EDUCATION INFORMATION:

Michigan Tech Univ (**-MAY-1987)

Michigan Tech Univ(01-MAY-1987)

Michigan Tech Univ(18-MAY-1985)

ADDITIONAL RESUME INFORMATION:

SABINA JENNY HOULE

PERMANENT ADDRESS

1347 E. Redwood Lane

Phoenix, AZ 85048 U.S. Citizen

480-***-****

JOB OBJECTIVE

A challenging engineering management position utilizing my chemical and mechanical engineering and microelectronic packaging materials and process background..

TECHNICAL ELECTIVES

Polymer Chemistry, Polymer Rheology and Processing, Mold Design (C-Mold), Finite Element Analysis, Design of Experiments, Composite Fabrication and Property Evaluation, Manufacturing Operations Management, Technical Writing and Presenting, Technical German.

EDUCATION

Michigan Technological University (1981-1985)

Degree: BS Chemical Engineering, Option: Polymers (GPA: 3.3)

Swiss Federal Institute of Technology (1985-1986)

Awarded Scholarship as Swiss America Exchange Student; Attended Classes taught in German and performed research for MS under Professor J. Meissner.

Michigan Technological University (1986-1987)

Degree: MS Chemical Engineering, Option: Polymers (GPA: 3.8)

Thesis Title: “A Rheological investigation of the Flow of Lubricated Polymer Melts into a Capillary Die”

Michigan Technological University (1986-1987)

Degree: MS Mechanical Engineering Option: Operation Management (GPA: 3.8)

Thesis Title: “Creep and Stress Relaxation of High Density Polyethylene Tubing”

Gunter Institute Translating Certificate German (1985)

TRAINING

7 years Intel Leadership Training, 7 steps Highly Effective people, Ziegler Miller Frontline Leadership 1996, Dealing With Difficult People, Injection Molding Tool Design, C-Mold, Product Design, Presentation Skills, Situational Leadership, Time Management, ATD Methodology, ATD Basic Stats, Constructive Confrontation, Effective Meetings, SECC white paper/PCCB, Speed basic, ATD Management and Leadership Training, Plastic Manufacturing, Innovation.

PROFESSIONAL SOCIETIES

Vice- President Society of Women Engineers (1985) (Member 1981-92, 2007-present)

Vice-President German Club (1985) ( Member 1981-87)

Historian Theta Chi Epsilon Sorority (1985) (Member 1983-85)

President General Motors summer interns (1985)

Member American Institute of Chemical Engineers (1982-1995)

Senior Member of the Society of Plastic Engineers (1987 - Present)

Member of the Society of Manufacturing Engineers (1989 - 1998)

Member of SAMPE (1989 - 1998)

Treasurer SAMPE Midland Chapter (1990-1991)

Chairman SAMPE Midland Chapter (1991-1992)

Member of Society of Automotive Engineers (1992 - 1995)

IEEE Membership Chair Intel (2005)

Educational Advisory Board Member Michigan Technological University (2005-2008)

Senior Member IEEE (June 2007 to present)

Material Technical Network Intel Co-chair (2008 to Present)

MTU Presidential Council of Alumnae (Advisory board to for the president) (2005 to Present)

Panel Member for Society of Women Engineers Discussion MTU (2006, 2008)

Educational Advisory Board Member Michigan Technological University (2005-present)

TMG Patent Committee Representative (2006- Nov 2008)

Judge TechCon conference session (Spring 2007)

Judge EXPO 2008 Michigan Tech (April 2008)

Lean Learning Certificate (Aug 2008) Panel Member for Women in Intel Discussion (Aug 2008)

Judge for papers CREATE in Costa Rica (Aug 2008)

Co-Chair Materials Technical Network at Intel (Nov 2008-present)

Co-Chair Supply Chain Technical Leadership Forum Conference (Q1 2010)

Chair Assembly Test Session for SCTLF (Q1 2010)

Committee Member for Supply Chain Technical Leadership Forum Conference (Q4 2011)

AWARDS

Society of Professional Engineers Scholarship (1981)

Dow Chemical Polymer Scholarship (1985)

Selected as Switzerland/America exchange Student Full Scholarship to ETH Zurich (1985-86)

Dow Chemical Research Award for Resin Transfer Molding Process Development for BCB-Diketone (1990)

Intel Awards:

ATDA award for DS2P cartridge redesign Q3 1997

ATD/CSMO Slot 2 Design to Production award June 1998

Award for Casdade thermal solution supplier development and cert.

