James Schey

Cleveland/Chagrin Falls, OH

Results Driven PCB Design Engineer

Certified Interconnect Designer (CID+).

CAREER OBJECTIVE

Apply my breadth and depth of skills and experience in electronics. PCB design, engineering, testing, and manufacturability; in a manufacturing and/or contract manufacturing company.

PROFILE

•30+ yrs. PCB Design Experience.

•Effective Systems thinker who proactively works across all levels of organization.

•Skilled at identifying and providing solutions to key issues: PCB complexity. footprint constraint tradeoffs with product functionality.

•Key contributor with proven track record of driving time to market reduction, increasing new product yield and reliability via deployment of PCB related software platforms.

•Capable of executing complete PCB design layout per Engineering design constraints, all standards, and company guidelines.

•Set up PCB libraries to meet constraints for design layout. Symbol design to aid in schematic layout and multi-footprint configurations to aid the designer for top or bottom solder processing.

•Continuous learner focused on developing and bringing to bear new approaches to solving problems/accomplishing tasks.

DISTINCTION

Patent-Rockwell Automation: Toggle key option on PCB to select high-speed option for a processor.

EXPERTISE/ SOFTWARE/TOOLS

Expertise in PCB Design: Multi-Layer Analog, Digital and Mixed Technology Circuitry and Complex High-speed Processor Design.

•Altium PCB Pro Designer

•Concord Pro

•Altium Power Analyzer Software

•JTAG Mops for Altium

•Mentor DxDesigner (Xpedition)

•Siemens Xpedition EDM

•PADS Logic & PADS Layout

•OrCAD

•Blueprint by Downstream

•PCB Design Library Management

•AutoCAD 2019

•GerbTool

•CAM350

•CADint Software

•Aegis Factory Logix Manufacturing Software

•Cadence Allegro, Revision 17.4, Flow Mgr.

•Theda PCB Design Tools

•Avanti ERP

•MS Office Word and Excel

WORK EXPERIENCE

CHAGRIN DESIGN

SENIOR PCB DESIGN ENGINEER. 8/2023 - Present Chagrin Falls, Ohio

Free lance contracting for short- and long-term contracts for PCB Design, documentation, Fabrication and Assembly drawings, Gerber files, Drill files Pick-n-Place files and ODB++ files. These contracts required Altium PCB Pro Designer, Mentor DxDesigner (Xpedition), and Cadence Allegro (17.4). This required board layout and library part creation.

COLLINS AEROSPACE

Specialized in making space missions feasible and more affordable for science, exploration, and commerce.

SENIOR PCB DESIGN ENGINEER. 7/2023 - 2/2024, Connecticut.

•Senior PCB Member of the group Aerospace Packaging Group.

•Utilized Candence Allegro 17.4 for Cad tools.

•Set up IPC-356 and ODB++, DFT engineering test guidelines format for file generation and transfer of PCB designs to test Department. Executed complete design layout per Engineer's design constraints and company guidelines, incorporating IPC, standards along with IPC-2221.

•Build all schematic and footprints related to the board design. Create a local library that travels with the board until built and tested to prove out parts. After board is verified local library parts can be transferred into the main library.

•The boards in the project house 1345 parts, 890 nets, 3277 connections, 18 Layers. Analog sensitive circuits and digital high speed circuit layout. A 484 pin BGA, with multiple connectors, utilization of circuit modules to help in placement. Setting up the constraint manager with the layer stack to manage all the trace width, spacing and impedance requirements.

•Library part generation with 3-D modeling

ASTROBOTICS TECHOLOGY, INC.

Specialized in making space missions feasible and more affordable for science, exploration and commerce. They provide end-to-end delivery services for payloads to the Moon.

SENIOR PCB DESIGN ENGINEER. 11/2022 - 7/2023 Pittsburgh, Pennsylvania

•Senior PCB Member of the Lunar Landing Team, which was used for the mission to Mars in 2025. Responsible for Design reviews with the design team and producing all documents to support PCB Fabrication and Assembly Dwg.

•Collaborated to create detailed electrical schematics, mechanical and assembly drawings, using Altium layout tools.

•Set up IPC-356 and ODB++, DFT engineering test guidelines format for file generation and transfer of PCB designs to test Department. Executed complete design layout per Engineer's design constraints and company guidelines, incorporating IPC, standards.

