Hanoverton, Ohio 44423
SEEKING THE NEXT CHALLENGE
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Director of Engineering and Quality
TTM Technologies, Inc.
President and General Manager
Etch-Tek Electronics Corporation
XCEL Circuits Group and CXR Telcom (Emrise)
Engineering, Marketing, Operations Director
Diceon Electronics (Elexsys International)
2005 – 2017
1999 – 2005
1995 – 1999
1985 – 1995
Builder and leader of Lean Manufacturing teams,
integrating people, equipment, safety, production, quality, and environmental considerations into an
efficient, effective, compliant,and bottom line
oriented department, operation, or enterprise.
Measureable process optimization through focused
cross functional team application of Lean, Six
Sigma, SPC, 5S, Kaizan, DMAIC, 8D, and other
performance improvement techniques and tools.
Defined and managed procedural and document
systems in compliance with ISO 9001, AS9100,
NADCAP, and associated agency and customer
standards and specifications
UCLA Chemical Engineering
Caltech Integrated Strategic Planning Program
Caltech Management of Technical Professionals Program Demming and Crosby Quality College Certifications
A consistently innovative,
enthusiastic and entrepreneurial
team leader for over 25 years in
manufacturing, and operations
roles with particular expertise in
revenue growth, return on
investment, employee growth
and contribution, and technology
advancement and utilization.
orientation tempered with up to
date market awareness, creative
long term vision, and a practical
appreciation of relevant
technologies and emerging core
and peripheral opportunities.
(sample accomplishments on page two)
Improved manufacturing yields and product compliance of critical fabricated components to such a level that sole source supplier status was awarded by Tier 1 customer for multiple defense programs.
Managed supplier quality efforts, consolidating where appropriate based on devised rating system and associated performance. Worked with key suppliers to improve performance to 99+% delivery and quality levels through focused corrective and preventive actions.
Similarly, functioned as key liaison with customers on managing supplier ratings and performance against goals to mutual benefit, implementing corrective and preventive actions as appropriate to each customer and situation.
Initiated and managed work center zone approach to manufacturing continuous improvement efforts implemented at the shop floor level as owned by their respective supervisor/engineer teams resulting in consistently improved performance metrics against defined goals quarter to quarter.
Fostered 5S, SPC, and lean manufacturing skills and approach in Process and Quality Engineering team members to increase focus and effectiveness of corrective and preventive actions at shop floor level involving production team members using Kaizan, DMAIC, 8D, or other team efforts as appropriate to the situation.
Utilized best practice benchmarking techniques within a multi-site manufacturing operation (domestically and in Asia) and against peers to focus, accelerate, and increase the degree of success of continuous improvement efforts.
Defined multi-year technology roadmap: managing, monitoring, and refocusing tactical efforts as appropriate to maintain relevance and follow through on plan objectives.
Managed and revised Quality Management System policies and procedures as necessary to ensure continued compliance to agency (ISO 9001, AS9100), military (MIL PRF 30132, 55110), industry (NADCAP, IPC 6102, 6013, 6018) and customer specific standards and specifications.
Upon assignment to senior VP role, eliminated heavy quarterly losses in volume PCB manufacturing facility and managed successful divestment of the then profitable operation within six month period.
Successfully re-engineered poorly performing and unprofitable low tech fabrication operation into an efficient, competitive and profitable business unit in the higher technology, quick-turn market segment.
Managed all design, engineering and facilitation aspects of a 45k ft2 military certified printed circuit operation for one company and a 70k ft2 Advance PCB Technology division for another.
Performed extensive market research projects both domestically and in Europe, distilling efforts into detailed strategic business plans. Identified merger/acquisition opportunities along with related regional development agency funding options. Managed subsequent M&A activities and operation transitions.
As Chairman and Managing Director of a UK subsidiary, successfully turned around distressed manufacturing operation, achieving net profitability in first month and thereafter with a 100% revenue growth in first six months.
Turned around telecom test equipment company from operational losses of $1 million per quarter to profitability within five months appointment as President.
Improved throughput and efficiencies over 60% in targeted mechanical, chemical, and photolithography processes within volume manufacturing facility.
Designed, staffed, and operated electronics assembly operation to plan within 90 days.
Prepared and delivered both general and highly specialized financial and technical presentations for use in investor relation and marketing activities.
Designed, staffed, and managed all aspects of an innovative business unit dedicated to the production of very high technology printed circuits.
Managed multi-million dollar research and development group in early ‘90s resulting in numerous manufacturing processes and products many of which are currently still considered state of the art involving MCM-L, TAB, COB, BGA, and embedded passives technologies.
30951 Speidel Road
Hanoverton, Ohio 44423
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