Michael Pietrantonio

*** ********* ***** ****** *******, FL 32708

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Director, Staff Scientist, Principal, Sr. Staff, Sr. Manufacturing, and Sr. Component Engineer

SUMMARY

Decisive, solutions-oriented engineer having over 35 years of experience in managing technical operations and product development efforts within deadline-driven environments and performing Component / Reliability / Failure Analysis and Material Engineering, Product Design Assurance functions. Adept in guiding design & development activities, components, materials & product selection, as well as in evaluating and qualifying manufacturers of system, sub-systems, products and active/passive components to the Space, MIL, Commercial, JEDEC & Customer Standard Requirements. Proven track record in aiding Design Engineers, System, Product, Quality Assurance, Contracts, Purchasing, etc. in selecting, evaluating and qualifying components, materials, products and analysis required for the program(s) and in aiding manufacturers in developing and implementing and executing design and process improvements. Recognized throughout the career with multiple awards for excellent performance in engineering. Demonstrates outstanding theoretical, analytical and problem solving skills. Expertise encompasses:

Semiconductors Devices R&D Process Engineer

Failure Analysis Manufacturing Design Product Engineering Component Engineering Reliability Engineering

Product Design Assurance Quality Assurance Quality Control

Internal & External Quality Auditing Component, Material & Product Evaluation & Qualification DC & RF Products Optical device

Satellite Systems and Sub-Systems Vendor or Subcontractor Selection Management/Director Forecasting & Budgeting Proposal Preparation International Business Strategic Planning Project Management Product Management Corporate Communication Corporate Staff Scientist /Chief Engineer

Principal/Senior/Lead Component & Reliability Engineer Power Supplies

CAREER TRACK

A) Smith Aerospace and General Electric Research in Pompano Beach Florida 2006 - 2016.

Joined Smith Aerospace Power Engineering group as a Principal Engineer to technically support both the Design Engineering group in Pompano Beach Florida and the one in Long Island New York. Due to my technical background, I was also responsible for technically supporting Manufacturing, Process Development, Materials and Component selection, Failure Analysis, etc. As a Principal and/or Sr. Staff Engineer, I was also responsible for Lead project development’s P & L, and annual budget forecasts. In 2007, this branch of Smith Aerospace was bought by GE Aviation System Division and called thereafter GE Aviation. Our research, and product development, served the Military, Navy, Air Force, Aerospace and Avionics division for companies such as Boeing, Lockheed Martin, General Dynamics, Northrop Grumman, Gulfstream, Raytheon, TARDEC (Tank Automotive Research, Development & Engineering Center), DARPA (Defense Advance Research Projects Agency), BF Goodrich, etc. Our primary expertise was to perform research and prototype development of High Efficiency, High Power, Low Weight and Size, Low and/or High Frequency, low and high Temperature Converters such as AC-DC, DC-DC and DC-AC power supplies.

• Technically Supported Design Engineering with high Efficiency Switch Mode Power Supplies in the

power range of 2 kW to 30 kW for Military, Air Force, Navy and Avionics.

• Involved in the Bid development process and Statement of Work.

• Oversaw customer requirements and ascertained that design, material and manufacturing standards are met.

• Supported multiple engineers and engineering teams from various disciplines i.e. electrical, mechanical, thermal, structural, manufacturing, and testing) throughout the life of the program(s).

• Managed and technically supported from start to finish multiple product.

• Managed, held or supported weekly and monthly Program Reviews (design, BOM, purchasing, receiving, kitting, manufacturing, schedule, cost etc.).

• Provided technical and non-technical presentation to management, team members and customer throughout the life of the program.

• Held or supported program’s PDR and CDR reviews with team members and customer as when required.

• Held or technically supported Manufacturing, Test Readiness review and Quality audits.

• Technically supported EMI and EMC.

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• Developed and technically supported new process for manufacturing with NTI, manufacturing and rework procedure for various types of products. Technically supported manufacturing with process improvement either by experience or by examining data obtained from SPC, Capability Analysis, Cpk,, 6σ, etc.

• Technically supported Manufacturing in product process development and material selection. Supported Manufacturing with Design of Experiments (DOE), Statistical Process Control (SPC), Product and Process characterizations and with Product and Process Failure Mode Effect Analysis (PFMEA) during manufacturing process development and life cycle of the product..

• Technically supported Evaluation and Qualification of components, material and product(s).

