Andrew Wulff

Cell: 612-***-**** Email: acxer6@r.postjobfree.com

Executive Summary

Energetic, results-driven leader with the ability to pull global, cross-functional teams together to obtain a predetermined objective. Excellent communication skills coupled with detail-oriented problem solving abilities. Manufacturing & Quality Engineering coupled with management experience related to hard drive suspension quality, design, integration, reliability, printed circuit board assembly (PCBA), systems assembly and optical design/assembly.

Quality Control, Statistical Process Control (SPC), Design for Six Sigma (DFSS), Define, Measure, Analyze, Improve & Control (DMAIC), 8D problem-solving, Corrective Action/Preventative Action (CAPA), Program/Project Management

Professional Experience

Seagate, Bloomington, MN

Sr. Staff Engineer, Supplier Quality Engineering, Recording Heads Operation 2012 – 2016

Responsible for Enterprise suspension development and program launch. Provided leadership to global Supplier Engineering teams during bi-weekly meetings. Worked closely with all suspension suppliers (HTI, MPT, NHK) to ensure best-in-class (BIC) quality.

Launched seven enterprise programs on-time for successful volume ramp by completing ramp readiness reviews and populating qualification plan requirements. Validated component level Critical to Quality (CTQ) performance to meet dual source supplier congruency which avoid downstream production issues and yield deltas.

Led and facilitated worldwide (Minnesota, Thailand, Japan, Singapore) supplier engineering meetings. Resulted in quicker problem resolution (saving weeks/months) thereby ensuring component supply to meet customer demand.

Coached suppliers through proper 8D problem solving methods resulting in clear summaries scored by their over sight board.

Partnered with Asia teams to trouble shoot Head Gimbal Assembly (HGA), Head Stack Assembly (HSA) and Drive level yield issues to find root cause & corrective actions (RC/CA). Resulting in increased yields by up to 5% and maintain dual source supply chain continuity from a risk mitigation perspective.

Communicated supplier process change requests internally to determine Seagate risk level, and then created risk documents for possible Drive level qualification. Ultimately approved process change(s) by proper data analysis which underpinned performance expectations.

Awarded multiple certificates of recognition for exemplary contributions and excellent achievements in customer success, openness and teamwork.

Sr. Manager, Supplier Quality Engineering, Recording Heads Operation 2006 - 2012

Managed Supplier Quality Engineering team (five engineers, one technician, and three operators). Provided leadership and strategic direction to the team. Ensured BIC quality for the suspension supply chain. Ultimately responsible for the quality of all suspension products, from Engineering Mode (EM) phase through Ship Approval Date (SAD). Partnered with international suppliers and Seagate regional facilities to create product to meet quality requirements & product development/mass production demand.

Managed SQE team & lab personnel which were responsible for three suspension suppliers (USA, Thailand & Japan)

+ Improved SQE team performance by individual coaching sessions.

Led a team of engineers, technician and operators that accomplished:

+ Increased STX product reliability through proper risk analysis and ultimate scrap decision of $1M of supplier inventory

+ Successfully launched 30+ programs on-time without gating program SAD. Ensured TGA supply to meet Drive demand.

+ Improved TGA cleanliness by proper root cause / corrective action analysis driving actions through the supply chain.

Reduced Drive level test failures by in one case by approximately 1,000 DPPM to meet our Drive level goal.

Staff Engineer, Recording Heads Operation/Personal Storage Group (PSG) 2002 - 2006

Managed and created project schedules for Desktop, Notebook and Consumer Electronics products as it relates to suspensions. Responsible for all PSG suspension products, from EM phase through SAD. Responsible for creating and communicating Trace Gimbal Assembly (TGA) Design Migration Documents. Teamed with international suppliers and Seagate regional facilities to create product in order to meet product development demand.

Facilitated weekly communication meetings between Seagate and TGA suppliers ensuring we have a common understanding.

Facilitated international meetings as required between Seagate USA, Seagate Thailand and TGA suppliers in Thailand & Japan

Led reliability improvement effort to reduce/eliminate a 200 DPPM skip write issue by improving lift tab finish

Andrew Wulff

ADC Telecommunications, Minnetonka, MN

Senior Project Engineer, Micro Optic Components Department 2001- 2002

Managed and created project schedules to develop new optical products. Responsible for leading team through Discovery, Design and Implementation milestones to transfer design from engineering into production. Responsible for ordering and implementing capital equipment. Facilitated weekly communication meetings between manufacturing team in Juarez, Mexico and Design team in Shakopee, Minnesota to resolve quality and delivery issues.

