces, including DDR, PCIe, USB, and Ethernet, with a focus on minimizing signal jitter and skew.

Implemented differential pairs, termination techniques, and high-speed routing guidelines.

Conducted electromagnetic simulations using Ansys HFSS to validate PCB designs, ensuring RF performance and signal integrity.

Performed power integrity analysis to manage voltage noise and optimize power distribution networks.

Collaborated closely with cross-functional teams of hardware engineers, RF engineers, and PCB designers to deliver successful projects on time and within budget.

Participated in design reviews, providing expertise in layout design and signal integrity.

Resolved challenging layout issues, such as crosstalk, EMI, and thermal constraints, resulting in improved product performance and reliability.

Working with polarized components and understanding their orientation's impact.

Effective use of diverse components tailored to specific circuit requirements.

Troubleshooting and resolving compatibility issues with integrated components.

Accurate net-list extraction for PCB layout and simulation.

Creating PCB footprints meeting IPC-7351B standards and custom guidelines.

Thorough understanding of IPC standards (IPC-2221, IPC-2222, IPC-6012, etc.) and IEEE standards (IEEE 802.3, IEEE 802.11, etc.).

Implemented IPC design guidelines to ensure robust and manufacturable PCB layouts.

Designed boards following IPC-2221 for general PCB design, IPC-6012 for rigid PCBs, and IPC-2222 for high-reliability PCBs.

Conducted design rule checks (DRCs) to verify compliance with IPC standards at each design stage.

Conducted signal integrity analysis using tools like HyperLynx to minimize signal jitter and meet high-speed data transfer requirements.

Implemented controlled impedance traces to ensure signal integrity compliance.

Designing single, double, and multilayer PCBs with optimized layer stack-ups.

Expert placement of critical components for signal flow and thermal management.

Applying DFA, DFM, and DFT principles for production and testing enhancement.

Mitigating EMI and ensuring EMC compliance.

Maintaining signal integrity through trace routing, impedance matching, and reflection reduction.

Implementing impedance matching techniques based on layer stack-up.

Managing signal parallelism for high-speed circuits.

Grounding techniques, including shielded ground-reference planes for critical signals.

Balancing copper density in each layer to prevent warping and thermal issues.

Mentorship of junior electrical engineers and participation in peer reviews.

Collaborated closely with cross-functional teams, including hardware engineers, mechanical designers, and quality assurance personnel, to ensure comprehensive high reliability design.

Contribution to defining PCB design specifications and standards.

Documentation of schematic diagrams and collaboration with cross-functional teams.

Contribution to Design for Manufacturing (DFM) guidelines and resolving design issues with vendors.

Proficient in using AutoCAD and Solidworks for schematic design, 2D/3D modeling, and mechanical integration within PCB design projects.

Utilized AutoCAD to integrate electronic schematics seamlessly with mechanical CAD models, ensuring a harmonious design between PCBs and enclosures

Efficient time management, multitasking, and prioritization of work.

Proficient in creating Gerber files and manufacturing documentation for PCB fabrication.

Generated accurate NC drill files for precise hole placement during production.

Prepared comprehensive fabrication drawings, including stack-up details and materials specifications.

PCB Footprint and Symbol Planning:

●The life cycle of the component/Mfg part number.

The present 'availability' factor of the component.

Checking alternate components based on Mechanical parameters like physical form, mounting styles, size and weight of the component.

Understanding planar and 3D views.

Knowledge of engineering drawing.

Ability to use web search tools to find manufacturer websites and download datasheets.

Creating PCB footprints based on the datasheet specification.

Creating schematic symbol as per latest datasheet and can arrange the pin position for easy design.

Able to build 2D PCB library parts as perIPC-7351B Standard.

Checking the properties of components from the datasheets or website with the details provided by System Designers.

Updating and maintaining of CIS Database.

Identifying Obsolete, NRND parts and find out equivalents for the same.

Perform RoHS analyses for the BoM and generate an environmental compliance report / Identifying RoHS alternates for all Non-RoHS parts.

Co-Ordination with Vendors / Suppliers to collect the RoHS, REACH compliance statement review and validate.

Creation of new parts in PLM (Agile).

Creation of ECO’s, PNR’s, and MCO’s& ECO’s for new release.

