Supply Chain Engineering

Michael S. Prowse

503-***-**** ● acxmb2@r.postjobfree.com ● 8534 NW Timber Ridge Ct. Portland, OR 97229

Education

Ph.D. Materials Science and Engineering, (University of Washington)

M.S. Materials Science and Engineering (University of Washington)

B.S. Ceramic Engineering (University of Washington)

Work Experience

Supply Chain R&D Engineer, Intel Corp. 2015 - present

Supplier facing technical engineer contributing to the development, deployment, and continuous support of SORT capital equipment for application to worldwide Intel manufacturing operations. Responsible for working closely with Sort Test Technology Development (STTD) Partners, Intel factory representatives, internal customers/stakeholders, and external suppliers in a distributed team. Manages technical supply chain, supplier and commercial relations, and engineering change control.

Improved supplier quality and execution of engineering change control and supply chain quality

Implemented and managed supplier CIP and ensured process improvements were realized, reduced documented quality misses to near zero.

Ensured commercial obligations were fulfilled and product demand was met by the supplier without gaps in the supply chain.

Initiated strategic alternate sourcing to reduce costs, by est. $2M.

Sr. Process Engineer Ion Implant Module Intel Corp Hillsboro, OR 2004-2015

Manage tactical operations, Module sustaining; Setting module priorities, scheduling, troubleshooting, remedying/monitoring integrated tool performance, supporting Inter Module Teams, and statistical analysis, directing/ training and mentoring manufacturing/engineering technicians. Supports and is considered a leader within the virtual factory. Continually strides to improve manufacturability and process control with SPC and other controls. Leads task forces and working groups to improve module performance. Chairs VF SLG setting VF wide direction, priorities, and projects.

Providing support and solutions to customers, both internal and external.

Process and manufacturing development; production tool process development, integration support, leads improving production tool performance and throughput, improving manufacturability, determining tool requirements and business needs, modeling capacity needs, creating process/tool specifications. Supported substantial tool/process development in leading edge semiconductor manufacturing processes. Supports process development through transfer of high volume manufacturing processes/equipment for ion implanters. Recently, reduced the need to purchase 3 implanters at a cost of $5.5M each through reduction of redundancy, optimizing run rate and improved manufacturability.

Utilizes DOE (Design of Experiment) to improve process, equipment and capacity.

Works with suppliers to ensure efficient operations and quality. Also works with vendors to drive solutions; tool performance issues are corrected and escalate issue with suppliers when necessary. Works to develop roadmaps/BOMs to support business needs for current and future equipment and process improvements within budget constraints.

Earned 9 divisional awards for process improvement, cost reduction, and improvements in manufacturing and capability/output

Research Associate at the National Institute for Materials Science (NIMS) Japan (2003-2004)

Designed and executed experiments using pulse laser deposition and thin film characterization techniques of novel transition metal oxides for thermo-electric materials, utilizing rapid screening techniques with pseudo-binary and -ternary film depositions.

Relevant Work Skills

Software: JMP (statistical software), Microsoft Excel/PowerPoint/word, Sigma Plot, IGOR (wave analysis), various database query applications.

Relevant course materials

Electronic packaging, physics of VLSI fabrication, IC technologies, defects in materials, physical properties of ceramic, polymeric materials, mechanics of materials, mechanical behavior of materials, engineering design, equipment and plant design, probability and statistics for engineers, engineering statics, mechanics, engineering graphics, solid state fuel cell, surface analysis, electronic properties of materials, and processing of inorganic materials.

Publications and Awards

National Science Foundation Fellowship EASI 2003 NSF-03035

1. Jonathan Putoff, Michael S. Prowse, Matt Wilkinson and Kellar Autumn, "Energy Storage, release, and

Dissipation in the Gecko Adhesion System" MRS Proceedings Vol. 1301, 2011

2. Jonathan Putoff, Michael S. Prowse, Matt Wilkinson and Kellar Autumn, "Changes in Materials Properties

Explain the Effects on Humidity on Gecko Adhesion" J. Exp. Biol. 213 (201*-****-****

3. Jonathan Putoff, Michael S. Prowse, Matt Wilkinson and Kellar Autumn, "Materials Properties and the Fibrillar

Adhesion System of the Gecko" Materials Research Society Fall Meeting 2010

4. Michael S Prowse et al. "Effects of Humidity on the Mechanical Properties of Gecko Setae" Acta Biomaterialia.

7 (2011) 733-738

5. Michael S. Prowse et al. "Effects of Humidity on the Mechanical Properties of Gecko Setae" SICB

Conference Jan 2010, Seattle, WA

6. Michael S. Prowse et al "NEXAFS and XPS of Gecko Setal Arrays" (in development)

7. Jerome G. Moyer, Dmitry A. Kukuruznyak, Nam Nguyen, Michael S. Prowse, and Fumio S. Ohuchi

'Thermopower and electrical conductivity of Mn1.68-XCu 0.6+X+Y+ZCo0.24-YNi0.48-Z thin film oxides obtained

through metal organic decomposition processing' Journal of Applied Physics Oct 2006

8. Dmitry A. Kukuruznyak, Jerome G. Moyer, Michael S. Prowse, Nam Nguyen, John. J. Rehr and Fumio

S. Ohuch ‘Relationship between electronic and crystal structure in Cu-Ni-Co-Mn-O spinels. Part B:

Binding energy anomaly in Cu1+ photoemission spectrum' Journal of Electron Spectroscopy and Related

Phenomena, Feb 2006

9. J. G. Moyer, D. A. Kukuruznyak, Michael S. Prowse, and F. S. Ohuchi

'Advantageous Power Factor Anomaly in Mn1.68-XCu.6+X+Y+ZCo.24-YNi.48-ZO4 Thin Films'

ICT proceedings, Aug 2003

10. Michael S. Prowse, J. G. Moyer, and F. S. Ohuchi ‘Compositional Effects on

Mn-Cu-Co-Ni Oxide Thin Films’ Gorton Conference on Solid State Ceramics, Aug 2002.

11. Michael S. Prowse, J. G. Moyer, and F. S. Ohuchi ‘Compositional effects on

Mn-Cu-Co-Ni oxide thin films’ Pacific Northwest Chapter of the American Vacuum Society

Annual Conference, Sept 2002.

12. Michael S. Prowse and F. S. Ohuchi “Development of a refined measurement of the

Seebeck coefficient” 4th annual Mary Gates Symposium of Undergraduate Research 2002.

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