ATD Divisional Award for dev. Olga2 thermal solution

Gigamine Launch Team Award Q1’00

ATD Dev. Recognition Award for Gigamine Thermal Solution Development

TMG Excellence Award Q1 2001- Olga2.int2 package technology leading the industry and ramp

ATD Divisional Award Q4, 2001 for IHS Dual cert Shinko and IPT

Q2’03 Award for Northwood/Prestonia Solder TIM Implementation

TMG Excellence Award Q3 2003- For making P860 Solder TIM happen

Lead the CAM Team receiving “ATTD Divisional Recognition Award “ For certifying CAM Process for 1264 p1a and DD in 9 months"

Award for Instructional Excellence in the Delivery of “ATTD Introduction to Packaging Program

Lead the Team receiving ATTD Divisional Recognition Award for “Exceptional Teamwork Developing the First Spray Flux Material and Process for Chip Attach Q3’06

Certificate of Appreciation Oct’06 for teaching ATTD Intro to Packaging Program (Director Nasser Gayeli)

DRA for Outstanding Results and Customer Orientation in Driving LEAN Improvements in MRA Business Process and Tools Q4’09

Recognized for outstanding support of CREATE conference in Costa Rica Q3’10

TME DRA for contributions to the success of Supply Chain Technical Leadership Forum

TME Excellence Award Quality of 1268 Ramp Q4’10

DRA for Efforts in RCG Recruiting Q4’11

TMG recognition Supplier Response to Japanese Earthquake/Tsunami Preventing Supply Chain Shortages and Customer Impact Q3’11

DRA Re-engineering of Intel Material business continuity planning process Q2’12

DRA Innovative modeling of Material Flow to Optimize IHS Quality Q3’15

Intel Achievement Award for enabling 800M cost savings qualifying Honeywell

WORK EXPERIENCE

2/08 to Current: Technical Program Manager

Responsible for all materials transfers from ATTD to ATGM and ATM. Worked with stakeholders and implemented a robust materials risk assessment tool and process review in all platform meetings rev-49 to LEC. Worked with substrates, PSMT, IHS, passives/actives sockets and carrier/tray commodities ensuring closure of all med/high risk items prior ATR across all platforms. MRA review process is also used in Malaysia starting with FCMB3 platform. Established material transfer meetings to the VF and MED reviews at the VF ramp MRC across the platforms leveraging ATTD substrates and PSMT/IHS teams to ensure knowledge transfer. Through the zero excursion WG drove reviews of all platform materials risk -49 to ATR, closure of any med/high risk material issue and CE improvements of three top equipment focus areas (CSAM, ICOS and IHS LM). Worked across the commodity and factory engineers identifying a technical roadmap, and providing direction to increase the technical skills of the factory engineers/integrators. Co-chaired materials technical network influencing the direction of all materials commodities; improving the technical visibility and influencing across materials. Co-chair of Q1 2010 materials/TME conference. Expanded role to influence materials selections and decisions in the pathfinding space from rev-400 to -100. Influencing all assembly materials across all technologies. Co-led the BCP After Action Response to the Japan Crisis. Managed the Honeywell IHS program which enabled 356Million dollars in savings by enabling technology at a second source.

