Engineer Design

Name: Mostafa Fard

Address: Nashua, NH.

Email: *******@*****.***

Tel: 603-***-****

U.S. Citizen

EDUCATION: B.S.E.E. (Honors) Boston University

INDUSTRY EXPERIENCE:

Board, System, and Software/Firmware Level Design, Development and Engineering Management of Telecommunications, Data communications, Medical and Industrial Products.

I have practical experience with all aspects of product development from the conceptual phase to the manufacturing release. These skills include but are not limited to:

-Design Architecture

-Product design (Product Manufacturability, Quality, and cost minimization )

-Product Specifications

-Hardware/Software Specifications

-Creating products test and verification plans

-Hardware/Software test and debug

-All necessary communications with hardware, software, firmware, mechanical, manufacturing, marketing, sales departments, and outside vendors.

-Multiple Projects management (Time lines, Budgets)

The designed products consisted of: (Analog,digital, mixed signal design)

8-bit to 32-bit embedded processors, including Intel 8051,8086, Intel RISC (80960) processors, Motorola (Freescale) Power PC (MPC860,824x) controllers, Variable Frequency Dives(MOSFET), LCD, TFT and OLED displays/controllers, RS-232, I2C, SPI Interfaces, DDR memory interfaces, A/D-D/A, VCO, TI TMS3205XX DSPs, PCI bus bridges, ATM, SONET, DWDM and Gigabit Ethernet chip sets(XAUI), 802.11 chip sets, EPLD's (Altera 7K Series, MAX PLUS II, QUARTUS), Altera, Xilinx FPGAs (Spartan,Virtex)

These designs utilized:

Orcad, Cadence(Concept HDL,Allegro), P-Spice, ViewLogic (View Draw), Altium, DxDesigner schematics capture and PCB layout tools(PADS), Altera Quartus II, Modelsim, and AutoCAD design tools

Programming Languages in: C, Pascal, Fortran, and Assembly including writing diagnostics code for testing and board bring up.

Tools: MS Project, MS Word, Excel, Frame Maker, Visio, Powerpoint, UNIX, MatLab, LabView

Experience with clock distributions, signal integrity issues in high-speed designs,

Telco Standards, Standard communication protocols (HDLC, Ethernet.) Medical

Products design and standards,(IEC601), Microwave and RF design.

Familiar with CE, UL, CSA requirements. RoHS compliance

RF Integration, Inc. (Contract) Billerica, MA. 4-2016 to 7-2016

Senior Hardware Engineer

Hardware design and development of controller boards for a navigation/guidance system.

These high speed boards (100-300GHz) provided power and clock distribution circuitry as well as controls for the entire system. The design utilized Altera FPGAs(VHDL), high precision VCO,DSP,and RF interfaces. Cadence tools were utilized.

EMC Corp. (Contract) Hopkinton, MA. 8-2015 to 11-2015

Senior Hardware Engineer

Hardware validation and verification of power circuitry for networking and storage products. Design of a midplane board for storage products. Cadence tools were utilized.

Liberating Technology, Inc. (Contract) Holliston, MA. 1-2015 to 7-2015

Senior Hardware Engineer

Hardware and firmware design and development of medical devices (MyoElectronics, Scoliosis) based on PIC32 microcontrollers. These designs included boost and buck power circuits, navigation, mems based pressure and temperature measurement and USB communications. Labview and ORCAD tools were utilized. Programming in C, assembly, and Python.

Lighthouse Imaging Corp. (Contract) Windham, ME. 1-2014 to 6-2014

Senior Hardware Enginee

Design and development of a board for a medical imaging system. This system utilized a SOC based on Xilinx FPGAs(Zynq-7K) and ARM Dual core Cortex A9, MIPI Chip sets, dc-dc power boost circuits, and Giga bit Ethernet connection. Design with isolation devices for IEC 60601 EMI.

Secure Care Products (Contract) Concord, NH. 6-2013 to 9-2013

Senior Hardware Engineer

Hardware and firmware (Assembly and C) design and development of a microcontroller PIC32 based security device. The Orcad schematics capture and PADS layout tools were used.

Safran Systems (Contract) Manchester, NH. 11-2012 to 3-2013

Senior Hardware Engineer

Design and development of a digital video processing system. This design utilized SOC and PIC32 microcontroller devices. The Altium schematics capture and PCB layout tools were used.

Goodrich ISR Systems (Contract) Westford, MA. 2-2012 to 7-2012

Senior Hardware Engineer

Development of avionic systems. System level integration of power and sensor components. Assembly procedures and documentations utilizing DxDesigner, ORCAD, and AutoCAD tools.

BAE Sytems (Contract) Hudson, NH. 7-2011 to 12-2011

Principal Engineer

Design and development of a system with Altera Cyclone FPGA devices and microprocessors. This project utilized the Cadence and Allegro tools.

LightHouse Selection (Contract) Manchester, NH. 2-2011 to 4-2011

Principal Engineer

Evaluation, test and modifications of existing product firmware in “C: and assembly based on the Microchip PIC16/32 devices. This project utilized the Microchip IDE and

Hi-Tech software compilers.

Elbit Systems of America (Contract) Merrimack, NH. 11-2009 to 2-2011

Design Engineer, Medical Products

Designed and developed AC/DC power distribution system for a medical product.

