Nagaraj Mitty

**** ******* **

San Jose, CA *****

408-***-****(Cell)

acxtmn@r.postjobfree.com

OBJECTIVE: To obtain NEBS Compliance Engineering Consultant’s position in Engineering Co.

Career Goal: As a seasoned Engineering Manager/Director who has worked in Computer/CPU/

Telecom /Avionics companies in Desktop Computers, SSD, In-Flight

Entertainment Systems, SSDs & Telecom Systems with 7US/ 1 European

Patent/s, I am looking for opportunities in Engineering Management.

Professional Experience:

* 20+ years experience as a Mechanical Engineering Manager/Director in managing Product

design teams at HGST, Intel, Sun Microsystems, Panasonic Avionics, Jasmine Networks &

Virident Systems to meet Industrial Design/NEBS/EMI/Safety/Compliance & MDVT/Environmental Test

requirements.

* Hold 7 US/ 1 European patent/s in Desktop Workstation System level & CPU level cooling from

Sun Microsystems.

4/2013 – Present: Mechanical/Thermal/Compliance Engineering Consultant

(3 Years)

4/2012 – 4/2013: Hitachi Global Storage Technologies, San Jose, CA 95135

(1 Year) Principal Design Engineer -SSD

* Designed PCIe 2TB SSD product design involving Mechanical/PCB/Thermal/ID/Mfg/

Safety/EMI/Business/Cost trade-offs per PLC processes.

*Qualified PCIe Add-in Card in 1U/2U Rack Servers – Thermal/Safety/EMI/Shock/Vibration Test Environments.

* Designed 2.5” SSD ( 2TB) product design involving Mechanical/PCB/Thermal/ID/ Mfg/

Safety/EMI/Business/Cost trade-offs.

*Qualified 2.5” SSD in 1U/2U Rack Servers – Thermal/Safety/EMI/Shock/Vibration Test Environments

in Horizontal/vertical configurations.

*Worked with Hitachi Technology Center to obtain Add-in Card & 2.5” SSD Thermal model/s.

*Built Mechanical/Thermal lab from scratch consisting of Reference Platform 1U/2U HP/Dell/ IBM/EMC/Oracle Servers, Temp-Datalogger, Hot-Wire Anemometer, Portable Acoustic

Sound Level Meter, Loctite 384 thermal compounds.

*Worked with Intel to obtain NAND Package Thermal Parameters. – Tj, Theta(JA), Theta(jc), TDP

For ODP, QDP packages

*Worked with LMDA/Hynix to obtain SoC Package Thermal Parameters .– Tj, Theta(JA), Theta(jc), TDP.

*Worked with Commodities manager, electrical lead, systems architect for product design,

of SSD products.

*Worked with PCB designers, system architects, external design houses etc on SSD design.

*Worked with external Test Labs to obtain SSD product EMI compliance to meet FCC, CE, VCCI,

Standards.

*Worked with UL Labs to obtain SSD cUL, CE, CB, RoHS, Certification & prepared a ‘DoC” – Declaration of Conformity.

3/2008 - 6/2011: Virident Systems Inc, Milpitas, CA 95035(Start-up Co)

(3 Years) Mechanical/Thermal/Compliance Engineering Manager

. A) 2.2TB SSD – FlashMax:

* Worked on Low-profile PCI-e Form Factor SLC SSD from Mechanical/ Thermal/ Compliance/

Manufacturing standpoints.

* Designed PCI-e Long & Short Brackets.

* Designed Numonyx Daughter Board Heatsink for Single-stack daughter card.

* Designed Cooling solutions for 2.2TB SSD - (PCIe) HHHL

* Built a standalone “Flashmax” CFD model using external CFD house to Study the board layout

Trade-offs from cooling standpoints.

* Designed FPGA Fan-sink/Heatsink, Flash heatsinks.

* Qualified 2.2TB SSD (Flashmax) thermals in /OracleDell/HP 1U/2U/Blade Server Platforms for

base lining.

* Worked on SSD Storage (PCIe Form Factor) Module Thermal analysis/testing.

* Designed SSD Storage Module FPGA, PLX, and Altera FPGA heatsinks.

* Coordinated “Flashmax” DVT activities with METLabs.

* Designed UL/CE/FCC/VCCI Label.

* Coordinated 1TB Flashmax EMI compliance tests to meet per FCC/VCCI/CE/ ICES/

CISPR specifications.