8/06 to 2/08: Assembly TCT Project Manager

Responsible for creating and managing the assembly pathfinding roadmap. Integrate the process area, equipment and materials roadmaps and deliver core pathfinding assembly technologies synchronized to program milestones. As the assembly technical lead align and set priories for cost savings, FLI stress reduction and form factor reduction projects. Also identify assembly nodes where there are significant shifts in assembly technology that impact multiple areas. Technical lead for demonstrating feasibility of material, process and equipment for key projects. Assembly process invention disclosure reviewer and TMG Patent Committee Member recommending dispositioning on all Assembly process IP. Safety Leadership Representative since 2005. Owned and managed Plan 2007 expense and capital budget for Module Engineering (17M total budget). Taught 5 Assembly Packaging Processing Course sessions in 06-07.

7/05-8/06: CAM Area Manager

Third level Area manager for first level interconnect development in package assembly. Led a team of 28 ATD engineers and technicians developing and delivering all CPU desktop, server and mobile chip attach technology. From July 05 until July 06 simultaneously led the spray task force. Team delivered and was recognized with a divisional recognition award for developing the first chip attach spray material, equipment and process which enabled the certification of the server platform in Q2’07. CAM area responsibilities included training, integrating and developing 21 new hires, the team was responsible for all equipment, and process and material development in the chip attach area. Key deliverables included automated PCS installation across all 3 NGCAM links, SnAg reflow profile development to meet IMAX requirements, process improvements to meet 1% TU targets with Pb-free solder, and ULT inline capability.

7/04-7/05: NUF Dual Core GL and CAM Group Leader

Group Leader for the NUF dual core process development. Led a team of 9 ATD/ATCED engineers delivering initial NUF dual core Algona samples. Aligned with the small die TF key learning’s, built GRC samples with 100% yield and recommended a NUF dual core process to the NUF TF. July ’04 took over the CAM module and as dual core technology was realigned to CAM (chip attach module). Managed 14 engineers and technicians. Also set the expectations and aligned 9 EIT’s from Costa Rica, Cavite and Penang. In charge of delivering the chip attach process across 8 Platforms and transferring the technology to in Intel Virtual Factories around the world.

2/04-5/04: Intel Corporation ATD, Technical lead for NUF Systronics Oven supplier development in Germany

Selected as technical lead for Systronic oven supplier in Germany to deliver a “showstopper” oven for the no-flow underfill program. Lead a team of 13 engineers and technicians from the ATCED and ATD groups setting technical direction, daily priorities and resource deliverables. Reviewed the NUF process requirements and ensured the oven met the technical requirements of the procurement spec.. Oven shipped WW21’04 per original committed schedule meeting agreed upon procurement spec. technical requirements.

3/00-7/04: Intel Corporation ATD, X60 and 1262 Materials Integrator/Manager

Responsible for managing 3 technicians, Engineer and ATD metal development. Led all supplier polymer and solder thermal interface material, heat spreader and sealant integration issues in development in ATD and virtual factories across CPU and server technologies. Responsible for timelines and deliverables of supplier selection and certification. Worked with material suppliers, material engineers, module engineers and platforms to drive resolution of all process, testing, and evaluation issues. Developed patent and team lead for cold form Indium in IHS with 25M ROI identified. Cold form technology aligned with thin die thin thermal interface technology and is capable of producing a 25um, 1 mil thick perform.

5/99-2/00: Intel Corporation, Sr. Materials Packaging Engineer

Promoted to position in Assembly Technology Development leading a team of twelve engineers evaluating AlSiC and Copper heat spreaders for the INT2 and OLGA2 programs. Led the AlSiC supplier to Rev-49 development until Copper material selected as primary candidate. Managed the Copper heat spreader team to technical certification of Japanese supplier in 23 weeks. Team recognized for outstanding accomplishments supporting Cascade and Olga2 ramps.