• Technically supported Material and Product Returns and / or Failure Investigations as required.

• Technically Supported Design Engineering in the development of 2 kW forward converter power supply

for the F-18, F-22, and F-35.

• Technically supported the development of power supplies for Laser Systems.

• Supported the design, manufacturing and failure investigation of the Airplane Door Handle Opener.

• Responsible for the P & L development of a 15 kW DC-DC SMPS operating at 95% Eff, 100kHz, 28 Vdc

output and 600Vdc input at Ta = 71 C and Tfluid = 71 C. Weight of the unit was less than 40 Lb.

• Technically supported the design of a 15kW DC-DC SMPS operating at 95% Eff, 100kHz, 28 Vdc output

and 600Vdc input at Ta = 71 C and Tfluid = 105 C. Weight of the unit was less than 40 Lb vs 80 Lb.

• Technically supported troubleshooting field returns (25 kW peak power, 3-phase, 115 Vac L-N to 100 Vdc

for the Air Force AWAK radar systems) on E-2D program also known to GE Aviation as AAR..

• Performed research and technically supported the design and development of power supplies for JASM,

Tomahawk and Buies, and 2kW, 3-phase, 115 Vac L-N to multiple DC outputs (5 Vdc to 65 Vdc) program.

• Technically supported GE’s Central Research Facility in Niskayuna, New York with the Development,

Evaluation and Qualification of SiC wafer process and packaging of SiC MOSFET dies/chips. Similarly, I

developed, evaluated and implemented a qualification program at 3 different Tch so as to evaluate the

reliability of packaged SiC 15A, 30A and 45A power MOSFETS. Power modules composed of SiC diodes

chips assembled on Copper base Metal Matrix, Copper-Ceramics-Copper substrates were also electrically

tested characterized and evaluated .

• Technically supported the GE Central facility in obtain ISO 9001 certification.

• Technically supported the development of a 15 kW – 25 kW Bi-directional power supply utilizing both GaN

And SiC transistors for Buck – Boost and/or Boost – Buck high temperature, high power, high Efficiency

Power Supplies.

• Carried out and technically supported reliability and life testing on SiC MOSFETS power transistors

mounted on PCB configured in a Boost – Buck Configuration, switching at 200 kHz with the Boost voltage input of 600 Vdc and circulating current of 15 Amps. The Buck section was set to the Boost voltage with the same circulating current.

• Developed multiple Thermal profiles for various multi layers of PCB and Metal Clad boards.

• Technically supported the manufacturing testing and repairs of 35 ATT 30 kW, 3-phase power supplies.

• Provided resolution noise issues on IBUs.

• Facilitated and generated the requirements of a Class 10,000 clean room for manufacturing High Power

Modules.

B) Consultant (Component & Reliability Engineer, Failure Analyst and Fixture Designer) 2005 - 2006.

• Coordinated all facets of Component and Reliability functions, of a design, testing, manufacturing, electrical

performance, and mechanical verification of several different active devices and chip pack carriers.

• Completed DPA & Failure Analysis engagements with Sypris Test & Measurement, United Space Alliance (USA), Aydin Display, EMS, ETK/MRC, and University of Maryland / law firms.

• Conducted failure analysis for USA on cables (wire and optical) and transistors used to monitor confidential communication signals between side rocket boosters and the Space Shuttle.

• Providing Component and Reliability Engineering tasks/EEE Parts Program Management services to

companies which lack a quality systems, quality organization or are short handed in Engineering.

• Performed component obsolescence search, custom packaging, testing and screening on various type of active & optical components for various avionics, aerospace and third party testing companies.

• Investigate alternate component, technologies and/or supplies for CCI. Consultant for CCI as well.

• Verified manufacturer’s qualification records/results/documentation/RoHS compliance for CCI, Aydin, Maxwell, Medtronic’s, etc.

• Design test fixtures (DC & RF), Custom Packaging, WLAT, Document Reviews, De-capsulation, Failure Analysis, components and material selection, alternates, ROHS compliance, etc.

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C) Sypris Test & Measurement (ST&M) formerly known as Bell Technologies

-Staff Scientist/ Principal/Senior/Lead Component & Reliability Engineer of the

Testing Corporate Division 1997 to 2005.

