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Supply Chain Lean Manufacturing

Queen Creek, Arizona, United States
January 12, 2017

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***** * ******* *********, ***** Creek, AZ 85142 480-***-****


Mechanical Engineer with extensive leadership experience in Global Supply Chain Professional, and Lean Manufacturing, including directing international developmental project teams throughout entire process culminating in successful completion to ensure timely, safe, cost effective design, and implementation of quality products from conception through customer satisfaction. Strengths include supplier quality management, equipment and socket development, lean manufacturing, and analytical problem solving.


Various positions: 2014- Present

Home Depot - Customer associate, assist customers for their project needs. Operated reach trucks, pallet jacks, and forklifts to load delivery trucks and bins. Clean and fixed rental equipment including small motors.

HD Pluming - Plumber, installed new fixtures and resolved customer service calls.

WKWood - Owner of operations, design, procurement, fabrication, and sales of wood furniture and wood art

GTAT Oven project Foreman, Omega Morgan, Mesa, AZ September 2015- March 2016

Managed a crew of 10+ employees for removal and demolition of the sapphire ovens. Established daily expectations which resulted in completing the project 2 months a head of schedule, no safety issues, and a cost savings of $100K

Intel Corporation, Chandler, AZ 1996 - 2014

Supply Chain R&D, Equipment Development Engineer, 2008 - 2014

Managed supply chain development, delivery, and acquiring die pick and place and strip saw equipment sets for current and future product requirements. Selected supplier that met design, cost, high volume manufacturing (HVM) demand, and delivered equipment to technology development (TD) and HVM sites. Published detailed engineering specifications, design for manufacturing and quality, equipment test plans, statements of work, process flows, failure analysis, automation and training documents. Spearheaded extensive project collaboration with engineering, finance, commercial, upper management and customers.

Managed $100M assembly equipment through development life cycle to up production ramp. Negotiated technical specifications, led technology path finding activities and oversaw supplier selection, drove cost reduction, managed delivery and schedule, designed for quality and manufacturing, and managed supply chain resources to deliver equipment capability resulting in return on investment of $500M.

Managed supplier development of robust quality systems, continuous improvement, engineering specifications for equipment training, equipment performance in mechanical, electrical, and pneumatic quality, equipment process, maintenance, recipes generation, and audit supplier capability and process for lean manufacturing that had direct impact on ability to meet production ramp, spares, consumables delivery, and suppliers’ 3rd party supply chain.

Audited suppliers and implemented continuous improvement using Intel’s supplier audit system. Applied quality systems for spares, equipment certification, software, and on site support resulting on a 50% reduction in equipment downtime.

Completed $20M 6 Sigma Black Belt development project for new pick and place equipment to pick die from wafers and place into a tape and reel.

Managed supplier and internal development engineering teams to create all technical aspects, development processes, statistical analysis of process controls, and safety requirements for first of a kind development of package strip saw equipment resulting in cost avoidance of $1B.

Tooling Socket Development (Supplier Quality) Engineer, 2000 - 2008

Managed suppliers and project in the molding, machining, electrical and delivery of CPU and test sockets to support Intel’s HVM ramp. Drove, tested, and facilitated socket development projects for multiple platforms resulting in reducing tooling development time by a quarter and a cost savings of $100K per project.

Measured, tested mechanically and electrical, and implemented new technology of a double compression stamped contact socket for use in HVM testing environment with cost savings of over $80M.

Led project for first molded desktop technology of land grid array (LGA) HVM socket that included leaded and lead free solder balls. Defined roadmap, electrical and mechanical requirements, and developed 2 HVM socket suppliers to meet engineering design, electrical, cost, quality, and reliability requirements. Qualified both suppliers for low risk HVM ramp of next generation desktop product.

Developed suppliers' printing and label attach pilot lines of Pentium II cover to 4 new HVM production lines using copy exactly methodology, lean manufacturing, statistical analysis, and Intel’s quality control method to suppliers HVM site. 4 production lines were up to 90% capacity with in 3 weeks of equipment delivery that resulted in no line stoppage at Intel or Intel’s ability to deliver to their customers.

Manufacturing Engineer, 1996 - 2000

Managed $5M complex ceramic package hermetic seal and tape carrier package technology equipment

Coordinated and performed lean manufacturing, process, and engineering specifications for ceramic package hermetic seal and tape carrier product equipment which ensued in $1B yield improvement on total assembly process yield and equipment buyoff. Team leader and trainer responsible for certification of 4 expert-level technicians


Published patent # US 6,743,037 B2 “Surface Mount Socket Contact Providing Uniform Solder Ball Loading and Method”

Published US Publication # US 200******** A1 “Integrated Circuit Package”

Published “Developing First Desktop LGA Socket” at Intel Technology Symposium.

Published paper “Ultra Fine Pitch Socket Development Challenges” at Burn-in Test Socket workshop


Bachelor of Science, Mechanical Engineering, Arizona State University, Tempe, AZ


Lean 6 Sigma Black Belt Certified


Drawing/3D modeling – GD&T, SolidWorks, AutoCAD and ProE

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