Lead the Gigamine thermal interface material development team. Identified thermal interface materials to meet component and system requirements. Managed the material testing, evaluation, selection and supplier availability to meet startup in six weeks. Received ATD Divisional Recognition Award and by OPSD for “Demonstrating exceptional personal and professional commitment to ensure Intel’s first 1Ghz processor”

4/97-4/99: Intel Corporation, Sr. Material Quality Engineer

As part of CSMO’s Plastics group, served as team lead over 7 Intel engineers qualifying injection molded components, ultrasonic welding and post ops process using ATD methodology. Recognized with ATD development award for DS2P Cartridge Design Improvement Lowering Technology Certification and Product Launch Risk. Team Technically certified Slot 2 plastic cover assembly program. Implemented BKM’s that have allowed transfer to second supplier 8 weeks earlier and with 50% reduced headcount. As part of cross-functional team drove and qualified changes in P2XP cover tooling that saved Intel $1.75 M over the life of the slot 2 program. Established training programs, metrics, and debriefs program for Kulim materials transfer engineering team. MED used as assimilation BKM for CSMO MQE’s.

3/95-4/97: Samsonite Corporation, Advanced Development Engineer

Lead cross functional team of purchasing, design and manufacturing engineers specifying, and developing thermoplastic resins to meet design requirements saving $500,000/yr in 1996. Also developed improved tape, water borne and pressure sensitive adhesives. Responsible for supplier certification, and quality specification development. Technical contact for over 20 material suppliers. Supported plastics departments with process improvements, and production troubleshooting. Performed C-Mold to optimize tool, and part performance. Completed Ziegler Miller Frontline Leadership Training.

9/93-3/95: FKI Automotive, Materials Engineer

Evaluated material in plant and specified alternate resins for $575,00/yr savings. Worked on Neon park and turn, headlamp bracket, Toyota door handle, Ford Van License bucket. Also evaluated and implemented alternate headlamp adhesive for $200,00/yr .cost savings. Retooled and debugged the Honda Accord door handle. Worked with Honda, Toyota, Chrysler and Ford. Materials utilized include topcoats, BMC, Silicones, Polylcarbonates, PC/ABS, Nylon, Acrylic, PBT/PC, propylene, Polysulfone, PBT.

8/92-9/93: Donnelly Corporation, Materials Engineer

Responsible for developing and patenting adhesive to bond PVC to glass for production of single sided encapsulation used on Chrysler Minivan. Product won design of the year 1996 Detroit. Developed process and design for bonding hinge directly to glass, removing mechanical link for flush glass appearance. Worked with suppliers improving PVC grades to meet Chrysler, Ford and GM’ material specifications. Presented to Chrysler Sr. Designers developments in acrylic glazing.

8/89-6/92; Dow Chemical Company, Research Engineer

In charge of equipment and operation of two-inch lab scale film line, ten-inch pilot plant film line controlled with CAMILLE, Cryogenic Grinder, an pilot plant reactor to make PBO in 95% acid solution. Supervised two technicians, and a technologist, and met all government deliverables of film and powder. Studied the cause of defects in PBO based molecular composite films. Produced the first good quality void free film with greater than 2 million tensile modulus.

7/88-8/89: Dow Chemical Company, Engineer

In processing applications group designed and built high temperature resin transfer molding equipment for processing new BCB materials on time and within $600,000 budget. Worked with the pilot plant evaluating the physical and composite properties of scaled up resins. Responsibilities included processing equipment design for fabricating new resins, safety, data acquisition, and process control programming of the equipment with Camille. Responsible for supervising a technician, summer intern, and new hire. Recognized with Dow Chemical Research Award for Resin Transfer Molding Process Development for BCB-Diketone.

6/87-7/88: Dow Chemical Company, Engineer

First year complete four assignments in a RAP (Rotational Assignment Program). In the Barrier Resins and Fabrication Division, determined the effect of compounding polyethylene and Saran on the blends rheological properties. Compounded samples and measured effects of shear segregation on the processing of Saran. Determined PE can increase processing window without adverse effects on film properties.

In the processing Fundamentals an Applications group, evaluated microlayer coextrusion as a means to make barrier containers. Fabricated parts and evaluated physical properties. Proved multilayer EVOH, PE barrier containers could be used to contain Alcohol; Technology licensed by Dow Chemical.

