Carrie Lee Snyder

Boise, ID 208-***-**** carrie.claflin.ad26j5@r.postjobfree.com ~/in/carrie-snyder-claflin/

Embedded System/Product Regulatory/EMC Engineer

Embedded design and compliance electrical Engineer responsible for a diverse cross section of disciplines including ASIC design, PCB board design, design for manufacturability and electromagnetic compliance design. Led multiple system level tests including firmware duration testing, USB electrical and protocol testing and Wi-Fi testing. Proficient in several scripting and programming languages including C/C++, VB, Awk, SED, Java and working on Python in both a Linux and Windows environment. Led both technical and regulatory/certification requirements of multiple electromagnetic regulated tests including Radiated Emissions and Conducted Emissions, Electrical Fast Transients, Conducted Immunity, Radiated Immunity.

Areas of Expertise

Embedded Systems EMC/EMI Standards, Testing, Accreditation & Certification EMC SME

HP Inc., Boise, ID August 1987-October 2023

Product Regulatory Engineer, May 2018-October 2023

Regulatory Engineer for multiple new and sustaining LaserJet small and enterprise product lines.

*Responsible for initial and sustained worldwide electromagnetic, safety, ROHS, wireless and telecom regulatory compliance supporting $10M in product sales.

*Worked with over 24 different internal program team members including R&D, marketing, and manufacturing, to introduce a full complement of new products to the market providing schedule and status reports as appropriate.

*Worked globally with individual technical regulatory country representative to ascertain country specific compliance requirements. Countries included China, Korea, Vietnam, EU, EAC, UAE, Brazil, Chile, Indonesia and Malaysia.

*Worked with external certification suppliers including TUV, UL, and A2LA accredited EMC test labs to perform regulatory testing and ascertain appropriate test reports and certifications.

*Sustained product responsibilities included working with country representatives, technical advisory groups, and regulatory compliance suppliers to interpret and maintain country certifications through time as compliance and regulatory requirements changed.

*Participated as subject matter expert in the following technologies wireless, EMC, and US CISPR Technical Advisory Group (TAG) representative/member.

Expert Electromagnetic (EMC/EMI) Engineer, May 2007-May 2018 Member of internal A2LA accredited EMC test lab.

*In charge of both technical and regulatory/testing and certification requirements of multiple regulated tests including Radiated Emissions (RE-CISPR32/22-FCC Part 15), Conducted Emissions (CE CISPR32/22-FCC Part 15), Electrical Fast Transients (EFT-CISPR35/24-IEC 61000-4-4), Conducted Immunity (CI- CISPR35/24-IEC 61000-4-6), Radiated Immunity (RI- CISPR35/24-IEC 61000-4-3), USB certification testing (USB-IF certification, and Wi-Fi Alliance Sigma testing.

*Wrote more than 100 EMC/EMI test plans for new products and sustaining products to support both initial regulatory certifications and continued EMC compliance.

*Represented EMC performance back into the program teams to drive timely identification of issues and countermeasures.

*Deputy quality manager, deputy technical manager and lead technical representative for ongoing A2LA ISO/IEC 17025 A2LA certification.

*Accomplishments include being the first within HP to evaluate and test at frequencies greater than 1GHz for CISPR 22 2007+A1 in accordance with CISPR 16-1-4.

*This included leading the redesign of the 10-meter chamber to be the first internal HP lab to certify products in radiated emissions testing up to 40 GHz.

*Audited 4 internal HP EMC/EMI labs and more than 6 external EMC/EMI labs to the technical and management requirements of IEC 17025 as part of HP’s internal EMC/EMI compliance program.

Infrastructure Champion, October 2001-May 2007, HP Inc, Boise, ID - Continued Worked across the R&D organization to develop/enable and facilitate more cost effective and efficient test methodologies and procedures.

*Set up the infrastructure and process to continuously execute firmware duration testing.

*Led an initiative to reduce cost by leveraging expensive paper testing between *hardware and firmware testing.

Automated MFP testing in life test and real time gathering of information using functionality and variables readily available in the firmware.

Firmware R&D Project and Release Manager, July 2000-October 2001

Led the firmware team responsible for system firmware integration while working within the organization to define a new firmware release model to deliver multiple products leveraging work from a multiple firmware organization.

Assumed top level responsibility of the MFP Release “Firmware release manager”. *Functioned as the primary interface and coordinator across multiple labs to deliver all firmware components in the MFP products.

*Worked with other release managers to run the firmware PMT, work through issues, set priorities and resolve conflicts. Functioned as primary interface and coordinator across multiple R&D organizations.

*Team responsibilities included solution definition, overall testing responsibility, integration, hardware bring up and issue resolution with firmware customers/partners such as life test.

*Member of the HP LaserJet 9000 MFP, HP LaserJet, HP LaserJet 4100 MFP and HP LaserJet 4600 cross-functional Program Management Teams responsible for delivering the entire product including marketing and financial considerations.

*Performed personnel performance evaluations and ranking.

Additional Relevant Experience Hewlett-Packard Co., Boise, ID

R&D Hardware Project Manager

*Managed teams of up to 14 Electrical Engineers to deliver the formatters and ASICs for the mid-and high-end LaserJet printers. Team responsibilities included design, development and EMC performance.

*Led cross-functional teams (manufacturing, procurement, and R&D) to deliver high quality formatters with no manufacturing, regulatory or AFR issues.

*Managed vendors including Canon, NEC, QED and Agilent.

R&D Electrical Engineer, LaserJet Division

Member of combined firmware/hardware team investigating future printer/formatter architectures, trends and opportunities.

Experience designing ASICs, FPGAs and PCBs.

R&D Electrical Engineer, Disc Memory Division

*Designed and developed both standard cell and semi-custom disc controller Integrated Circuits.

Education

University of Idaho, Moscow, ID

Master of Science and Bachelor of Science Degree - Electrical Engineering Master’s Thesis: An Optimal Implementation of Berlekamp’s Algorithm in a Pipelined Reed Solomon Decoder.

Boise State University, Boise, ID

Master of Business Administration

Patents and Technical Papers

PATENT: An Optimized Hardware Compression and Decompression Architecture for use by an Image Processor in a Laser Printer. Patent No. 5,729,668.

TRADE SECRETS: Method Of Peppy Protocol Incomplete Packet Detection/Decompression. PD No. 10950597.

PAPERS:

*EMI Implications of ASIC Internal Switching Noise. - Presented at 1992 Design Technology Conference.

*Interactive SIMMASTER/AWSIM Behavioral Simulation. - Presented at 1989 Design Technology Conference.

*HP Boise Site NSA using Hybrid Antennas. - Presented at 2013 IEEE International Symposium on Electromagnetic Compatibility.

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