•Build all schematic and footprints related to the board design. Create a local library that travels with the board until built and tested to prove out parts. After board is verified local library parts can be transferred into the main library.

•All documentation was done using draftsman, in Altium designer.

•Library part generation with 3-D modeling

NORDSON CORPORATION

Nordson is the leader in precision dispensing, fluid management, and related technologies. Nordson manufactures products used for dispensing adhesives, coating, sealants and biomaterials.

SENIOR PCB DESIGN ENGINEER, 5/2022 - 7/2023 Amherst, Ohio

•Senior PCB Member of the new Powder coating system Team, which replaced the original system which has been in operation for 10 years. Responsible for Design reviews with the design team and incorporating a new CAD System to aid in designing printed circuit boards. This new system will speed up producing all documents to support PCB Fabrication and Assembly.

•Set up a company library to serve all engineering personnel and PCB designers. Create this library to make it easy to find the parts easily and place them on the schematic and transfer that to creating the PCB.

•Executed complete design layout per Engineer's design constraints and company guidelines, incorporating IPC, CSA, NEMA Industry and UL standards. Use output files to generate, ODB++, Fabrication Drawing and Schematics. Oversee the release of these files to the new cloud based electronic vault.

•Preformed checking on co-workers designs to provide feedback and error free designs.

•Worked on ECO’s for current products to move work to completed state and the new release process on the cloud to facilitate file access to everyone.

ADVANCED ENERGY

Manufacture of the most complex AC – DC power supplies in healthcare, communications, computing, consumer electronics, servers, and industrial automation for their exceptional reliability, cost-effectiveness, and versatility.

SENIOR PCB DESIGN ENGINEER, 4/2022 - 4/2023 Fort Collins, Colorado

•Senior PCB Member of the High Voltage Power Supply Team, which was used for a number of defense systems and aviation systems. Responsible for Design reviews with the design team and producing all documents to support PCB Fabrication and Assembly

•Executed complete design layout per Engineer's design constraints and company guidelines, incorporating IPC, CSA, NEMA Industry and UL standards. Use output files to generate, ODB++, Fabrication Drawing and Schematics. Oversee the release of these files to the electronic vault.

•Preformed checking on co-workers designs to provide feedback.

•Worked on ECO’s for current products to move work to completed state to enable ECO sign off.

PROGENY SYSTEMS

Progeny produces systems to significantly Increase situational awareness and improve the efficiency of military operations.

SENIOR PCB DESIGN ENGINEER, 11/2021 - 5/2022 Charleroi, Pennsylvania

•Senior PCB Member of the SONAR Team, which is used for several defense systems. Responsible for Design reviews with the design team and producing all documents to support PCB Fabrication and Assembly

•Collaborated to create detailed electrical schematics, mechanical and assembly drawings, using Cadence layout tools revision 17.4.

•Set up IPC-356 and ODB++, OFT engineering test guidelines format for file generation and transfer of PCB designs to test Department. Executed design layout per Engineer's design constraints and company guidelines, incorporating IPC, CSA, NEMA Industry and UL standards.

•Lead PCB Designer for the MARI< 8 Torpedo Program.

•Library part generation with 3-D modeling for all parts related to the PCB project, in a local library until verified.

AEROJET ROCKETDYNE

The prime contractor for the light proven, high-performance RS-25 engine used to propel America's next-generation heavy lift launch vehicle, Artemis.

SENIOR PCB DESIGN ENGINEER. 12/2021 - 5/2022 Canoga Park. California

•Senior PCB Member of the RS-25 Test Engine Stand. Responsible for documenting design process, Design reviews with the design team and producing all documents to support PCB Fabrication and Assembly

•Assisted Mechanical Design Engineers with PCB outline definitions and critical part orientation/placement.

•Attended project meetings to discuss project progress and issues.

•Validate feasibility for high-speed digital printed circuit boards, using Design Automation Tools.

•Lead PCB Designer for the RS-25 Engine Program.

L3 HARRIS TECHNOLOGIES

An American technology company, defense contractor and information technology services provider that produces wireless equipment. Tactical radios, avionics and electronic systems. night vision equipment for use in the government, defense, and commercial sectors.

SENIOR PCB DESIGN ENGINEER, 3/2021 - 12/2021 Cincinnati, Ohio

•Member of Customer Program Representing PCB Design: Responsible for documenting design process, Design reviews with the design team and producing all documents to support PCB Fabrication and Assembly

•Review all company guidelines and procedures to ensure it represents the company's process of workflow.