• As a Staff Scientist/ Principal/Senior/Lead Component & Reliability Engineer, during my eight-year tenure with ST&M (Third Party Test House), I successfully performed and technically supported over 200 people from

various departments such as sales (document review, negotiations, cost build, etc.), Purchasing (Buy & Sell, Buy & Screen, etc.), Testing (ATE & Bench) and Production [ Screening (customer’s, MIL, NASA, JEDEC, Automotive,

Avionic, Medical, etc.), Evaluation & Qualification from 5 testing locations. In addition, I reviewed the Engineering

and Quality Assurance requirements of many active and passive components, for the five testing locations, for numerous Space, Military, Avionics, Automobile, Medical and Commercial applications / programs including those programs involving the launch vehicle, space shuttle, space station and missile/defense applications in accordance to the Customer Requirements, Data sheet and / or various Mil & Commercial standards such as: MIL-STD-202, MIL-STD-750, MIL-STD-883, MIL-STD-1547, MIL-STD-756, 785, 1629, MIL-STD-810, GR-63,, GR-78, GR- 468, GR-1089, GR-1221, GR-1312, MIL-STD-901, MIL-STD-167, MIL-STD-461, MIL-STD-1580, MIL-C- or MIL-PRF-20, 123, 3003, 3006, 39014, 55682, 17, MIL-T-27, MIL-STD-981, etc., ASTM, JEDEC-STDs, AEC, EIA, IECC, etc. or various General Mil & NASA documents such as MIL-M or PRF-38510, MIL-STD-1772, MIL-PRF-38535, MIL-PRF-38534, 5962, MIL-S or MIL-PRF-19500, INST 311-001 & -002, MIL-STD-2000, GSFC-STD, MIL-STD-975, PPL18, 19, 20, 21, MIL-HDBK-217, 338, 472, 780, 781, 965, ISO 9000, 90001, 9002, QS-9000, 13485,13488, etc. as well.

• Supported many internal and external Quality Audits (Customer’s, ISO, DSCC, etc.), DRs, MRBs, and

Corrective Action Requests.

• Assisted in ISO 9000s, QS-9000 Certifications and DSCCs testing method suitability’s for well known standards

such as MIL-STD-202, MIL-STD-750, MIL-STD-883 and MIL-STD-810, etc.

• Technically support electrical, mechanical and environmental engineers and technicians in performing stress testing, dc or dc & rf burn-in at various temperature, dc& rf at High Temperature Operating Life (HTOL), HAST, HALT, etc. on plastic components, products/units, rf modules/amplifiers, high frequency transistors & MMICs, etc.

Tasked to optimize and standardize Bell’s overall process including sales, quoting, engineering design and NRE, receiving, production, screening, evaluation and qualification, QA & QC support & testing, DPA & FA, final inspection and shipping of the product using FMEA and 6 σ strategy methodology implementing changes.

Recommended to upper Management to develop an infrastructure that integrated the Core Centers of Excellence from our 5 divisions. This involved the leveraging of technical and processing competencies for existing and new customer requirements. I periodically supported conferences or set on technical panels to answer technical questions and the same time to promote out technical capabilities as a third party test house.

Identified and eliminated duplicative efforts and waste through the use of FMEA and SPC.

Provided engineering support solutions to BF Goodrich, Lockheed Martin in Orlando with the Patriot program and Owego with the CAU cockpit electronics upgrade used for upgrading the present Space Shuttles.

Provided engineering solutions to USA at the Cape Kennedy Center in performing Preventative Analysis, Tear Down Analysis and Failure Analysis on the hardware used in the Side Rocket Boosters.

Provided worldwide class engineering solutions to many of ST&M’s Space, Military, Avionics, etc. customers in custom packaging and obsolescence. Provided technical support to internal and external sales engineers with presentations and discussions.

Provided worldwide class engineering solutions to many of ST&M’s Space, Military, Avionics, etc. customers in developing, evaluating and qualifying many of their products, components and materials.

Technically supported all of the production DRs, ECNs, and MRBs and tried to capture all of the incremental costs or cost savings associated with the programs.

Acting Director of the Orlando testing division where I was responsible for the management of 45 people (P&L,

Budgeting, Forecasting, Business development, Sales, Production, Quality Assurance, Managers, Engineers, Program Management, Performance appraisals, Reviews, Career development, Staffing, Hiring, Firing, training, etc.), maintaining ISO 9000, 9001 & 9002 certification (presently they do no longer exist), DESCC and A2La approval for various military, space, and automotive test methods. Furthermore, I assisted the CEO and the Division General Manager in meeting yearly goals for Bookings and Revenue.