* Coordinated product Safety activities with UL Labs to successfully obtain UL/EN 60950,

certification for UL, cUL, CE & CB markings.

* Worked with UL Inspector on Initial product Inspection (IPI).

* Worked with Chick Packaging to get “Flashmax” shipping package designed & obtained

qualification for Drop Shock/Shipping Vibration environments at Westpak per ISTA-2A standards.

B) 2U/MySQL Server:

* Worked on 2U GreenCloud Server Product design using Supermicro System &

Spansion developed Gateway Accelerator/EcoRAM DIMMs for high density

Memory, custom plastic Front Bezel (with Industrial Design features) for Data

Center application/s.

* Designed Virdent’s Gateway/EcoRAM heatsinks & validated the Theta(sa) performance

* Did Tcase measurements on CPU, EcoRAM DIMM Bridge ASIC, Flash

Memory & Gateway ASIC to compute Tj #s with Virident Partner, Spansion.

* Coordinated 2U Server MDVT activities with METLabs.

* Worked on 2U/Green Server with Quad-Opteron Motherboard & Virident/Spansion developed

Gateway/EcoRAM DIMMs for high density Memory systems.

* Designed 2U Rack Server Front Bezels with corporate logo & with Industrial design treatment.

* Coordinated 2U Server product safety activities with UL Labs for a successful

Safety Certification per CSA C22.2 No. 950 M95, UL 60950 3rd Edition, EN60950,

standards.

* Worked with UL Inspector on Initial product Inspection(IPI).

* Coordinated 2U Server DVT activities with METLabs.

* Worked with Chick Packaging to get 2U shipping package designed & obtained qualification for Drop Shock/Shipping Vibration environments at Westpak per ISTA-2A standards.

C) 1U/Memcached Server:

* Worked on 1U Green Server with Quad-Opteron/Intel Motherboard &

Virident developed Gateway for high density Memory systems.

* Evaluated Dynatron Fan-sinks, Heat pipes, Straight-finned heatsinks for 1U

Opteron cooling solutions in Supermicro Chassis Enclosure/s.

* Prepared 1U Green Server Environmental Test Spec to meet product Environmental

ruggedness.

* Coordinated 1U Server MDVT activities with Mettles.

* Coordinated 1U Server product EMI Compliance activities with CKC Labs to successfully obtain

FCC Class A, CISPR 22 & EN 55022 & EN-55024 certification.

* Coordinated product Safety activities with UL Labs to successfully obtain UL/EN 60950,

UL/EN 61010, UL/EN 60601 certification for UL, cUL, CE & CB markings.

* Worked with UL Inspector on Initial product Inspection (IPI).

* Worked with Chick Packaging to get 1U shipping package designed & obtained

qualification for Drop Shock/Shipping Vibration environments at Westpak per ISTA-2A standards.

D) General:

*Built Thermal Engineering Lab from scratch consisting of Hot-wire Anemometer, 16-

channel Temp Datalogger for Data acquisition, Portable Sound Level Meter etc.

8/2007 - 3/2008: Panasonic Corporation, Lake Forest, CA 92630

Mechanical Engineering Manager

* Managed 25 Mechanical Engineers developing In-Flight Entertainment (IFE) for Boeing Corp

using Pro/E & to Stringent Mechanical Shock/Vibration/Acoustic/DFM/DFT guidelines.

* Managed SMART LCD Monitor designs – 5”, 7”, 9”, 10.6”, 12.4”, 15” 17” & 23”

Using VIA processor/s for Airline In-Flight Entertainment System.

* Worked very closely with Osaka Manufacturing to get IFE Smart Monitors built

to meet Japanese Manufacturing quality standards.

* Was in-charge of in-house Dynamic & Thermal Test Labs.

* Worked very closely with NTS, external Environmental Test Lab to get D0-160E

Temp/Altitude/Humidity/Vibration/Shock product qualification tests to meet Boeing requirements.

8/2005 – 7/2006: Intel Corporation, Folsom, CA 95630

(1 Year) Lead Thermal/Mechanical Q&R Engineer

FM MMG Q&R Group

* Worked on Penryn - Mobile Processor design & its Platformization for Laptop applications.

* Supported CWMA & Penryn CC Qual JET teams in Mechanical/Thermal Q&R areas.