•Review all IPC documents that are updated to assure they match the company guidelines that support the IPC specifications.

•Validate feasibility for Rigid Flex and Flex printed circuit boards using Mentor Graphics DxDesigner (Xpedition) Tools.

•I created all new library parts in DxDesigner (Xpedition) to support the changes, required in the new design. Multi-footprint to help designers adjust the part for top or bottom solder requirements.

•Lead PCB Designer for the Patriot Missile Re-Design Program.

•Rigid Flex Board designs were 6 - B layers and had complex mechanical packaging requirements to fit into the noise cone of the missile.

•The rigid board layouts had to be folded up on each other to form a stack and component height became a critical issue between board to board.

•3-D modeling of the folded board assembly became a critical tool to assure that components fit between each other to meet the height restrictions of the entire stack.

•High Power 8ectronics design experience with l 50A at 1500V.

•Board layout tools used were Mentor Graphics DxDesigner (Xpedition), for legacy programs. All library support was done using DxDesigner (Xpedition) tools.

•Started a program to maintain legacy Mentor databases for future longevity.

•All PC Board documentation was generated in an application called Blueprint.

•The Fabrication drawing. BOM, and Assembly drawing were all driven by the PCB Data Base which allowed all updates to be performed automatically.

•Tin Migration analysis was performed on all new designs.

BIRD TECHNOLOGIES GROUP

A privately held. $70+MM global supplier of Radio Frequency products, systems, services, and educational solutions for the Public Sector. Cellular Communications. Distributed Antenna Systems (DAS), Broadcast, Semiconductor, Military. Government, and medical markets.

PCB Design Engineer, 2001 - 2020 Solon, Ohio

•Key Member of new product design teams: prepared PCB related project schedules, budget, and risks.

•Executed complete design layout per Engineer's design constraints and company guidelines incorporating IPC, CSA, NEMA Industry and UL standards.

•Recommended new design concepts and validated feasibility for digital multiplexed printed circuit boards. using Design for Testability (DFT) and Design for Manufacturing (DFM) circuit board simulations Mixed signal technology/analog and digital.

•High speed digital design with matched length pairs, BGA. High speed memory. power ground planes. Multilayer 4 -16 layers.

•Analog design layout knowledge

•RF circuit design layout practices

•HDI and DDR memory routing

•Wi-Fi circuit layout experience

•Bluetooth circuit layout experience

•Ethernet IC layout configuration

•Experience with FR-4, Roger's dielectric for specific impedance.

•High Power electronics design experience with 1OOA at 75V.

•Assisted Mechanical Design Engineers with PCB outline definitions and critical part orientation/placement.

•Attended project meetings to discuss project progress and issues.

•Project Team Support Member to system critical software upgrades:

Provided leadership in selection/ and implementation of Altium Design/Concord Pro and Aegis Factory Logix manufacturing software.

Created and implemented Quick prototype system for engineering to prevent overload impact to production manufacturing schedules.

Quickly learned and trained others in software integration.

Complied with design rules which: mitigate crosstalk problems, antenna effects and connection failures in multi-layer circuit boards.

•Excellent Team Player across functions:

Collaborated to create detailed electrical schematics, mechanical and assembly drawings.

Set up IPC-356 and ODB++, DFT engineering test guidelines format for file generation and transfer of PCB designs to test Department to perform required testing and analysis. Automation streamlined NPI testing turn-time.

Worked with in-house SMT technicians: to standardize tooling methods and implement process improvements- resulting in increased throughput, decreased scrap, improved manufactured yield.

ROCKWELL AUTOMATION/ ALLEN BRADLEY

The largest company in the world dedicated to industrial automation and enterprise-wide business information integration.

Senior PCB Design Engineer, 1980 - 2000 Highland Heights, Ohio

•Successfully researched, benchmarked, and evaluated PCB layout tools.

•Supported implementation and full integration of performance-driven wire routing for component and integrated circuit placement, Theda Design Tool Software.

•Managed CAD and PCB Library maintenance.

EDUCATION/CERTIFICATIONS

Associate degree in Electronic Technology (Cuyahoga Community College).

High Speed Digital Circuit Technology Training (Cleveland, Ohio).

IPC Certification and Advanced Certified Interconnect Designer (CID+).

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