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Software Engineering Electrical

Location:
Fremont, CA
Posted:
November 18, 2023

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Resume:

JAMES WONG

**+ YEARS EXPERIENCED ENGINEER/LEADER, PHD (ABD) CS

SCALE PRODUCTS 0->1, 1->100

ad083w@r.postjobfree.com

1-510-***-****

Fremont, CA, US

https://www.linkedin.com/in/jameshsw

https://metricer.com

SUMMARY US Citizen

Over 20 years of experience developing and

scaling cloud-native, AI and blockchain

applications. Expertise in managing multi-

disciplinary teams and engineering complex

systems supporting millions of global users.

EDUCATION

University of Michigan, Ann Arbor

PhD (ABS), Electrical Eng/Computer Science

University of Michigan, Ann Arbor

MS, Electrical Eng/Computer Science

National University of Singapore

MS, Electrical Engineering

National University of Malaysia

BS, Electrical Engineering

Stanford University

Specialization, Machine Learning

SKILLS

Programming: Python, Java, JavaScript,

TypeScript, C/C++, Ruby, C#, Solidity

Application: SaaS, Web App, Mobile, API,

B2B, B2C, SDK, ERP, CRM, SCM, WMS,

EDA, Marketplace, Ads

Framework: Node.js, Django, Flask, Spring,

Spring Boot, Unreal, Unity

Frontend: React, HTML, CSS, Mobile

Database: SQL, NoSQL, PostgreSQL,

MySQL, MongoDB, Oracle, Cassandra,

Redis, GraphQL, Redshift, GraphQL, Vector

DB

AI: Machine Learning, Generative AI, LLMs,

TensorFlow, PyTorch, ETL, NLP, Langchain,

Embeddings

Cloud, DevOps, MLOps: Kubernetes,

Docker, Jenkins, Terraform, Kafka, AWS,

Azure, GCP, CI/CD, Ansible

Data: ETL, Hadoop, Spark, Tableau

Testing: Selenium

Blockchain: Ethereum, NFT, Web3, Smart

Contract

Hardware: Verilog, RTL, Chip Design,

Chiplet, EDA, Firmware, CUDA, UVM

Leadership: Agile, SCRUM

Compliance: PCI, HIPAA

CERTIFICATE

Azure AI, Microsoft

AWS Solution Architect, AWS

LANGUAGE

English, Chinese

Architected and scaled a data platform, serving thousands of design engineers, achieving a 99% uptime rate.

Developed a proprietary AI recommendation engine that analyzed billions of chip designs, resulting in a 50% reduction in design time, costs, and resource allocation. Launched the industry's first chiplet marketplace, integrated with third-party vendors, offering millions of components and facilitating transactions worth multi-millions. Led a team that developed award-winning "ChipBuilder" EDA and chiplet routing tools, improving design efficiency by half.

Established an NFT framework based on the Ethereum network with scale to millions of transactions.

Built an SDK and API configuration for chips, enabling seamless integration with cloud services for IoT devices with a 20% increase in overall performance. Created an MLOps platform for ML model training and inference with PyTorch/TensorFlow framework, validation, and deployment pipelines using Kubernetes, Docker, and Jenkins. Co-led the Open Compute Project and JEDEC joint-development of chiplet standard data format Co-authored the white paper 'Proposed Standardization of Chiplet Models for Heterogeneous Integration'

Co-authoring the white paper 'Chiplet Integration Workflow' Led a 50-person distributed team responsible for architecting platforms serving millions of monthly users, achieving a 99.5% uptime rate.

Optimized fulfillment workflows, reduced shipping costs by 15%, and decreased delivery times by one-third, leading to a 10-point increase in customer satisfaction. Consolidated 10+ warehouses into automated hubs, standardizing processes and workflow, resulting in multi-million-dollar annual savings in inventory carrying costs. Implemented a cloud-native supply chain suite, integrating ERP, WMS, and TMS, reducing out-of- stock instances by 50% and achieving a 99.9% on-time shipping rate. Automated the pricing and promotions engine, analyzing terabytes of sales data daily, boosting conversion rates by 10%, and driving additional multi-millions in revenue annually. Engineered a flagship MMO platform with 99.99% uptime, serving several million monthly active users.