* Worked on Thermal/Mechanical Q&R aspects of Penryn CC Mobile Processor working with Si

TD, ATD & IDC & T-CAD groups.

* Worked very closely with SARCM & EMG PTM teams for Penryn Si-Package Q&R aspects.

* Prepared & presented Penryn Sync Review Mechanical/Thermal Q&R Risk assessment slides

during Sync Review.

5/2004 – 3/2005: ISR Corp, Spokane, WA 99019

(1 Year) Mechanical Engineering Manager

* Managed 25 Mechanical/Thermal/FEA Engineers developing Spray Cooled

Computer Systems for Commercial, Telecom & Military applications.

* Worked on designing Spray Cool cooling solutions for high-powered Intel,

AMD, UltraSparc & G5 CPUs residing in 19” x 1U/2U Rack Servers.

* Worked on Spray cooled HP Rack Servers with Itanium2/Xeon CPUs.

* Responsible for designing high-powered Blade Servers/Rack Servers with

Intel/AMD/Sun/G5 CPUs from Cooling, Shock/Vibe, Acoustics, EMI, ESD,

Safety criteria conforming to ATCA, ATX, and PCI form factors.

2/2002 - 5/2004: Mechanical/Thermal/NEBS Consultant

(2 Years)

Worked on Intel-based PCI/SAN Servers Mechanical/system design for Sun’s Storage Server.

1/2000 - 1/2002: Jasmine Networks, San Jose, CA 95112

(2 Years) Director, Mechanical/Thermal/Compliance Engineering

*As a founding member, built a 7-man group & designed (OC-48/OC-192 MUX

for Nortel using Pro/E & qualified for NEBS Level 3 specs at ITS & METLabs.

* Coordinated OC-48/OC-192/Controller/Backplane design activities with H/W Engineering &

Sanmina Corp.

* NEBS Specialist (GR-63 & GR-1089 & worked with ITS, NTS, METLabs for product NEBS.

* Built Mech/Thermal Lab from scratch & had built a System level Flotherm model

& had designed all of the ASIC heatsinks & did Thermocoupled tests.

8/1988 - 1/2000: Sun Microsystems/SunLabs Menlo Park, CA 94025

(12 Years) Staff Engineer/Mechanical/Thermal Lead/Supervisor

* As a Thermal Test lead/Supervisor, managed thermal Engineers & did cooling/acoustics design

for SS2, SS10, Portable workstations & Ultra1 & Ultra2 Workstations.

* As a lead mechanical engineer, involved in designs of SS10, Ultra-1 & Ultra-2

Desktop Workstation Enclosure/Cooling/Acoustics designs.

* Built Mechanical/Thermal Lab form scratch.

* Hold 7US/1 European patents in CPU & System level cooling.

* Designed & managed a sheet metal & plastic deskside enclosure, Genesis for GE Medical

Systems consisting of a 15-slot/9U VME Card Cage & successfully qualified enclosure for Env/

UL/CSA/VDE/Safety/ EMI specs.

* Worked on Prowler/Telecom Shelf design (19" W x 18" Deep x 4U high).

* Worked on Sun’s Supercomputer project – PHASER at SunLabs.

*As a Mechanical Lead, successfully worked with outside sheet metal fab house for

manufacturing & transferring the products for production.

*As a Mechanical Lead, managed “Deskside” Enclosure project involving plastic

& sheet metal for Graphics Tower to meet cooling/safety/structural rigidity & acoustic specs.

* Was Chairman of Corporate “Acoustics Strategy Committee” & “Environmental Test Spec

Review Committee”.

Qualification: B.S.M.E (Bangalore University, India)

Patents:

1) SparcStation 10 Workstation Power Supply/System Cooling (Patent # 5287244 dt 1994)

2) Fan-sink design for cooling 30W UltraSparc CPU (Patent # 5734554 dt Mar 31, 1998)

3) Ultra-1 Workstation Cooling/Acoustics design (Patent # 5793608 dt Aug 11, 1998)

4) Ultra-2 Workstation System Cooling Design Patent # 5963424 dt Oct 5, 1999)

5) Integrated Circuit Package & Method (Patent # 5972736 dt Oct 26, 1999)

6) Heatsink attachment method (Patent # 6134112 dt Oct 17, 2000)

7) Stack GBDIMM (Jan 2004)

8) Stack GBDIMM (Jan 2004), European patent

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