ULTRA LIBRARIAN – tool

CIP -tool

ECAD TOOLS:

PCB Design Tools:

Cadence Allegro 16.6, 17.2 and 17.4.

Altium 19.4 to 21.3.

Xpedition PCB Layout.

DX designer.

PADS vx2.6

Kicad.

Schematic Tools:

cadence OrCAD Capture 16.6 and 17.2(CIS).

Altium 19.4 to 21.3.

Pads Logic.

Xpedition Dx Designer.

Gerber View Tools:

CAM350.

Design Complexity:

Designed high-speed interfaces such as DDR3, DDR4, SRAM, FLASH DEVICES, PCIE, SATA, Ethernet, and USB.

Have worked RF, Mixed signals and Flex-Rigid boards.

Have good knowledge in Footprint Creation, Schematic Drafting, Net list verification, Components Placement, Constraints settings, Power Plane Creation, Routing and Gerber Generation.

Have exposure to build stackups (up to 24 layers)

Have knowledge of DFA and DFM.

WORK EXPERIENCE:

Analog Devices – Austin, TX November 2022 - PRESENT

Senior PCB Designer

Responsibilities:

●Utilize advanced PCB design tools (e.g., Cadence Allegro, OrCAD, Altium, Xpedition, PADS and DX designer) to create complex and high-performance PCB layouts.

●Design multi-layer PCBs, considering impedance-controlled traces, differential pairs, and high-speed signal routing.

●Implement industry best practices for signal integrity, EMI/EMC compliance, and thermal management.

●Conduct design reviews to ensure compliance with design specifications, industry standards, and client requirements.

●Perform thorough design validation, including DFM (Design for Manufacturability) and DFT (Design for Testability) analyses.

●Prepare detailed design documentation, including schematics, assembly drawings, fabrication drawings, and bill of materials (BOM).

●Generate and maintain accurate CAD files, libraries, and design databases.

●Collaborate with cross-functional teams, including electrical engineers, mechanical engineers, and firmware developers.

●Communicate design requirements, constraints, and progress to project stakeholders.

●Coordinate with PCB manufacturers and assemblers to ensure seamless fabrication and assembly.

●Provide technical guidance and mentorship to junior PCB designers, sharing knowledge and expertise.

●Monitor project expenses and budgets, striving to optimize costs without compromising quality.

●Evaluate and select PCB fabrication and assembly vendors based on project requirements and quality standards.

Project: Mini Mother Board design

Board Size: 167 x 107 mm.

No. of layers: 12.

No. of components: 826.

Minimum Trace width and Spacing: 4 / 4 mils.

Via sizes: Default signals 18C08 & 24C12 for power.

Impedances in the design : 50Ω, 90Ω,100Ω and 120.

Interfaces: DDR4, USB, PCI and Ethernet.

Critical packages used: processer IC module.

Texas Instruments - Dallas, Texas, USA June 2021 – September 2022

Senior PCB Designer contract / Hardware designer

Responsibilities:

●Design and develop complex PCB layouts and designs using advanced PCB design tools (e.g., cadence,Altium, OrCAD) to meet project requirements.

●Apply in-depth knowledge of PCB design principles, including high-speed signal routing, impedance control, and thermal management, to create high-quality designs.

●Conduct design reviews and simulations to ensure designs meet electrical and mechanical requirements.

●Perform signal integrity analysis and ensure compliance with industry standards and best practices.

●Collaborate with electrical engineers and other teams to select appropriate electronic components and ensure component availability.

●Prepare detailed design documentation, including schematics, assembly drawings, and fabrication files, to support manufacturing and assembly processes.

●Work closely with cross-functional teams, including hardware engineers, mechanical designers, and firmware developers, to ensure design integration and compatibility.

●Communicate with PCB manufacturers and assemblers to address manufacturing issues, resolve queries, and ensure successful fabrication and assembly.

●Identify and mitigate project risks related to PCB design and development.

●Manage project timelines, budgets, and resources effectively to ensure on-time delivery of PCB designs.

●Generate project status reports, design documentation, and comprehensive design reports as required.

●Consider environmental impact and sustainability factors in PCB design, in line with Texas Instruments' values.

Project: HV-LV Power Logic board for Eclectic car

Board Size: 425 x 370 mm.

No. of components: 1135.

Used through hole technology for vias.