As acting Director of the Orlando Test Lab Facility I played an integral role with the development

and start-up of new business technology services in the Military, Avionics, Space, Medical, Automotive, etc. In addition I managed the design, development, production, testing, sales/marketing and customer interface for many of our Military and Space customers both in USA and Europe.

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Responsible for the successful completion, on-time delivery, and on-budget completion of many Engineering program development.

As Acting Director I was responsible for managing $5 M + revenues + new business development.

This entailed coordinating, directing and leading a team of 40 people made up of managers, supervisors, engineers, technicians and operators.

Managed many programs from cradle to production. Supported all pre-production and production

builds, product development, customer interface, new equipment, tool procurement and commissioning, budgets, financial planning, quotations, exceeding customer performance expectations and on-time delivery.

Managed 5 engineers and 12 technicians in product services, process development, testing and

screening directly, while technically supporting an additional 10 engineers from the other 4 locations or through a matrix management structure in R&D such as the design and development of testing and burn-in fixtures, bias schemes, Low and High Voltage power supplies (AC-DC, DC-DC, etc.), RF fixturing and testing, software development, DPA, X-Rays, FA, HALT HAST, ESS, etc.

Managed a cross-functional group including all activities between: Quality, Engineering, Testing, Screening and Production Control.

Responsible for managing the monthly, quarterly and annual financial targets for revenue and profit, including monthly revenue and profit forecasting, Estimate to Complete and Estimate at Complete forecasting, man-loading analysis, and Program metrics achievement.

Technically responsible for the successful transition of the NREs into production / manufacturing.

Responsible for the Engineering Process implementation and execution as required.

Managed growth and subsequent organizational change.

Adaptable and flexible, able to rapidly assimilate new business opportunities and concepts,

technologies and industries.

Responsible for selecting, developing and inspiring teams of managers, supervisors, engineers and

operators towards common goals.

Added value through challenging established practices and delivering creative solutions to complex

business problems

Conduct and managed complex engineering and technical support projects, develop new or

improved techniques and procedures to accomplish assignments

Prepared project plans to include the proposed technical approach, budget, and key milestone

completion dates for all assigned projects

Prepare departmental budgets, control expenditures to stay within spending limits.

Prepared reports, analysis, recommendations and presentations reflecting the status and results of

production in progress on a regular basis

Provide planning, direct and coordination for technical activities associated with the production of

the company’s programs while achieving optimum use of staff, machines, materials and facilities

Worked to improve process capability, linearity, and quality performance.

Participate with functional areas of the company to identify problems and needs.

Responsible for the technical and professional competency of the design NRE and production

engineering staff to meet company goals and objectives

• Worked with various vendors, customers and internal product development groups in each step of the product life cycle to provide reliability engineering support. This type of support included: performing product warranty and reliability assessment; defining reliability test plans, procedures, standards, and specifications based on product reliability requirements; conducting these reliability tests to include accelerated life tests (ALT), highly accelerated life tests (HALT), highly accelerated stress tests (HAST), and/or on-going reliability tests (ORT) for discovery of design weaknesses and reliability verification/demonstration and for driving reliability improvements by understanding the physics of a failure and determining root cause failure mechanisms and corrective actions.

• Provided Component Engineering tasks/EEE Parts Program Management services to companies which lacked a quality systems or quality organization.

• Supported the Buyers, Engineers, Manufacturing, Production Control, etc. of ST&M with Parts

Application Request (PAR) and Parts Approval Process (PAP) at the Testing side of ST&M and Product Parts Approval Process (PPAP) on the Product side as well.

• Perform Reliability Parts Count Prediction (MTBF), Reliability Parts Stress Prediction [(MTBF), modeling, Weibull, Log Normal, Exponential, etc.], De-rating Electrical Stress Analysis, etc.

• Performed Reliability Modeling Predictions using Reliability Block Diagrams, MIL-HDBK-217 F and Part Count Method, Derating Analysis (on Current Sensors, Magnetic Sensing Devices and High Reliability Hall Effect Probes for Lockheed Martin, Hamilton Sundstrand, Boeing, EMS, etc.) to ball park the expected Reliability of the

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products. Where critical failures where identified or suspected, an overall Reliability Block Diagram analysis was also performed to see if redundancy could be considered to handle or mitigate possible single point failure(s).

