Resume’

Gary M Thut

Summary:

Excellent experience in Electro-mechanical Packaging including Sheet Metal and Injection Molded Plastics design for computer, communication, medical, commercial and aerospace applications and the design of printed circuit boards.

Extensive years of experience working within Engineering Environment of Product Design and Development, Mechanical Engineering and Packaging, Printed Circuit Design, Team and Project/ Product Coordination.

In addition to design, administration of documentation control, agency compliance, and engineering services.

Team Member of 6Sigma and ISO9000 Quality Programs.

Skills:

CAD Experience: AutoCAD, SolidWorks, Pro/Engineer, CREO, CATIA, Altium, Mentor Graphics, Protel, PCAD, CadStar.

Computer Systems: Apollo / HP UNIX Workstations, PC's Including DOS, Windows3.x - Windows8, and Microsoft Office (Word, Excel, PowerPoint, Project, Outlook, etc.).

Experience:

Senior Circuit Board Designer Megitt Aircraft Braking Systems, Akron, OH Sept ‘13 - Present

Design of high-density Multi-Layer SMT, Thru-Hole, and Hybrid and Flex Printed Circuit Boards Using Altium Designer, and Catia for 3D Mechanical Product Design, Drawings and Archive Document Maintenance.

Senior Mechanical Engineer Pepperl+Fuchs, Inc., Twinsburg, OH Nov ‘05 – Feb ‘13

Mechanical and Electromechanical Packaging and Product Design.

Worked on Sheet Metal and Injection Molded Plastics Using Pro/Engineer Wildfire Thru CREO 2.0, and SolidWorks, for Purge Systems, HMI Products (Christensen Displays, Slimline Industrial, Back-Pack Product Line, Aseptic and Edge Product Lines and others), System and Solutions and PA Division Products. Was Awarded a Patent for the Aseptic product for its revolutionary door sealing and in the wall mounting.

Design of high-density Multi-Layer SMT, Thru-Hole, and Hybrid Printed Circuit Boards Using PCAD, and AutoCAD for 2D Drawings and archive document maintenance.

Engineering Services Manager IOtech Inc., Bedford Hts, OH Nov ‘97 – Sep ‘05

Mechanical and Electro-Mechanical Packaging and Product Design including Sheet Metal, Extrusions and Castings, and Injection Molded Plastics.

Design of high-density Multi-Layer surface mount and Thru-Hole printed circuit boards.

Administration of Engineering Services Department, Including Mechanical Engineering, Printed Circuit Design, Document Control, Technical Writing, and Engineering Technicians.

AutoCAD, SolidWorks and Protel design Software.

Developed Design Standards, Policies and Procedures, and the IOtech Engineering Services WEB Page.

Member of the IOtech ISO9000 Quality Development Team.

Provide Support for Manufacturing with Prototype to Production and Design for Manufacturability programs.

Project Manager for Assorted Projects like DaqBook260, WavePort, PowerVista, Snap-Daq, Etas, etc.

PCB Layout Engineer/ Senior M/E Designer Adecco/Tad Technical Services, Feb ‘94 – Nov ‘97

Under Contract to: Aerospace Design and Fabrication (NASA Engineering Directorate), Brookpark, OH

Under Contract to: IOtech Inc., Bedford, OH

Printed Circuit Design, using Protel, Mechanical Design, using AutoCAD

Project Manager for the Design and Release to Production of the ChartScan Product.

Printed Circuit Design, (Mentor Graphics Board Station) for NASA Space Experiments Division, Designing Boards for Space Shuttle “Glove Box Flight Experiments”.

Printed circuit Design for the NASA Instrumentation Division and Engineering Directorate; Designing boards for “Space Shuttle, Space Lab Equipment, and ACTS Satellite.

Electromechanical Packaging and Design, and Electrical Design using AutoCAD (SAMS and SAMSII Project, TEEM Project).

Drafting and Design Manager Rexon/Tecmar Inc., Solon, OH Oct ‘83 – Apr ‘93

Design of high-density Multi-Layer surface mount printed circuit boards (Mentor Graphics Board Station).

Electro-mechanical packaging and Mechanical Product design including sheet metal and injection molded plastics.

Administration of Drafting, Document Control, Technical Writing, Component Engineering, Agency Compliance and Certification, Engineering Technicians.

Developed and Implemented Design Standards and Department Policies.

Member of 6Sigma and ISO9000 Quality Development Teams.

Support Manufacturing with prototype to production and Design for Manufacturability programs

Senior M/E Designer Paramount Technical Services, Willowick, OH Feb ‘83 – Oct ‘83

Under Contract to: Picker International, Highland Heights, OH (April 83 – Oct 83)

Under Contract to: Chase brass Inc., Solon, OH (Feb 83 – Mar 83)

PCB Design, Mechanical Design, Product Documentation, and Design Drafting.

Drafting/Design Supervisor Telxon Inc., Akron, OH Sep ‘78 – Feb ‘83

PCB Design, Mechanical Design, Injection Molded Plastics Design, Electro-mechanical and Packaging Design, PCB prototype photography, fabrication and procurement; Technical illustration.

Management of Drafting, Design and Document Control.

