Lisa DiFruscia

** ***** **.

Manchester, NH *****

Cell: 1-603-***-****

acvxux@r.postjobfree.com

PROFESSIONAL SUMMARY

I am a Process Technician with 30 years of experience in the semiconductor and crystal growth, and

manufacturing fields. I have served as the Lead Technician for 7 of those years. I’m highly skilled with all

aspects of programming, inspections, process loading/unloading, monitoring, and documentation. Additionally,

I have operated a wide range of manual & automated equipment.

NanoComp Technologies, Inc.

Merrimack, New Hampshire

2014-Present

Final Process Technician-Floater:

NanoComp is the sole, worldwide producer of carbon nanotube based sheets, tapes, and yarns. It

produces strong, lightweight, conductive solutions for use in automotive, space, aviation, and defense

department applications. Responsibilities include:

• Perform the final processing chemical treatments, precision measuring, cutting, mounting, and quality

inspections of carbon nanotube based sheets.

• Operate nanotube production furnaces which produce very strong, light weight, and highly conductive

carbon fibers (Yarns).

UltraSource

Hollis, New Hampshire

2013-2014

Process Technician-Floater:

UltraSource is an industry leader in thin film circuits and interconnects. It serves customers in the

avionics, military, fiber optics, wireless, medical, industrial, and semiconductor markets. Responsibilities

include:

• Perform substrate chemical Etching process through the use of phosphorous & sulfuric acids and

hydrogen peroxide.

• Use of machine dicing saws to slice substrates to standard and specialized tolerances depending on

customer specifications.

• Operate precision Starrett measuring machine to ensure substrates meet customer requirements.

• Ensure proper handling and packaging is performed in preparation for customer shipments.

Appli-Tec Advanced Thermoset Solutions

Salem, New Hampshire

2012-Present

Process Technician-Floater:

APPLITEC is a leading provider of adhesives, sealants and encapsulants to the aerospace, computer,

defense, microelectronics and medical industries. Responsibilities include:

• Machine slicing of Thermoset Casting Blocks into individual wafers to meet customer specifications.

• Perform dimension inspections of finished wafers and ensure they are air and contaminant free.

• Perform polymer potting and encapsulation applications on customer electronic connectors.

• Ensure proper inventory management is maintained to include; Lot traceability, categorization, proper

packaging & storage, and prep-for-shipments.

Advanced Renewable Energy Company (ARC-Energy)

Nashua, New Hampshire

2011-2012

Process Technician:

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ARC-Energy manufactures and markets an innovative Controlled Heat Exchange System (CHES) along

with a patented process that grows sapphire crystal along its c-axis plane to be used specifically for LED

applications. Responsibilities include:

• Raw sapphire inspection. Raw material weighing and staging.

• Loading raw material into CHES chambers in accordance with precise recipes.

• Enter and monitor process set points throughout a 3 to 4 week growth process.

• Perform process adjustments to reach an extremely critical melting stage with a +1mm tolerance level

(also known as SEEDING).

• Unloading grown crystals and performing pre-inspections of the completed product (i.e mapping cracks,

bubble belts, grain boundaries, contamination, etc.).

• Provide training to new Technicians and Customers.

• Use of precision measuring tools.

• Minor and major component replacement.

Microsemi

Lowell, Massachusetts

2008-2009

Wafer Fabrication Technician/Inspector:

Microsemi offers a wide range of semiconductor solutions for: aerospace, defense and security;

enterprise and communications; and industrial & alternative energy markets. Responsibilities included:

• Operated in, and comfortable with, ISO 9000 Clean Room Environment and Safety policies.

• In charge of 16 Diffusion furnaces: programmed recipes; monitored processes; monitored various gases

& gas mixtures; unloaded, inspected, and measured wafers to specific standards utilizing an

Elipsometer.

• Trained to perform the Chemical Etching process to dissolve unwanted materials from the quartz

wafers.

• In charge of 4 Anneal furnaces: programmed recipes; monitored processes; monitored gases & gas

mixtures; unloaded, inspected, and recorded process steps.

American Superconductor

Devens, Massachusetts

2007-2008

Process Technician:

American Superconductor provides superconductor cabling and wiring for use in networking renewable

energy systems. Responsibilities included:

• In charge of loading, programing and monitoring 11 separate Sputtering Deposition systems: CHA (5);

Silver IVI (1); Gold IVI (1); and PA Anneal (4).

• Performed cable/wire inspections utilizing the Filmetrics Measuring Transfer Station.

• Performed conductivity testing utilizing the Mechanical IC Testing station.

• Trained in chemical mixing, use, and safe HazMat disposal.

Ophir Optics Inc.