• Performed Reliability analysis, electrical testing, evaluation, life testing, qualification and step stress testing at various temperature and bias conditions for many active and passive devices/components for many High-Reliability Communications & Space related programs so as to derive the activation energy (ies) and associated failure mode (s). The failure time points per condition were next plotted (MTBF/MTTF vs 1/T) so as to obtain a straight line or series of straight lines. The slope of the line yields the activation energy (θb or failure mode). One over the MTBF / MTTF is the number of FITs or1 over the FITs value is the MTBF/MTTF. Derived and calculated the acceleration factor at various temperature conditions by using the Arrhenius equation and activation energy.

• Looked into various software packages such as Relex, Weibull ++, OPS, Dyadem, Relcal, Isograph and Prism for evaluating the inherent Reliability of the multiple products or process to monitor/pinpoint potential areas for

Reliability improvements as well. Please note that the Reliability evaluation of a process can include a number of

different Reliability analyses. Depending on the phase of the product lifecycle, certain types of analyses are appropriate. These type of software’s were appealing since they could represent an integrated approach to Reliability Engineering or

complement the old convention approach i.e. hand derived vs software.

• Evaluated numerous amounts of materials such as; paints, epoxies, rtvs, strapping compounds, solders, Teflon’s, polyurethane jackets, Kevlar braid, stainless shields, aluminum, kovar, Invar, Titanium, Molybdenum, Tantalum, Tungsten, solders (low & high temperature), 3-M products, etc.

• Supported the Manufacturing and Product Engineering Groups of ST&M in process improvements, evaluation, qualification and product validation, Statistic Process Control (SPC). Supported devices and product designs, quality and process performance metrics. Supported manufacturing Engineer’s and Quality Assurance Engineer’s in root cause analysis and in implementing corrective actions and technically supported the product engineering group of ST&M in performing PAR, Stress Base Analysis, Accelerated Testing using Arrhenius equation,

FMEAs, FMECAs, FTAs, Hazard Analysis, SPC, etc. of their current Sensing Probes and Hall Effect devices intended

for Space use applications.

• Analyzed and implemented process changes in the semiconductor and product group, which manufactured

Gauss meters, current sensors, probes, and Hall Effect devices.

• Technically Supported the Six Sigma Teams in the six sigma activities in the manufacturing and testing side of ST&M.

• Technically supported Management and team members in the Lean Manufacturing Improvement effort to focus on ways of reducing waste & improve lead times.

• Supported inside and outside sales in interpreting customer’s requirements, with technical presentations,

engineering solutions and recommendations, with deriving cost and schedule for many different types of products,

components and materials.

• Performed qualitative and quantitative analysis of many different types of active and passive devices/components and materials for RoHS and WEEE compliance.

• Performed on many Products, Devices and Materials, Destructive Physical & Failure Analysis, Tear Down Analysis for (to name a few customers); USA/KSC, BF Goodrich, Aydin Display, Perkin Elmer Optoelectronics, Chita Electronics, Hamilton Sundstrand, Spar Aerospace, EMS, Siemens Westinghouse Power, Honeywell, Raytheon, Lockheed Martin (Texas), Seakr Engineering, Aerojet, BAe Systems, Boeing Satellite Systems, Conexant, Eaton,

Avnet, ITT Aerospace, Jepico Corporation, L3 Communications, University of Maryland (Dr. Christou), Northrop Grumman, Sepel,…

• Failure Analysis. While at ST&M I performed Failure Analysis and conducted Failure investigations for most of the customer’s (listed above) products in determining the root cause and/or defect(s). I provided technical support to the engineers and technicians in the Analytical lab in performing, Destructive Physical and Failure Analysis as well. Over the course of 8 years at ST&M I have performed, supported and /or managed DPAs and FAs on many different type of passive devices & materials (Resistors, Capacitors, Inductors, Transformers, Isolators, Attenuators, Connectors, PCBs, PWBs, Ferrite materials, Feedthroughs, Filtercons, Switches, Solders, Solder Bumps, solder joints, strapping compounds, board coatings, cleaning agents, Optical Cable (s) & Wired Cable (s), Wires and, etc.), all different active type of semiconductors [Wafer evaluations, Diodes, Photodiodes, Transistors (J- FETs, MESFETS, HEMTs, PHEMTs, HBTs, Bipolars, etc.), OP-AMPs, Digitals, Ball Grid Arrays, Memories (S-RAM, D-RAM, DDRs, PROM, EPROM, EEPROM, etc.), Microprocessors, Gate Arrays, etc.], Optical devices, Power supplies, DC-DC power converters, RF & DC hybrids, disk drives, pacemakers, earring aids, fibrillators, defibrillators, magnetic sensing and current sensing devices, Hall Effect devices, active mixers, Phased lock Loop, LNAs, Channel Amps, SSPAs, Receivers, assemblies, subsystems, systems and various other types of products and materials.