Developed and Implemented all Department procedures and design standards, Coordinated Product and Documentation transfers from Engineering (in Akron) to Manufacturing (in Houston Texas).

PCB Designer/ Product Designer/ Draftsman Paramount Tech Services, Willowick, OH Feb ‘77 – Aug ‘78

Under Contract to: Keithley Inc, Solon, OH (Jun 78 – Aug 78)

Under Contract to: Victoreen Inc, Cleveland, OH (May 78 – Jun 78)

Under Contract to: Ohio Nuclear Inc, Solon, OH (Feb 77 – May 78)

Supervised a group of designers to product completion.

Printed Circuit Design and Drafting to MIL Spec. For “In Flight” Space Shuttle test equipment.

Printed Circuit and Mechanical Design and Documentation of the "AREA MONITOR" Product, for Installation in the Perry Nuclear Power Plant.

PCB Design, Electrical Drafting, Mechanical Design Drafting, and Product Documentation.

Design Draftsman Addressograph Multigraph Inc, Warrensville Heights, OH Aug ‘76 – Feb ‘77

Mechanical and Electrical Design Drafting and Product Documentation of the 'AMCAT' Product.

Engineering Technician, Draftsman, Designer Hickok Inc, Cleveland, OH Jul ‘73 – Aug ‘76

Electronic Technician, Instrument Assembly and Calibration, Electro-Mechanical Design Drafting.

Instrumentation Technician Key Instruments Inc, Gardena, CA May ‘73 – Jul ‘73

Electronic Technician, Instrument assembly, test, calibration and repair.

Technician, Calibrator Hickok Inc, Cleveland, OH Jun ‘72 – May ‘73

Electronic Technician, Instrument assembly, test, calibration and repair.

Related Work Experience:

North Coast Services

Mechanical and Electrical CAD Services, PCB Design Services, Computer Systems, Legal Filling Clerk.

Tendon Manufacturing

Mechanical CAD Design and Drafting, Assorted Projects

Quatech Inc.

Mechanical CAD Design of the “Serial Device Servers” Product Line

AOM Inc.

PCB CAD Design and Product Documentation.

Tellog Systems Inc.

PCB Design and Electromechanical Design.

Electro-Data Inc.

Electromechanical Drafting and Ink Illustrations.

Diagnostic Testing Laboratory

PCB Design and Electrical Drafting.

Hill Manufacturing Co.

Electromechanical Drafting and Ink Illustrations.

Education:

Graduated (Eastlake, Ohio) North High School upper 1/3 of Class. 1972

Associates Degree, ASEET, Electronics Engineering Technology, Lakeland Community College. 1974

Associates Degree, ASMET, Mechanical Engineering Technology, Hickok-Griswold Technical Institute. 1976

Additional Courses/Certifications:

Creo2 Advanced Design, 2013

Creo2 Surface Modeling Design Tools, 2013

Transition from ProE to Creo 3D Mechanical Design Tools, 2102

Pcad PCB Design Tools, 2006

Pro/Engineer Basics and Essentials, 2005

Pro/Engineer Sheet Metal Basics,, 2005

SolidWorks Essentials, Parts and Assemblies, 2002

Protel Advanced Schematic/Advanced PCB: Protel, 1997

CadStar (ADF- Alpha Division): Zuken-Redac CAD PCB Design, 1996

AutoCAD R12/R13 (ADF- Beta Division): CAD Mechanical Drafting and Design, 1995

CADAM TRAINING (ADF - Alpha Division): CAD Mechanical Drafting and Design, 1994

Hume Educational Services: Business Management, 1992

Mentor Graphics: Advanced BoardStation and System Admin, 1986/ 1989

Hume Educational Services: Investment & Money Management, 1984

W.E. Continuing Education: Computer "BASIC" Language, 1983

Moody Bible Institute: Scofield Bible Course, 1981

Printed Circuit Design Institute: PCB Design DFM, 1980

Rishis Institute of Metaphysics: Meditation and Metaphysics, 1977

Activities:

Ordained Minister (Universal Life Church), Jun 05

Ordained Minister (United Christian Faith Ministries), Jul 04

IPC Official Representative for IOtech Inc, Nov 97 – Sep 05

Charter Member IPC Designers Council, 1993

Charter Member GLUG (Great Lakes User Group), Mentor Graphics User Group 1987 – 1997

IPC Official Representative for Rexon/Tecmar, Jan 84 – Apr 93

References:

Michael Gordon Tendon Manufacturing Inc 216-***-****

Paul Kutolowski Fisher/Unitech 440-***-**** x 7606

Joe Penna Phoenix Contact 216-***-****

Ron Pollack Innovative Design Packaging 440-***-****

Patrick Rooney P.F.Rooney adn Assoc 440-***-****

Scott Fazzone McAuliffe Sales 440-***-****

Bob Fitch Rockwell Automation 440-***-****

Frank Janossy Pepperl+Fuchs, Inc 330-***-****

Alden Forbes Venture Design Services 509-***-****

Personal Information:

Gary Michael Thut 440-***-****

460 East 310 Street

Willowick, OH 44095-3710 aczm82@r.postjobfree.com

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