Working for the membranes group in Walnut Creek CA, studied the phase separation of three-component Generon solution used to make oxygen nitrogen separation membranes. Determined the temperature shear rate dependence of the phase separation and related results to the pilot plant optimum operating conditions, resulting in increased plant production.

In the Automotive TS&D group, determined compatible paint coatings for mass ABS. Coordinated fabrication of test panels, testing at paint manufactures, and satisfying OEM requirements. Worked with GM, Ford and Chrysler to align on test material and methods. Data published to identify paint systems and ABS grades meeting automotive performance requirements.

9/86-5/87 Chemistry and Physical Chemistry Lab Instructor and Tutor

For one quarter taught 75 freshman chemistry students lab (3 classes/qtr), tutored weekly. For 2 quarters taught physical chemistry lab, graded reports and tutored (2 classes/qtr).

5/85-9/85: Summer Intern General Motors

Determined test methodology for measuring coating stress and collected data on 13 Epoxy and Urethane encapsulates for circuit boards submerged in gas tanks. Worked with electrical engineers on circuit redesign due to overheating of 2 capacitors. Validated 2 material candidates met the stringent performance requirements for the gas tank circuit boards. Recommended cure conditions to minimize coating stress.

5/84-9/84: Summer Intern General Motors

Studied the effects of regrind on the mechanical properties of DuPont’s Acetal-copolymer. Mixed samples with a statistical history of material injection molded 1-12 times. Molded test samples, measured notched izod, tensile, flexural and impact properties. Determined the Acetal impact properties are over 80% degraded with the addition of over 10%. Results correlated to Acetal co-polymer gears cracking with the addition of large amounts of regrind. Enabled the addition of sprue and runner regrind for a materials costing $2.80/lb; estimated savings 500k/yr.

PAPERS/PATENTS

51 issued patents in packaging materials and processes.

Presented to the Board of Directors General Motors Sept 1985 S. Houle “ The effects of regrind on the mechanical properties of gears molded from Acetal-copolymer”

Presented to the Society of Rheology Oct. 87 S. Houle, Meissner ‘A rheological Investigation of the Flow of Polymer Melts into a capillary Die”.

SAMPE April 1991, “High Temperature and High Performance Diketone-Bis-Benzocyclobutene (DK-Bis-BCB)/Graphite Fabric Composites.

23 Internal Confidential Reports Dow Chemical, 7 Internal Confidential Reports Donnelly Corp.

At Intel 120 Patent Disclosures, 48 patent filings, 51 patents issued, 20 trade secrets, 18 publications.

Patent 1994 ‘Vehicular Panel Assembly Method and Apparatus for Making”

Flush Glazing HVM process developed launched on 1996 Chrysler minivan, and won “Product Invention of the Year” in 1996 Detroit Auto show

IATTJ 1999, “EMI Solutions for Slot 2 Processors-Performance Product Development Risk and Cost”, Sabina Houle, Kim Merley, and Ian Roe

IATTJ 2007, “Spray Flux Process, Equipment, and Materials Development for Chip Attach”, Sabina Houle, Anna Prakash, Hari Ramanan, Xiaorong Xiong, Valentina Dimitrova, Christos Economopoulos, Nitin Deshpande and Mike Colella.

A. Nallani, X. Xiong, G. Kostiew, C. Congo, C. Loh, M. Lam, S. Houle and C. Rumer, “Development of Next Generation Technologies for Improved Die Side Component Assembly, Inspection and Rework Processes,” Intel Assembly and Test Technology Journal (IATTJ), Process Technology, 2007, vol. 10

Presented during Women at Intel Network in Malaysia March 2008 “ Navigating Your Technical Career”

IMEC 2010 paper and presentation “Assembly Materials Development and Ramp Management Methodologies to Enable 126y Ramp Excursion Reduction by>80%”.

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