Keshab Raj Paudel (PhD)

acxkk6@r.postjobfree.com 573-***-**** LinkedIn

Boise, Idaho, USA

Immigration Status: Green Card of the United States Optics Metrology Characterization Thin Films Process Engineering Semiconductors A diligent, efficient and versatile process engineer/physicist with proven experience leading and developing semiconductor packaging processes, thin film metrology and material characterization in the United States, supported by industry experiences, a doctorate degree, postdoctoral training and numerous publications/presentations as a recognised scholar. With expertise in using state-of-the-art process & metrology tools as well as measurement system analysis methods, this collaborative and highly accountable engineer provides high quality data graphing, analysis, modeling and system calibration to continually challenge the status quo and expand the boundaries of his specialist field.

A critical thinker and proactive problem solver who combines a natural analytical and investigatory aptitude with established interpersonal and mentoring skills to guide production technicians in their work and add value to the wider industry through knowledge sharing, innovation and advanced technology proposals. Key Skills

Metrology – UV- VIS- NIR, Ellipsometry (UV-Vis to 3um), Interferometry, PL, Absorption, transmittance, reflectance, XRF (metal film stack thickness and % composition analysis) Thin film deposition – Spin coating, PVD, CVD, RIE, PLD, thermal evaporation Microscopy – Optical (UV-Vis-NIR), Fluorescence, SEM, STEM, AFM, FTIR (Hitachi), Raman Electrical methods – IV, CV characterization, Four-point probe Ultrafast methods – Transient PL and Photoconductivity and Lifetime measurements Temperature and Pressure – Diamond Anvil Cell, Cryogenics and Vacuum Technology Surface Characterization – Thickness, Roughness, Stress, Bow, Warp etc. Strengths and Capabilities

Process Engineering – Plans, executes and enhances innovative engineering processes Characterization – Proven expertise in metrology for metal, non-metal and semiconductors films/wafers Semiconductor Fab Tools – Tool calibration, recipe set up, gauge analysis, and FMEA, SPC Semiconductor Device Fabrication – Designing processes for semiconductor packaging including 3DI Photolithography – Traditional to EUV lithography techniques Measurement System Analysis – Gauge R & R, recipe qualification Career History

2015 – Present Micron Technology, Inc., Boise Idaho Process Engineer – PWF

Focus: Thin film sputter PVD, CVD and plating metrology for advanced 3DI IC packaging

Supported production in the thin film fab by setting up and qualifying recipes on metrology tools

Designed and executed key characterization experiments for various metals and non-metal films

Gained expertise in DOEs, Engineering Global Change System executions and Process Automation

Qualified blanket and patterned wafer recipes on Lasertec-BGM300, Sentronics-SemDeX, KLA Aleris, KLA-RS100, Novai500, Jordan Valley XRF, Circle, Rudolf wafer scanner etc. for 300mm wafer fab equipment

Identified correct calibration models and processes for electrical four-point probe metal metrology tool

Established correct metro gauge evaluation process using Measurement System Analysis

Set up and qualified several processes for technology transfer from R&D to high volume production

Discovered shortcomings in existing process analysis methods, designed and implemented improved methods in order to compare and contrast process vs. metrology contributions on variances

Designed process development/improvement experiments utilizing factory automation tools

Assisted in qualifying new photoresist process qualification project to the team

Characterized Silicon wafers at 3DI assembly fab processes from FOEL through BOEL

Fully trained and experienced in Real Time Defect Analysis (RDA) applications such as Klarity 2

2012 – 2015 Oregon State University

Postdoctoral Scholar, Department of Physics

Research: Characterization (metrology) of semiconductor thin films and devices

Part of the Organic Photonics and Electronics Research Group at Oregon State University

Designed and built a multipurpose system with high vacuum pumps, cryogenic equipment and customized sample holders for optical and electrical characterization, plus semiconductor imaging

Created and executed experimental processes for data analysis for various tools such as PVD

Built devices such as Thin Film Transistors, Solar Cells, Light Emitting Diodes (LED) and Photodiodes

Successfully designed a photolithography process for patterning gold electrodes on glass substrates

Overall maintenance/upgrade of clean room lab and research equipment hardware to ensure a safe fit for purpose environment

Conducting & presenting academic research papers & technical reports to improve industry knowledge 2006 – 2012 University of Missouri, Columbia

Graduate Assistant, Department of Physics and Astronomy Research: Optical and electrical characterization of organic semiconductor materials under high pressure. Fabrication and characterization of organic solar cells and field effect transistors

Performed Photoluminescence, UV-Vis absorption, Raman, AFM, FTIR, XPS/UPS experiments

Assembled and integrated a grating spectrometer with Lock in amplifier, photomultiplier tube and stepper motor, and computer interfaced experimental set up in LabVIEW

Studied BHJ organic solar cell materials using PL absorption and Raman spectroscopy

Provided training to senior undergraduate and graduate students in advance optics course including:

• High Precision Optical Interferometry (Michelson, Scanning Fabry-Perrot etc.)

• Polarization and Dynamic Birefringence experiments 2004 – 2005 University of Missouri, Kansas City

Graduate Assistant, Department of Physics and Astronomy Research: X-ray/UV photoelectron spectroscopy (XPS/UPS) study of gold nanoparticles supported on Silicon

Developed a computer interfacing program for transistor parameter characterization in LabVIEW

Performed XPS and ultraviolet photoelectron spectroscopy (UPS) in an ultra-high vacuum (UHV)

Determined electronic structure of nano-sized gold clusters and

Observed fragmentation of electronic energy levels in gold nanoparticles of certain cluster size

Set up laboratory and instructed undergraduate physics (Physics I and II), advanced optics & physics Education, Qualifications, Training and Courses

Postdoctoral Scholarship: Department of Physics, Oregon State University 2012 –2015 PhD in Physics: Dept. of Physics and Astronomy, University of Missouri, Columbia, GPA: 3.76/4.0 2012 M.S. in Physics: Dept. of Physics and Astronomy, University of Missouri, Kansas City, GPA:3.94/4.0 2005 Professional Affiliations and Memberships

Material Research Society (MRS), American Physical Society (APS), Society for Optics and Photonics (SPIE)

President: Physics & Astronomy Graduate Student Association, University of Missouri Columbia (2010) Computer Applications and Additional Information

Six Sigma Green Belt - Certified, KT-Problem solving- certified, experienced in 5S, 8D, L6S, Programming & Simulation – JMP, Python, MATLAB, GAUSSIAN, MATHEMATICA Design & Data Analysis – JMP, AutoCAD, ZEMAX, Cadence APD, Peak-Fit, Microsoft Office Manufacturing Tools - Recipe set up on KLA, Lasertec, Sentronics, NOVA, Applied Materials etc. tools Process Integration – MES, traveler set up and process integration, lot management etc. Statistical Process Control - (SPC) chart set up with rules and alarms Measurement System Analysis (MSA) - Gauge R & R, SPACE, JMP and Excel Statistics Tools – JMP (including JSL scripting), Excel, R: Certified Markup Language & Web Applications - LaTeX, MS Word, HTML, Dreamweaver Publications, Presentations and Awards are listed in full on LinkedIn Professional and personal references are available on request

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