Achieved B-release of the Optical Tap Monitor (OTM) in December of 2001 which met original target date and budget

Achieved A-release of the OTM in July of 2002 which met original target date and budget

Facilitated order and implementation of an Adept L1/P2 Nano stage unit. Transferred one Adept unit into production

Partnered with Manufacturing & Quality to produce miniature stainless steel components with tolerances of +/- 2.5 microns

Eliminated reoccurring Material Reject Notifications (MRNs) by detailing quality issues to Manufacturing in Juarez, Mexico

Educated both Manufacturing & Design on requirements to produce and ship product without delays

Senior Project Engineer, Manufacturing Engineering Department 2000 - 2001

Led team to create one standard Design for Manufacturability & Test guideline across four states and five design teams. Responsible for transferring PCBAs from Portland to Minnetonka as part of the $160 million business unit transition. Provided leadership and direction to Process Engineers.

Completed update of Design for Manufacturability & Test Guideline which met the six-month target date

Transferred 200+ existing PCBAs into our Minnetonka manufacturing facility in six months

Guided Process Engineers on Design of Experiments (DOEs) which increased outgoing quality of product

Manager, Manufacturing Engineering Department 1999 - 2000

Managed 28-person Manufacturing Engineering department including Product Engineering, Process Engineering, Industrial Engineering and Documentation creation. Responsible for cost center management, capital budgeting, hiring, performance appraisals, training and goal setting.

Led a team of engineers and technicians with an annual budget of $2.4 million that accomplished:

+ 85% reduction in cycle time on highest volume product HXLR (from 800 units in 84 hrs to 12.5 hrs)

+ 87% reduction in Rework/WIP by implementing a consolidated rework cell (from 2,300 units to 300 units)

+ Specified, ordered and implemented $1.2 million surface mount prototype line

+ Improved machine utilization from 20% to 40% over a 3-month period

+ Implemented a new job kitting process which obtained a 95% success rate in three months

+ Created more than $800,000 in cost reductions

+ Implemented Panapro SPC software for real-time data tracking of equipment uptime

+ Completed Alternative Pad Finish DOE approving OSP, Ni/Au and Ag

+ Implemented 0.4mm pitch QFP process and 1.0mm pitch BGA process

+ Increased output by 40% over an 8-hour shift, on a medium-volume assembly

Previous Relevant Experience:

Senior Manufacturing Engineer (Product/Process), Manufacturing Engineering Department

Brought 15 high technology double-sided SMT assemblies into manufacturing to meet production demand

Reduced rework by 40% on various assemblies after implementing standard spacing recommendations

Increased first pass yields by 15% to >95% on numerous assemblies after adjusting stencil aperture opening

Specified, ordered and implemented a Nicolet 1400 X-ray manual inspection machine

Improved success rate of 90% to 95% for meeting customer promise dates by working with scheduling

Responsible for DFM&T on Cellworx product family designed out of Richardson, Texas. Made trade-off decisions between design and manufacturing. Worked with Mechanical and Electrical Engineers to create a low cost, easy-to-assemble product.

Partnered with Purchasing to implement a two-bin electronic ordering auto-replenishment system thus increasing inventory turns and reducing on-hand inventory cost

Senior Manufacturing Engineer (Process), Manufacturing Engineering Department

Responsible for SMT floor support of Panasonic High Speed Chip Shooters (MV2), Fine Pitch placement machines (MPA) and MPM Stencil printing machines (U2000). Concentration on Leading Edge Technology (1.27mm BGA, 0603, 0402, 0.5mm QFP). Responsible for creating new pad layout geometries for numerous CAD departments.

Improved outgoing quality of product by conducting numerous DOEs

Increased thru-put of product by using SPC to monitor performance of automated equipment

Partnered with Purchasing to implement JIT ordering of consumable products

Partnered with Quality to implement ISO standards across the factory floor

Resolved quality issues and eliminated MRNs by using IPC and EIA standards

Andrew Wulff

Banner Engineering Corporation, Plymouth, MN

Manufacturing Engineer SMT

Managed Manufacturing Engineering Technicians who were responsible for programming Pick & Place machines, providing floor support and completing engineering projects. Responsible for performance on the following processes: Stencil printing, Pick & Place, Reflow and Cleaning of PCBAs. NPI team member providing DFM input from inception to delivery of product. Provided floor support in the Hybrid Assembly area (dispense epoxy, place die, cure conductive epoxy, wirebond, encapsulate and cure).

Specified, ordered and implemented $3 million in new equipment pertaining to Surface Mount Assembly

Educated and trained operators which increased thru-put and improved outgoing quality of our product

Education and Professional Development

UNIVERSITY of ST. THOMAS - Minneapolis, MN

Masters of Business Administration (MBA) with concentration in Management

MANKATO STATE UNIVERSITY - Mankato, MN

Bachelor of Science - Manufacturing Engineering Technology (MET)

Professional Training: 8D, DFSS, Lean Manufacturing, Harvard Business School Leadership Development Program for Managers

Linkedin = https://www.linkedin.com/in/drewwulff

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