Systems Engineering Six Sigma

Jones Assiedu

*** ** ******* ******, ******* City NY 13790, 607-***-****, ********@**********.***

EDUCATION

Binghamton University, State University of New York

Thomas J. Watson College of Engineering and Applied Science

Doctor of Philosophy in Industrial and systems engineering, Expected May 2024 (GPA 3.40)

Lean Six Sigma Black Belt, Brown Belt, and Green Belt

Ohio University

Ohio University (Russ) Engineering School

Master’s in engineering management: May 2015

University of Maryland University College

Master’s in healthcare administration and Graduate Certificate in Healthcare informatics

Morgan State University

BSc in Industrial and systems engineering: May 2013

Cape Coast Technical University

HND in Mechanical Engineering (Plant Maintenance) August 2003

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RESEARCH INTERESTS

• Interactions Between Electromigration and Fatigue of Regular and Low-Temperature Solder Joints

Optimizing Reliability of Solder Joints Reflowed at Temperatures Below 140C.

Low Solder Hybrid joint, Understanding and Preventing Defects in Cu-solder Micro joints through Design and Process Control

Evaluation of User Friendliness of Automatic Pepper Grinding Mill Using Usability Testing System

Using lean Six Sigma methodologies to reduce patient waiting times.

Investigation on how Mobile Phones can be used to increase crops (foods) and livestock production, and the Reduction of Postharvest Losses in Ghana agriculture centers.

• Electronic packaging and Reliability (SRC and IEEC Projects).

Optimizing Reliability of Solder Joints Reflowed at Temperatures Below 140C.

Interactions Between Electromigration and Fatigue of Regular and Low-Temperature Solder Joints

Alternative Fine Pitch Solder Joint Interconnect Technology for System-in-Packages (SiPs).

Reliable Low-Temperature Solder Approach (where Joints formed with SnAgCu bumps soldered with eutectic SnBi with a peak reflow temperature of 150-175 C)

Dissertation Thesis: A Study of Reliability Issues in the Interactions Between Electromigration and Fatigue of Regular and Low-Temperature Solder Joints.

PROFESSIONAL SYNOPSIS

Research Assistant, Dr. Peter Borgesen Research,

Department of Industrial and Systems Engineering, Binghamton University, May 2019- Present,

Reliable Low-Temperature Solder Approach (where micro joints are formed with SnAgCu bumps soldered with eutectic SnBi with a peak reflow temperature of 150-175 C

Development of the SAC305+SnBi sample allows for soldering with a peak temperature of about 150C, leading to a mixed region between the Sn3Ag0.5Cu layer and the substrate pad. The annealing will also lead to the growth of the small Sn grains to form a polycrystalline joint with less than 4% Bi distributed uniformly across the joint.

Tutor Morgan State University

Department of Industrial and System Engineering May 2010 – May 2013

• Pre-calculus

• Calculus

• Quality Control, and statistics

Engineering economy

Research Assistant, Semiconductor Research Corporation (SRC) Project,

under Dr. Peter Borgesen Research Group, Department of Industrial and Systems Engineering

Binghamton University, May 2019 - Present

Optimizing Reliability of Solder Joints Reflowed at Temperatures Below 140C.

Interactions Between Electromigration and Fatigue of Regular and Low-Temperature Solder Joints

Alternative Fine Pitch Solder Joint Interconnect Technology for System-in-Packages (SiPs).

Reliable Low-Temperature Solder Approach (where Joints formed with SnAgCu bumps soldered with eutectic SnBi with a peak reflow temperature of 150-175 C)

ADDITIONAL WORK EXPERIENCE

Quality Control associate: Amazon from 2016-2018

• Monitoring defective packaging from the conveyor

• Record data based on daily work using Excel etc.

Quality Control associate: Axum Plastic Company from 2018- 2019

Assisting in the quality inspection process for various plastic products, measuring standards, and ensuring conformance of units before shipping.

Develop, implement, and maintain the quality plan and metrics to support, direct, monitor, and address quality processes, and quality procedures.

Lowes Inc: from 2019- 2022

I work at Lowes Companies Inc. in the MST department as a quality control associate applying 5S methodologies, and Corrective Action Preventive Action (CAPA) recommended by the ISO methodology. However, at Lowes, the application of Lean Six Sigma processes such as DMAIC, Lean, and DMADV to mention but few across various areas of the Lowes Inc. organization is paramount, and the implementation of quality control improvement actions and measurement and the results is what the Lean Six Sigma do to bring the quality improvements focus on improved service delivery to the company customers and the improvement of organizational productivity and the operating efficiency of the company

Secretary Abrem Agona Methodist Church Men’s fellowship

• Keeping the fellowship records and books

• Taking down minutes of the meeting

• Providing important communication to all members

Mathematics and Chemistry Teacher,

Eguafo Abrem Senior High School from 2003 to 2005

• Teaching chemistry and Elective Mathematics

• Assistant Curriculum Master

Science and Mathematics Teacher,

Abrem Ankase Junior Secondary School

Teaching Mathematics and Science

LIST OF PUBLICATIONS

PUBLISHED

Effective Constitutive Relations for Sintered Nano Copper Joints S Thekkut, RS Sivasubramony, A Raj, Y Kawana, J Assiedu, K Mirpuri, ..Journal of Electronic Packaging 145 (2), 021010

UNDER REVIEW / SUBMITTED

COMPARING/OPTIMIZING ACTUAL SOLDER FATIGUE LIFE Ronit Das, Atif Mahmood, Shantanu Joshi, Jones Assiedu, and Peter Borgesen

CONFERENCES ATTENDED

• SRC Annual Review- 2022

• Techcon Annual Conference 2023

AWARDS AND OTHER ACHIEVEMENTS

• Methodist Church Transformational Leadership course certification

• Lean Sigma Black Belt and Green Belt certification

TECHNICAL SKILLS

Laboratory Equipment:

• Scanning Electron Microscope (SEM)

• Failure analysis of solder joints

• Micro-Joints analysis

• Cross-section polisher

• Instron micro tester

• Arc Melting of Soldering Material

• Optical Microscope

• Multiprep polisher.

• Annealing oven

• DSC

• DTA

• TGA

Computer:

• Mat lab

• Microsoft Office (Excel, Word, PowerPoint, Internet Microsoft Project, Microsoft Visio)

• Report Writing, Editing, Excellent interpersonal and communication skills.

• Origin software

• ImageJ analysis software

• SPSS, SAS, Minitab, Arena, Vensim, Microsoft SharePoint, Creo 7.0 and Visual Basic programming.

Languages:

• English, Fante, and Twi (native).

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