Engineer Engineering

Shankara Vidal 949-***-**** ********@***.***

Electronics Engineering Executive

“Hands on” electronics engineer with solid experience in product development engineering and product applications management in the analog and mixed circuit semiconductor industry.

Experienced in development of hardware from concept to volume production using whatever tools available at whatever budget constraints imposed.

Management of electronics and software engineers for several years as part of a large organization and in a start-up

Vast knowledge of electronics in multiple areas including DSP, firmware, analog, power supply, RF and antennas.

Core Skills and Competencies

Applications Engineering Manager

Hardware Development

Wireless communications

Firmware/embedded systems

RF Electronics

Radio Architecture

Volume Manufacturability

Customer Engagement

Complex electronics design

Relevant Professional Experience

Iamplus, Hollywood CA.

Lead Hardware Engineering Consultant (7-2016-present)

Develop capabilities within the hardware engineering team to develop hardware and firmware for a line of IoT devices that take voice input to interact with an AI personality. Technology development and refinement of acoustic noise and echo canceling. Wrote spec for QC. Hands on development of drivers for I2C, SPI, USB and UART.

Maxim Integrated (Contract), Irvine CA (5/2015-5/2016)

Lead Hardware Developer

Design and prototype hardware. Test to ETSI and FCC standard specifications for EMI, EMC and safety.

Test the hardware and prove that it meets the G3 Power Line Communications standards. This enabled the marketing of the chipset to customers such as Sagem, Wasion, ERDF etc.

Support customers such as GE Oil and Gas for legacy chipsets for Power Line Communications and Home Plug.

Apply my deep knowledge of wireless communications to transmitter and receiver performance considerations such as the design of active and passive filters.

Solve critical problems involving transmitter thermal limitations and applying experience of PCB design to solve those problems and improve electrical performance over temperature.

BROADCOM CORPORATION, IRVINE CA (2003-2014)

Manager of Product Applications (2012 – 2014), Principal Engineer (2009 – 2012)

Senior Staff Hardware Engineer (2003 – 2009)

A demonstrated record of success and achievement at this semiconductor company, marked by a series of promotions to positions of increased influence, authority, and accountability.

Fulfilled a critical role providing leadership in all facets of hardware development, spanning radio, baseband, acoustics, audio and antennas. Effectively managed a team of professionals dedicated to the development of audio and acoustic enhancement technologies for such features as active noise cancellation, video recording and music playback enhancements on cellular devices powered by mobile baseband chips produced by Broadcom.

Key Accomplishments

Served a key role resolving complex technical problems, working with software and chip design teams to ensure that the mobile phone platform achieved the performance expectations of top tier customers.

Worked with circuit design tools, simulations, and lab tests; interpreted and presented test results to internal, external and standards bodies like the 3GPP.

Engaged in extensive client contact, developing and strengthening relationships with customers such as Samsung, Sony and Nokia.

Developed engineering capabilities related to the design of hardware and software architectures for radios, while participating in the development of testing and manufacturing of interfaces for mobile phones incorporating 2G GSM/EDGE and 3G UMTS.

Responsible for outsourcing of design services to China based manufacturer to create a prototype mobile phone that was used for development and marketing of the platform chipset.

Represented the interests of the company in meetings of standards organizations that included 3GPP, the ITU and the MIPI Alliance.

Achieved a reputation as an authority on audio and acoustic applications for the mobile phone platform for Broadcom and its customers.

INTEL CORPORATION, SAN DIEGO CA (2001-2003)

Senior Staff Engineer – Wireless Communications Group

Contributed to the successful implementation of Intel’s first generation WiFi technology, serving as Intel’s lead hardware engineering interface to its external chipset and firmware development partners.

Successfully navigated the product to a transition to manufacturing, where it became incorporated into the Centrino mobile platform chipset.

Responsible for the development of the radio technology and the WiFi modem for the 802.11 family of standards.

MOTOROLA INC., SAN DIEGO CA (1999-2001)

Electronics Engineer – Personal Communications Sector

Contributed to the integration and testing of radio frequency circuits in mobile phones produced by this telecommunications company, with experience gained on multiple models using AMPS, TDMA, GSM and CDMA technologies.

Gained valuable experience developing leadership capabilities and interpersonal communication skills while working with large teams on sizable projects.

ALLIED SIGNAL INC., OLATHE KS (1998-1999)

Engineer – Commercial Avionics

Served as a member of the engineering support staff providing support for business and general aviation electronics and avionics produced by this diversified manufacturer. Provided rapid response to production issues while providing technical support for legacy products used in aircraft communication, navigation and identification.

SOLECTEK CORPORATION, SAN DIEGO CA (1995-1998)

Member of Technical Staff

Instrumental as a member of the Hardware Engineering team for this manufacturer of long-range broadband wireless products used to transmit voice, data and video. Led development and integration initiatives for multi-point two way radios. FCC Part 15, ETSI

Technical Skills

Electronics Design and Development: OrCAD, Cadence, Eagle, PADS, SPICE, MATLAB, FPGA

Firmware: C, C++. IDE’s: Eclipse, Visual Studio, Git. OS: Linux, Android. Scripting: BASH, Perl, Python.

Lab Skills: Soldering with microscope, spectrum analyzers, vector signal analyzers, network analyzers, waveform generators.

Education

MBA- University of California, 2009

MS, Electrical Engineering – University of Colorado, 1994

Bachelor of Technology, Electrical Engineering – Indian Institute of Technology 1992

Patents

Method and system for sharing multiple antennas in mobile devices (8,744,375) Sole patent holder

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