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Note: I am very well familiar with various types of laboratory analytical lab materials, equipments and tools, such as chemicals, grinders, polishers, etchers (dry or wet), microsectioning, calipers, vernier, plastic decapsulation, deliding (mechanical, shear, heat, acid de-capsulation, etc.), microscopes & digital imaging accessories, curve tracers, oscilloscopes, spectrum and network analyzer, high impendence meter, ohm meters (for continuity, contact resistance), sheet resistance, four point probes, Capacitance, Inductance, IR, DWV, etc. Understand the usage and theory behind most failure analysis equipments such as SEM, EDAX, WDAX, SAM, Auger, SIMS, IR, FTIR, FIB, MIL-STD external & internal visual inspection criteria’s as also dictated by MI-STD-1580, customers or manufacturers, cross section, special testing as required, radiography (film or Real Time Imaging), failure analysis reports, recommendations & corrective action when possible, etc. Furthermore, I performed both in-house or at the vendor, process/manufacturing investigation(s) as required and provided technical support to the design, manufacturing, Product Design Assurance, management and operational staff.

• Performed Failure Analysis and Reliability evaluation, characterization and qualification (as a function of bias, temperature and pressure) for United Space Alliance (USA) on various actual and representative fiber optical cables, spools of fiber optical cables, water tight and un-watertight cables used on board the Side Rocket Boosters or Space Shuttles.

• Setup RF measuring capabilities up to 40GHz.

• Designed 50 ohms RF & mm wave test fixtures.

• More information is available upon request.

C) Spar Aerospace

- Component Engineer 1982 to 1997.

- Manager PDA (Component, Reliability, Materials, PA, QA & QC Engineering, Incoming and Analytical

Lab Department 1986 to 1988.

- Technical Team Member, Product Design Assurance & Systems group 1982 to 1997.

- Principal/Senior/Lead Component & Reliability Engineer 1984 to 1997.

- Staff Scientist of the Product Assurance Group 1994 to 1997.

• As Manager of the Product Design Assurance Group at Spar Aerospace. I provided leadership to as many as 40 Component, Reliability, Materials, QA & QC, PDA, Receiving Inspection, etc. engineers, technicians and operators. I technically supported an additional 150 engineers and technicians from other departments and branches of the

company which where engaged in the design of payload hardware. Acted as a technical advisor to many other engineering and technical groups and was a member of the Technical Overview Board from 1982 to 1997.

• As a Staff Scientist/Principal/Senior/Lead Component & Reliability Engineer at Spar Aerospace, I performed, technically guide and support all component, reliability, material and PDA functions, systems and product

development groups (DC & RF), manufacturing, subcontracting & purchasing activities, receiving inspection, configuration management, testing, etc. of Spar Aerospace.

• Supported the Design, Evaluation and qualification of components and products (diodes, transistors. Optical couplers, LEDs), solid state lasers, low-noise and Solid State Amplifiers, AC-AC frequency converters, AC-DC & DC-AC inverters, DC-DC Converters, 3-phase power supplies and three face transformers, Isolated and non isolated Power conditioners, Hybrids, ASICS, product electronic units and sub-systems, etc.

• Worked with design engineers in selecting components and materials in designing power conditioners,

high-frequency receivers, channel amps, low-noise amplifiers, solid state power amplifiers, traveling wave tube

amplifiers, ground mission control and satellite bus systems, fuel tanks, solar cell panels, sunshields, and antennas for

several satellite programs, including SRMS (Canada arm on every space shuttle), Galaxy, Brazilsat 1 & 2, Intelsat VI, Sarsat II/III, International Space Station Alpha, etc. Evaluated and qualified every component and material used in 30+

satellites.

• Oversaw Product Design Assurance activities (Component, Reliability & Quality Assurance, Analytical Lab, QC, etc.) including product design support, process development, manufacturing, assembly, & Testing, parts / material procurement, audits/surveys, and critical

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