Orchestrated the migration of thousands of servers to AWS, resulting in multi-million-dollar annual infrastructure cost savings.

Developed proprietary in-game matchmaking and content distribution systems, consistently delivering sub-50ms latency worldwide.

Led a team that launched an AAA title, doubling monthly active users and increasing the company's valuation to tens of millions, leading to acquisition. Drove incremental revenue in the millions through AI technology innovations integrated across the Oracle product suite.

Managed the team that launched the industry-first elastic pricing recommendation engine for Oracle Sales Cloud, adopted by hundreds of Fortune 500 customers. Spearheaded the integration of proprietary AI algorithms into Oracle Public Cloud, attracting hundreds of new enterprise clients.

Architected cloud-based payment services achieving 99% uptime, facilitating millions of annual transactions.

Streamlined integration with tens of global gateways through standardized REST APIs. Recognized with the Excellence Award for Modernizing WebEx Monetization through architecture, supporting millions of monthly active users.

Led system-level test efforts, achieving over 90% logic fault coverage for a validated microprocessor.

Developed novel simulation-based verification methodologies, reducing chip re-spin costs by up to 25%.

EXPERIENCE

Head of Engineering/CTO, 2017-Present, zGlue, Palo Alto Electron, Palo Alto, CA Project Lead, Contributor, 2020-Present, Open Compute Project, Santa Clara, CA Senior Director of Engineering, 2012-2017, MA Labs, San Jose, CA Director of Engineering, 2010-2012, Webzen, Sunnyvale, CA Engineering Manager/Senior Principal Engineer, 2002-2010, Oracle, Redwood City, CA Senior Software Engineer, 2000-2002, Cisco, Santa Clara, CA Design Engineer, Intel, 1995-1996, Malaysia

Functional Simulation and Verification Workflow for Chiplet-based Systems. James Wong. Chiplet Summit 2024 Guide to Integration Workflows for Heterogeneous Chiplet Systems. James Wong, et al. OCP White Paper, 2023 Business Analysis of Chiplet-Based Systems and Technology. James Wong, et al. OCP White Paper, 2023 Panel: Innovating in the Open Chiplet Economy. James Wong, et al. OCP Global Summit 2023 Chiplet Design and Verification Using An Open Standard Markup Language. James Wong, et al. DAC 2023 Using a Markup Language in Chiplet-Based Design. James Wong. Chiplet Summit. 2023 CDXML - Chiplet Data Exchange Markup Language. James Wong, et al. 2022 Design of Heterogeneous Integrated Circuits - Chiplets and Models. James Wong, et al. MEPTEC Report, Fall 2021 Proposed Standardization of Heterogenous Integrated Chiplet Models. James Wong, et al. 2021 Proposed Standardization of Heterogenous Integrated Chiplet Models. James Wong, et al. IEEE International 3D Systems Integration Conference, 2021

Oracle Advanced Pricing Engine. Hockshan Wong, et al. User's Guide, 2006 Personalized Bidding Agents for Online Auctions. Hockshan Wong, et al. Proceedings of The 5th International Conference on the Practical Application of Intelligent Agents and Multi-Agents, 2000 Agents Participating in Internet Auctions. Hockshan Wong, et al. Proceedings of the AAAI Workshop on Artificial Intelligence, 1999 Agent Service for Online Auctions. Hockshan Wong, et al. AAAI, 1999 Robustness monitoring for PID control systems. Hockshan Wong, et al. IECON, 1998 CES 2020 Innovation Award Product: ChipBuilder, 2020 National University of Malaysia First Class Honor, 1995 Hewlett Packard Award for the Top Graduating Engineering Student at the National University of Malaysia, 1995 Malaysia Sabah State Government Undergraduate Full Scholarship Award, 1991-1995 National University of Malaysia Dean's Lists, 1991-1995 PUBLICATION

AWARD



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