Woburn, Massachusetts

2006-2007

CNC Polishing Technician:

Ophir is a market leader in the production of precision infrared (IR) optical components and complex IR

lens assemblies for the defense, security and commercial markets. Responsibilities included:

• Employed Germanium Baikalon slurry solutions coupled with various polishing machines to hone

optical lenses to meet military grade specifications. Experienced with Speed Fam, PII-3LA, and X-

ENA LOH polishing machines.

• Experienced with the Zygo Laser Metrology machine used for precise depth measurements.

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• Utilized various precision calipers, vernier calipers, and gauges to inspect and ensure the polished

optical lenses met exact radial standards.

Luminus Devices Inc.

Woburn, Massachusetts

2004-2006

Wafer Fabrication/Process Technician:

Luminus Devices Inc. develops LED technology for use in commercial flat screen televisions and

commercial & industrial lighting fixtures. Responsibilities included:

• Hired as the shift Lead Technician in charge of supervising 15 personnel.

• Supervised the operations of 14 separate systems including: Thin Film Photolithography machines (5);

Sputtering machines (3); Etching machines (3); Bonding machines (2); and Laser Lift-off machine (1).

• Experienced with the following system-specific machines: MRC and CHA (Sputtering); STS, Unaxis,

Unaxis Versa Line, and VII (Etching); SUSS and SUSS 6E (Bonding); and JPSA Chromacel (Laser).

• Experienced with Thin Film Deposition of the following metals: Ti-Au; Ti; Au; AuSn; and SiOx

• Managed all incoming and outgoing Quality Assurance Inspections of Integrated Circuits (ICs).

• Intimately familiar with, and adept at enforcing, ISO 9000 Clean Room Environment and Safety

policies.

• Trained in chemical mixing, use, and safe HazMat disposal.

Xan3d Technologies

Merrimack, New Hampshire

2003-2004

Wafer Fabrication/Process Technician:

Xan3d Technologies Inc. (now Cubic Wafer, Inc.) designs and develops Hybrid Integrated Circuits and

Multi-functional 3D Integrated Circuits for use in consumer electronics, digital, wireless, and data

communications. Responsibilities included:

• Hired as the shift Lead Technician in charge of supervising 15 personnel.

• Supervised the operations of 19 separate systems including: Microscopes & calibrated Elipsometer

measuring devices (5) Etching machines (3); Thin Film Photolithography machines (2); Sputtering

machines (2); Coating machines (2); Aligner machines (2); Spinner machines (2); Lapping machine (1);

and Anneal furnace machine (1).

• Experienced with the following system-specific machines: Nikon L200 (Microscope); Sharon

(Sputtering); Oxford Plasma Lab 80 (Etching); Karl Suss MA-8 (Aligner); RC-8 (Spinner); Logitech

PM5 (Lapping); and RTA (Anneal furnace).

• Experienced with Thin Film Deposition of the following metals: SiNx, Pd, and Au on GaAs wafers

• Managed all incoming and outgoing Quality Assurance Inspections of Integrated Circuits (ICs).

• Performed data base entries utilizing SPC Chart and QSI software systems.

• Intimately familiar with, and adept at enforcing, ISO 9000 Clean Room Environment and Safety

policies.

• Trained in chemical mixing, use, and safe HazMat disposal.

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M/A-Com Technology Solutions Inc.

Lowell, Massachusetts

1998-2003

Wafer Fabrication Technician:

M/A-COM Technology Solutions Inc. (M/A-COM Tech) provides high performance analog

semiconductor solutions for use in wireless and wire-line applications across the radio frequency (RF),

microwave and millimeter wave spectrum. Responsibilities included:

• Responsible for the operation of 12 separate systems, including: 6 Thin Film Photolithography (Stepper)

machines; 3 Photoresist Coating machines; 2 CHA Sputter machines; and 2 SiNx & Nitride Etching

machines.

• Performed incoming and outgoing Quality Assurance Inspections of Integrated Circuits (ICs).

• Operated in, and comfortable with, ISO 9000 Clean Room Environment, practices & procedures.

Raytheon

Andover, Massachusetts

1984-1998

Wafer Fabrication Technician:

Raytheon is a global leader in American defense contracting. Raytheon develops military grade RF and

semiconductor solutions for use in: Missile Defense; Intelligence, Surveillance &Reconnaissance; Precision

Engagement; and Homeland Security. Responsibilities included:

• Required to hold a “Secret” security clearance.

• Responsible for the operation of 17 process machines, including: 8 Diffusion machines; 6 Chemical

Vapor Deposition (CVD) machines; 2 Anneal furnaces; and 1 LASER Scriber.

• Performed incoming and outgoing Quality Assurance Inspections of Integrated Circuits (ICs) to meet

military grade specifications.

• Operated in, and comfortable with, ISO 9000 Clean Room Environment, practices & procedures.

• Performed data base entries utilizing Oracle and Promise program software systems.

• Trained in chemical mixing, use, and safe HazMat disposal.

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