rzliang Resume

Rongzhen Liang

Cell: 925-***-****

Email: acxr5o@r.postjobfree.com

Objective: Test, inspection or assembling jobs position of the optic semiconductor devices. Summary of skills:

- Strong experience in hands-on work. And use a stereo microscope. Inspect of quality control.

- Experience in use MES (Manufacturing Execution System) system.

- Understanding in measure components size with ScopeImage.

- Understanding testing on Labview.

- Experience in the design of assembly process and in manufacture for module of semiconductor laser and device of Super Luminescent Diode (SLED).

- Strong experience in the manufacture of mounting TEC (thermo electric cooler) in package. Mount COS (chips on sub-mount). Assemble devices. Measure ACR (Alternating Current Resistance). Wire bonding. Lid sealed. Leakage tested. Etc.

- Familiarity with coupling of fiber-chip technique.

- Well know in the device assembly to adjust Mei-1204B ball bonder, maintenance and trouble shorting of the EDB 65 & EDB 80 Die bonders and parallel seam sealer machines.

- Familiarized to use West-Bond Die bonder, TO-CAN sealing machine, Pull tester, Die Shearer, LW51 compact YAG Laser Welder as well as familiarized to use multi-equipment and multi – meter with work interrelated.

- Familiarized to use computer, Microsoft Word, Excel, PowerPoint. Experience:

Feb 22, 2003 ~ Feb 10, 2016, Inphenix Inc.

Assembling Engineer; QA Engineer; Package Engineer

Schemed a module assembly process for 14 DIL/BUT long / short wavelength SLED devices and SOA module. Set up equipment parameter for mounting COH (carrier on Heat-Sink), COS

(chip on Sub-mount), Assemble devices, Wire bonding, Inspection & lid sealing, etc.

Designed an assembly process scheme and manufactured function stable TO-8 device.

Middle tested, trained people & resolved trouble shorting for Burn-in of semiconductor COS.

Final tested & report results of quality control for Return Material Analyze.

R/D worked in module assembly. Such as: TO-56; TO-9 CAN & SOA device.

Incoming Quality Test of the raw materials: Package, TEC, Heat-Sink, Carrier, Rt, Photo-Diode detector, submit results in IQT Form. Count RM amount for inventory of production line.

Operator supervisor; Trained people in the whole assemble process for the devices.

Created “Raw Material usage for daily work” Form to use in the packaging production line.

Form for Matrix of the COS’S tools. Pull test. BOMs. Etc. Mar, 2002, ~ Feb, 2003, Axonphotonix Inc.

Packaging Engineer

Work in packaging research & development work of chip mounting, module assembly and lid sealing for Optic-Electronic devices of SOA, SLED, DFB, etc. 1980 ~ Mar, 2002, Wuhan Telecommunication Devices Inc, of Wuhan Research Institute of Posts and Telecommunications (WTD of WRI)

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rzliang Resume

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Engineer

R/D worked & experimented for new products; Designed assembly process; Reformed new equipment tools; Made Fiber Facet Treatment; Module assembly; Wire bonding; Fiber-laser coupling; Lid sealing and Final testing. Training people, Quality-control for TO-CAN structure LD, High –speed DFB laser, PUMP source Lasers and PIN detector. Oct 1977 ~ 1979, Wuhan Research Institute of posts and telecommunications (WRI)

Work in process technology of the phosphorus diffusion for the integrated circuit chip.

R/D worked of optical grating Etching of the holography for the DFB (Distribution Feedback laser), and used the Oxidizing technology, photolithography and Etching techniques. EDUCATION:

Sep 1974 ~ Sep 1977, Bachelor’s degree from the Department of Solid State Electronics of Huazhong University of Science and Technology (HUST) in Wuhan of China. Sep 1978 ~ Sep 1979, High Technology study, Wuhan Research Institute of Posts and Telecommunications (WRI) of Ministry of Information and Industry. Jan 1999 ~ Feb 1999, In Corning Lasertron Company of USA. Receive training of module Assembly for Pump Laser and DFB Laser.

PRIZES:

1. “Long wavelength laser with the diffusion stripe” (1983. One of the gold dragon collective prize from national economic committee of China.)

2. “Laser module with five elements for the long wavelength” (1984. One of the first-rank prize from national posts and telecommunications department) 3. “Laser module for the long wavelength” (1986. Third-rank prize from the national posts telecommunications department)

4. “Long-life 1.3um un-cooled laser module” (1991. Second-rank prize from Wuhan research institute of posts and telecommunications)

5. “1.55um distribution feedback laser” (1992. First-rank prize from the national posts and telecommunication department)

6. “1.55um distribution feedback laser” (1992. First-rank prize from Wuhan research institute of posts and telecommunications)

7. “Practical 1.3um semiconductor laser module” (1993. First –rank prize from the national posts and telecommunications department)

8. “Practical 1.3um semiconductor laser module” (1993. First –rank prize from Wuhan research institute of posts and telecommunications)

9. “New equipment’s Popularize and Apply” (1997. Fifth-rank prize for reasonable suggest from Wuhan research institute of posts and Telecommunications) CERTIFICATE:

1. For products Quality Improvement, the praise and award to Ms Liang Rongzhen for notable achievement of improving products quality during 1989 year, from Wuhan Research Institute of Posts and Telecommunications, March 1990.

2. Praise and award to Ms Liang Rongzhen as advanced worker member during 1984 year, from Wuhan Research Institute of Posts and telecommunications, Febnuary1985. 3. Praise and award to Ms. Liang Rongzhen as advanced product member within 1985 year, from Wuhan Telecommunication Devices CO., January 22, 1986.

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