CURRICULUM- VITAE
A. P. KIRAN E-mail: acw2dq@r.postjobfree.com Mobile: +91-903*******
L E
CAREER OBJECTIVE:
To seek a Challenging and Successful career in the field of Surface Mount Technology by keeping abreast with the latest technical advancements, which will enable me to offer the best of my professional expertise and drive atmost job satisfaction.
WORK EXPERIENCE:
PpppppppppppppppppppppppppppppppppppppppppppppENCE:
Worked as a Quality Assurance (Electrical) Engineer in ANSP, DEFENCE RESEARCH & DEVELOPMENT LABORATORY (DRDL) Kanchanbagh, Hyderabad from March 2014 to April 2016.
Having experience in SMT (Surface Mount Technology) Process Development Engineer.
Worked as a Astra Microwave Products Ltd, Hyderabad as a SMT Production Engineer from Oct 2012 to Oct 2013.
Worked as a Consultant from Aug 2010 to Aug 2012, Electronics Corporation of India Ltd (ECIL), Hyderabad as a SMT Production Engineer which is a leading production unit of Electronic Voting Machines (EVM).
1 Year Experience as a Graduate Engineer Apprentice(GEA) in Electronics Corporation of India Ltd (ECIL), Hyderabad from 10th Oct, 2008 to 9th Oct, 2009.
JOB PROFILE:
Experience in Quality Assurance inspection, missile integration, material handling, production operations and process improvements. Adept at supervision, co-ordination and managing the day-to-day and round the clock plant requirements for operation and maintenance.
Experience in SMT Process Development where my duties include:
PRODUCTION:
1. Programming of SMD components assembly on various types of PCBs using
Pick and place machines.
2. Stencil programming for different types of PCBs.
3. Running production.
4. Maintenance of SMT machines.
5. Setting of thermal profile in re-flow machine.
QUALITY CONTROL:
1.Maintaining of output record.
2.Feedback to designer wherever applicable.
3.Maintaining of quality output.
4.Soldering inspection.
JOB RESPONSIBILITY:
Inspection and testing of cable harness and electronics sub-systems for ground, flight and underwater systems.
Conducting functional and ESS (Environmental Stress Screening) tests for various electronic and electrical sub-systems & unit level as per JSS 55555, JSS 0256 and MIL-STDs.
Prepares the Job cards, Flow charts & Route cards.
Monitors Productivity.
Monitors process for achievement of production target in the projects.
Arrangement of people for different projects.
Stop the production in case of Non-Conformance.
Co-ordinates Corrective & Preventive Action for Operators Faults.
Co-ordinate of people for different projects.
Preparation of records related his department.
Responsible for the operation of high speed chip and fine pitch placer like my data machines.
Ability to Identify and understand component value and correct feeder size and setup list flow up latest revision. Setup SMD material to the correct feeder and setup the feeder to the machine with the correct safety manner without any wrong polarity and wrong location.
Setup SMD component to the Feeders (like MY DATA) automation machine.
Ability to read and understand MPI (Manufacturing Process Instruction) or Bill Of Material for parts reference.
Hand-load any kind of SMT electronics component perfectly with correct polarity & orientation.
Handle all High dollar value parts (such as BGA, Fine pitch) high precaution and very carefully with right parts & right Polarity.
Record correct information on the setup list
All alignment check and monitoring the machine placement
Work with re-flow oven
Efficient in Programming, Operating and Preventive & Break Down of
a.Generation of CAD file using GRAPHIC CODE (GC) Power place as offline programming.
b.Efficient in handling surface mount machinery:
a.Solder paste application machine using screen/ stencil
S No
Make
Model
1
REPRINT
R29spectrum
2
DEK
Ela
b.Pick and Place machines
S No
Make
Model
1
MYDATA
MY9 -01nos
MY9E -01nos
MY100sXe -01nos
2
EUROPLACER
Express20 -02nos
Vitesse -01nos
c.Re-flow soldering machines
S No
Make
Model
1
VITRONICS
Soltec XPM820
2
HELLER
1809EXL
Strong exposure to thermal profile settings in re-flow machines.
Inspection of BGA Assembly using X-RAY inspection station.
EDUCATIONAL QUALIFICATION: Q
UALIFICATION:
B.Tech (2003-2007) in EEE from Chruch Institue of Technology, JNTU, Hyderabad.
Intermediate (Board of intermediate A.P.), from Vandana junior college, Hyderabad (2001-2003).
Standard Ten (S.S.C Board) from Valerian Grammar School, Hyderabad (2001).
ACAEMIC PROJECT DETAILS :ACA
DEMIC PROJECT DETAILS:
Underwent a project on ELECTRICAL POWER GENERATION AND DISTRIBUTION IN AIRBUS A320 at Indian Airlines Limited, Hyderabad, Andhra Pradesh.
TECHNICAL SKILLS :TECHNICAL SKILLS:
COMPUTER SKILLS : MS Oficce, Window XP, Window 98, Vista, win7.
PROGRAMMING LANGUAGES : C-LANGUAGE, JAVA(done course from NIIT in
the year 2008).
STRENGTH:
SNGTH:
Willing to learn new concepts.
Hard working.
Confident.
Diplomatic
LANGUAGES:
LANGUAGES:
Can fluently speak, read and write English, Hindi & Telugu.
EXTRA CURRICULAR ACTIVITIES: E
XTRA CURRICULAR ACTIVITIES:
Playing cricket at college level
PERSONAL DETAILS: PER
SONAL DETAILS
Name
A. P. KIRAN
Date of Birth
26th Oct 1983
Gender
Male
Nationality
Indian
Marital Status
Single
Present Address
H.No:20-53/1, Venkatapuram, Trimulgherry, Secunderabad,Pin:500015
acw2dq@r.postjobfree.com
DECLARATION: DECLARATION:
I hereby declare that the information furnished above is true to the best of my knowledge.
Place : Sec’bad.
Date : (A. P. KIRAN)