Quality Engineer

Jing Chen

**** *********** **** ******, ***** ***40 H 972-***-**** C 214-***-**** **********@*****.***

SUMMARY

A technically-oriented engineer with extensive experience both electrical and mechanical multiple level assembles and in SC wafer fab CMP process, QRA and customer quality, semiconductor process design, root cause analysis, CMOS device test and team mentorship. Strong focuses on problem solving and meeting customer commitments. Possesses a proven track record in using multiple data analysis tools to detect problems and root cause identification. Excels in the management of cross-functional, international teams.

EXPERIENCE

VLSIP Technologies, Richardson, Texas

Senior Supplier Quality Engineer 2013-

Ensured that suppliers control their process and achieve seamless quality performance, meet the VLSIP package assembly quality expectation, and continue improvement of medical product quality to support customer Boston Scientific.

Drove supplier quality improvement. Conducted onsite assessment, managed the approved supplier listing. Worked with customer and design engineering team to select new component vendor and disqualify high risked supplier. Chaired supplier approval committee for all changes and qualification.

Directed cross-functional teams and suppliers to coordinate the selection of new products. Ensured product manufacturability and quality would result in high yields.

Drove suppliers in the areas of assembly, test, in-coming monitoring and product qualification. Developed monitoring and measurement systems including ongoing data monitoring and reporting while striving for continual improvement for all incoming components. Modified incoming quality control specification for process robustness. Worked with cross-functional teams to develop and document processes in support of business.

Managed supplier Process Change Notice (PCN) activities to continually improve product quality.

Texas Instruments, Dallas, Texas

World Wide Customer Quality Engineer, Member of Technical Staff 2005-2013

Drove alignment of company and customer quality requirements for products, processes, and services. Solved customer problems. Served as quality and reliability champion for local business entity. Served as primary quality representative to external customers, continually improving customer's valuation of quality experienced with company product. Frequently interacted with customers and company functional group managers and engineers in process/product development, design, test, marketing, and manufacturing.

Developed strategy and process flow for external customer quality, developing long-term relationships with external customers, suppliers, as well as internal product development teams. Resolved customer return issues, provided solution, and drove corrective, preventive actions. Conducted quarterly review with business team, highlighting quality issue to drive improvement of DPPM activities. Received assignments and established detailed action plans to meet objectives. Directed and coordinated activities of functional groups outside of quality organization to achieve customer quality requirements.

Established as go-to person in quality team. Utilized sound knowledge/experiences in semiconductor processing and reliability. Earned confidence from different customers, resulting in direct NR impact to bottom line.

Championed external customer return issue and identified root cause due to excessive epoxy over die, causing IC severe burn at external customer’s second-phase test. Designed DOE (4 legs) experiment with different amount epoxy, location, side/top of die to build units to prove possible excessive epoxy as the root cause, with DOE results indicating failure signature match EOS damage on top of circuitry from customer returned units and customer accepting root cause.

Led initiative for largest quality issue in HPA Business Unit history from 2006 to 2008. Impacted 20MU of 50 devices and 4,500 customers in medical, automotive, aviation and telecom applications. Creatively utilized reliability model to provide effective risk assessment for medical and automotive device applications. Rebuilt customers’ confidence and device family resumed shipments.

Identified failure modes and avoided customer line down in 2007. Led root cause analysis/corrective action implementation for TPS799XX (WCSP) quality excursion. Differentiated three failure modes from convoluted customer return cases in corrected hardware design, mixed SWR material, and worn probe card, which speeded issue resolution.

Developed top-notch technical talent for mentoring Asia regional CQE. Provided one-on-one mentoring to China CQE on product knowledge, CQE tools, customer responses on major quality issues, and career development.

Conducted training sessions with Asia regional CQE and U.S. Customs to combat counterfeit activities. Presented verification guidelines, customer return case studies, and useful tools for counterfeit verification.

Received Quality Service Award for outstanding HPA business unit quality team in 2007.

Won Intel’s Preferred Quality Service award for linear regulator product line in 2007.

Texas Instruments, Dallas, Texas

Process Engineer, 2001-2005

Responsible for chemical mechanical polishing (CMP) processes, such as PMD, IMD, FSG, post Cu clean, and STI in wafer fab DMS5.

Served as key member of evaluating N2 gas level in water system when N2 contactor was initially installed in DMOS5N. Identified marginality of N2 gas level and successful results led to dramatically reducing blisters on post Cu clean. Enabled continued qualification of C035 in DMOS5N.

Identified non-uniformity in PMD as root cause for edge yield loss. Designed original DOEs to optimize process. Increased overall yield up to 3% by creating new polishing process.

Optimized C035 PMD CMP process due to C035 failure of reliability qualification. Added extended Buffer to smooth scratches into new robust flow. Integrated results to current C035 new robust flow for C035 qualification.

Acted as key member of A035 technology development team.

ADDITIONAL EXPERIENCE

Texas Instruments, Dallas, Texas QRA Engineer, 2000-2001. Held responsibility for digital mirror assembly and test process control as well as process/equipment major change.

Dallas Semiconductor Corp., Dallas, Texas, Parametric Engineer, 1998-2000. Responsible for CMOS device parametric test data analysis. Investigated parametric failures at test probe, using HP parametric analyzer and SEMs.

Honeywell, Richardson, Texas, Intern, 1997-1998. Managed statistical analysis of process control data, sensor device failure analysis, and quality improvements.

EDUCATION

University of Texas at dallas, Richardson, Texas, Ph.D., Physics, 1999; M.S., Physics, 1993

Dissertation: Optical properties of nitrogen doped and annealed a-C:H films.

Shanghai Normal University, Shanghai, China, B.S., Physics, 1986

PUBLICATIONS AND PRESENTATIONS

Represented Semiconductor Industry Association and TI to provide anti-counterfeit trainings at U.S. Customs and Border Protection sessions for semiconductor (2007-2009): TI is the sole semiconductor company selected.

“TPS382XDBV Excursions and Resolution real case study,” presented to TI 2008 TI Quality & Reliability Symposium, 2008.

“Creation of a robust contact integration for metal I copper; C035.A and C035.1 technology,” presented to TI Yield Symposium, 2004.

“Adding dissolved gases to improve cleaning efficiency in post CMP copper clean,” presented to TI Yield Symposium, 2003.

“Optical characterization of amorphous hydrogenated carbon films,” Diamond and Related Materials 9, 2000.

“Photophysical and photochemical investigations of fullerene presence in a-C:H films,” Applied Physics Letters, 71(2), 1997.

PATENTS

U.S. Patent 200********: Chemical mechanical polishing pad having improved groove pattern.

U.S. Patent 200********: Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same.

U.S. Patent 200********: Detecting endpoint using luminescence in the fabrication of a microelectronics device.

LEADERSHIP AND MENTORING EXPERIENCE

Chair of DFW Asian American Citizens Council (DFWAACC) Youth Symposium in 2012

Program Chair of DFW Asian American Citizens Council (DFWAACC) Youth Symposium in 2010 and 2011

Chair of DFW Asian American Citizens Council (DFWAACC) Leadership Program in 2010

CERTIFICATION

Lean Six Sigma Green Belt

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