Power supply routing and planes creations as per power supply guidelines.

GND shielding for selected signals.

Integrated with 3 child cards and mechanical verification.

Vanan Advanced Sciences & Technology PVT. LTD September 2018 – November 2020

Hardware designer/ PCB designer

Responsibilities:

●Collaborate with cross-functional teams to define product requirements, specifications, and constraints for PCB designs.

●Utilize specialized software tools (e.g., Altium, OrCAD, cadence Allegro) to create and validate schematic diagrams, ensuring accuracy and adherence to design standards.

●Develop multi-layer PCB layouts, considering factors like component placement, signal routing, power distribution, and thermal management.

●Analyze and optimize signal integrity, addressing issues like impedance matching, noise reduction, and minimize electromagnetic interference (EMI) and electromagnetic compatibility (EMC) problems.

●Work with procurement teams to select electronic components, considering factors such as cost, availability, and compatibility with the design.

●Conduct thorough design reviews and simulations to ensure that PCB layouts meet electrical and mechanical requirements and comply with industry standards.

●Collaborate in the development of PCB prototypes, overseeing the assembly, testing, and troubleshooting processes.

●Consider manufacturability and assembly factors during design to facilitate efficient and cost-effective production.

●Prepare comprehensive documentation, including schematics, assembly drawings, fabrication files, and Bill of Materials (BOM) to support manufacturing and assembly processes.

●Work closely with electrical engineers, mechanical designers, firmware developers, and other stakeholders to ensure seamless integration of the PCB into the overall product.

●Manage project timelines, budgets, and resources effectively to ensure on-time delivery of PCB designs.

Project: High-speed signal type design(24 GHz)- Intel client

Schematic Capture, Footprint creation, Importing Net list, Placement, Routing and Gerber generation.

Tool used: Allegro17.4.

Board Size:120 x 80mm.

No. of layers:8.

No. of components:26.

Trace width and Spacing: 4.4 / 4.35 mils.

Via sizes: 20P10D and 30P16D, 20P40D for power.

Impedances in the design: 50, 85 & 100 Ohms.

High-Speed Interfaces: XMC connector, Ethernet connector.

Sienna Ecad Technologies – Bangalore, India September 2015 – August 2018

Junior PCB Design Engineer

Responsibilities:

●Proficiently create schematic diagrams representing electrical connections and components for PCBs. This includes the careful selection of components, their logical placement on the schematic, and ensuring seamless connectivity.

●Skillfully design the physical layout of PCBs, encompassing component positioning, trace routing, and layer stackup definition. Ensured designs align with both electrical and mechanical requirements while adhering to industry standards.

●Collaborate effectively with engineering teams to choose electronic components that align with project specifications. Consider factors such as cost, availability, and performance.

●Conduct thorough design reviews and simulations to guarantee PCB layouts meet stringent electrical and mechanical requirements. This includes optimizing signal integrity, managing impedance, and controlling thermal aspects.

●Skillfully prepare comprehensive documentation packages, including detailed schematics, assembly drawings, fabrication files, Bill of Materials (BOM), and comprehensive design reports.

●Assure strict compliance of PCB designs with industry standards and certifications, including FCC and UL requirements.

●Stay updated on industry trends, emerging technologies, and the latest advancements in PCB design tools and methodologies.

●Maintain the utmost security and confidentiality of sensitive design information and intellectual property.

Project: WGM & TSG module for Rite

Footprint creation, Importing Net list, Placement, Routing and Gerber generation.

Tool used: Altium 20.2

Board Size:320 x 250 mm

No. of layers: 16

No. of components: 1156

Trace width and Spacing: 3.3 / 4 mils

Via sizes: 18P8D, 20P10D for Default signals, 24P12D and 30P16D for power.

Impedances in the design: RF coplanar-50 & 100 ohm. Default signal 40, 50, 80 &100 ohm.

Critical packages used Processor BGA (900pin 1.0mm pitch), DDR3 (96pin 0.8mm Pitch BGA) and ADC chip (240pin 0.8mm pitch).

High-Speed Interfaces: ADC7936 chip Processor, DDR3, Ethernet controller, Flash and connector.

Education:

Bachelor’s in electronics and communication in PSG college of technology, Chennai

Cadence

Cadence

Cadence

Cadence

Contact this candidate