Designed and developed NMR and Microwave (30-36GHz) sub-systems for the above medical product. Designed and developed controller boards utilizing OpAmps, DACs, ADCs, motors, sensors, pumps, valves, etc. Utilized LabView for hardware controls.

Created detailed design description documentations/test procedures for these projects.

SUN Micro Systems (Contract) Burlington, MA. 10-2008 to 11-2009

Design Engineer

Design and development of controller cards for SUN storage systems. (SAN)

The 6 GHz SAS2 designs including backplanes were based on ARM technology and they were implemented utilizing Cadence design tool sets.

Hardware/Software integration testing for multiple Hard Disk Drives. (HDD)

Also created hardware specifications and test validation plans for the above designs. Familiar with SATA, SAS1-2, and SCSI storage Area networking.

Olympus NDT (Contract) Waltham, MA. 6-2008 to 10-2008

Design Engineer

Design of hardware and firmware for none-destructive Array Inspection test equipment.(NDT) Modified the existing TI DSP code to exercise the hardware upgrades in the new generation of products. These products consisted of Xilinx FPGAs, TI3205XX DSPs, and analog calibration circuitry. Created test documents for the manufacturing/environmental testing.

Valeo/Raytheon Systems (Contract) Hudson, NH. 10-2007 to 6-2008

Systems-Design Engineer

Update and completion of the Hardware – Software Interface Specifications for the

Multi Beam Radar Sensors. Creation of the environmental test procedures for multiple sensors conditions for temperature, humidity, voltages, etc.

Reviewed the sensor pwb schematics. Troubleshot sensors for HMI drive issues based on the given radar telemetry data and made the necessary design modifications.

Participated and monitored the sensors environmental testing including thermal shock for high/low temp., humidity, and vibration testing. Reviewed, updated existing LabView source code for CAN messaging to improve test performances. Utilized MatLabs tools.

Nortel Networks (Contract) Billerica, MA. 5-2007 to 10-2007

Design Engineer

Created hardware design specification and designed a Control Processor card for Nortel’s Ethernet Routing Switch. This design consisted of local MPC8548 (at 1.33GHz) bus as well as PCIe bus, I2C bus, SERDES, and Gig-E interfaces. The design also contained Broadcom Gig-E switch fabric devices, USB drivers, CF, and FPGA/CPLD devices. The schematics capture was accomplished with Cadence design tools.

Instron Corporation (Contract) Norwood, MA. 1-2007 to 5-2007

Project Lead/Design Engineer, Projects management (Time lines)

Designed a front panel controller for the Instron frame system by researching and selecting Keypad and display technologies and the schematic capture using Orcad tools.

This design was based on the FreeScale S08, 8-bit micro controller core, scanning keypad inputs and communicating with the main frame and an OSRAM OLED display module.

Burk Technology Nashua, NH. 2005-2007

Hardware Engineering Director/Lead Design Engineer

Developed and managed the projects for the remote control products for the radio and the television transmissions stations from concept to manufacturing.

-All necessary communications with hardware, software, firmware, mechanical, manufacturing, marketing, sales departments, and outside vendors.

-Internal and External Staff and resource Management

-Project Team Building and Multiple Projects management (Time lines, Budgets)

-Product releases to manufacturing

These products utilized Atmel 8051, Coldfire processor, digital/analog circuitry, GPS and CAN messaging. Altium schematics capture and PCB layout.

DaVinci Technologies Corporation Bedford, NH. 1991-2005

Engineering Manager (8 years)/Lead Design Engineer

-Design Architecture and Hardware/Software Specifications

-Product design ( Product Manufacturability, Quality, and cost minimization )

-Creating products test and verification plans

-Hardware/Software test and debug

-Project Team Building and Multiple Projects management (Time lines, Budgets)

-Product promotions by means of communications with existing and potential customers including international sales and marketing channels

Designed and developed telecom and networking products for startup and established companies. The following is a partial list of the products and technologies developed:

- A wireless (802.11b) data acquisition system based on the Coldfire microprocessor, local SDRAM, and Broadcom BCM53XX. Wi-Fi router device.

- A multiport 100 BASE-T and Gigabit Ethernet module. This module utilized MMC Gigabit Network packet processor devices,MII,and interfaced to the backplane of the system. Xilinx Virtex FPGA with Embedded Core Memory was utilized for CAM and FIFO functions in Verilog. - Trunk Modules for T1/E1, and OC-3/OC-48 lines.

WANG LABORATORIES, Inc. Lowell, MA. 1987-1991

Designed and developed ISDN BRI,PRI,T1,E1,Ethernet and Token Ring controllers for WANG servers. These products utilized INTEL 80C188, 80386SX processors, Communication peripherals, DRAMS, SRAMs, and EPLDs.

TEKELEC, Inc. Lexington, MA. 1986-1987

Designed and developed ISDN Basic Rate(2B+D) Interface for a voice/data product.

TELEX COMPUTER PRODUCTS, Inc. Norwood, MA. 1984-1986

Designed and developed desktop printers and display terminals.

MEMODYNE CORPORATION Needham, MA. 1981-1984

Designed and developed thermal printers.

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