Arul, Geetha

MSc in MEMS (Microsystems engineering/Nanotechnology)

Q 45 lonetree ct Q Milpitas CA 92128 Q

acvxgo@r.postjobfree.com Q 858-***-****

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Engineer with advanced technical skillset, including 4 years of

experience as R&D scientist in Microsystems Engineering (Semiconductor

industry, nanotechnology, Wafer FAB) and 1 year of experience as

system engineer (Human resources)

Proactive, multitasker with valuable exposure to recent trends in

semiconductor manufacturing and techniques used in a semiconductor

process environment. Able to work together with researchers,

technicians and engineers to produce high quality components in

accordance with project standards with limitations of process window

and timeline.

Q Nanotechnology Q Assembly &Packaging

technology Q MEMS fabrication and Process technology

Q Micro/nano metrology Q Failure analysis

Q SMT packaging & metrology

Q Cleanroom (Lithography and process techniques)

Q WAFER FAB

technical skills

Device fabrication

Two Photon (3D) Lithography, Colloidal lithography, Clean room

experience: Photo-lithography, lift-off process, Plasma etching,

Electroplating, Chemical vapour deposition, Physical vapour

deposition, Oxygen-Plasma etching, Micro milling, Microfluidic print

head fabrication, Self-assembled monolayer

Measurement and Characterization

Atomic force microscope (AFM), Scanning electron microscope

(SEM/EDX), X-ray fluorescence(XRF), Scanning acoustic microscope

(SAM), Shadow-moire, Dye and Pry, Ersascope, White light

interferometer, Surface plasmon resonance spectroscopy (SPR), X-ray

reflectometry, C3 corrosion analysis, Contact angle measurement,

Ellipsometry, pressure measurement of microfluidic channels.

In-situ and Post-experimental analysis

Wafer bonding: BGA analysis- cracks,delamination,

Dye and Pry technique, post-bonding analysis. Micro-nano Polymer and

metal structures, Repeatability & Reliability issues,, Failure

analysis

Simulation and analysis software

M3D software for analysis of Photonic crystals, Voxel structure in

3D printing, Nanoscope and WSxM for AFM imaging, CMM- GRR,

MeterPro for White light Interferometer, Lumerical FDTD solutions

for Diffraction analysis, Mold flow simulation for injection

moulding

EDUCATION

Master of Science in Microsystems Engineering (MEMS)

10.2009

- 10.2013

University of Freiburg, Institute for Microsystem technique (IMTEK),

Germany

Bachelor of Technology in Electrical and Electronics Engineering

07.2004 -

07.2008

SASTRA University, India

work history

Flextronics International Inc

Milpitas,

California, USA

Failure Analysis Engineer - Quality and Metrology group

09.2015-

Present

. Failure analysis in semiconductor packaging

. Working in metrology/electronics manufacturing of wire bond

flex BGA, chip in package, system on chip (SoC), sensor

devices(GMR)

. FA techniques such as SEM,XRF, C SAM, Dage X ray, AFM, FTIR,

Interferometer, Shadow-moire, C3 corrosion, other metrology

equipments

. Problem solving capabilities focusing on package and die/wafer

level analysis to determine root cause of failure

. Familiar with standard tools for SPC ( MiniTab Basic) and

presentation

. Experience with Zeiss CMM, Dye and Pry, cross sectioning,

parallel polishing and delayering techniques, SPI,AOI.

. Document and report failure mode and failure mechanism findings

to the Customers, engineering and manufacturing departments

R&D scientist

IMTEK, Germany

Department of microassembly and packaging, Department of

construction and connection technology

Process optimization and characterization of a novel micro-scaled

silver sintering paste as a die-attach material for high temp and

power

08.2014- 01.2015

Reliability of Flip-Chip Technologies for SiC-MEMS operating at 500

C 05.2013 -

09.2014

Failure analysis of silver based micro contact bumps (Si3N4

substrates)

Investigation of stability and electrical performance of contact

material, DYE/PRY technique, SEM, vibration and shock analysis

Surface metallization by PVD process (10-20 micrometer) in DBC

substrate

Silver paste printing (stencil printing) and removal of air pockets

by in house vacuum pump

Pressure assisted sintering under quasi-hydrostatic conditions

Destructive testing to determine adhesive strength and analysis

using SAM,SEM

Laboratory for Process Technology, IMTEK, University of Freiburg,

Microfluidic sample extraction with an integrated pressure

measurement for medical applications

Milling of microfluidic system in PMMA and sealing with ultrasonic

bonding

studying surface hydrophobicity for efficient sample extraction

Analysis of pressure across microchannels and documentation of

results

Chemistry and Physics at Interfaces, IMTEK, University of Freiburg,

Tailor-made nanoantennas for surface plasmons induced topography

change in polymer films

. Design and fabrication of an optical micro actuator for nano sized

particle movement

. Study of surface plasmon generation at metal dielectric interface and

topographic analysis of photosensitive layer

. Fabrication of metal nanostructures using Two photon lithography and

colloidal lithography

. FDTD simulation to determine the micro actuator performance parameters

Laboratory for MEMS Applications, IMTEK, University of Freiburg,

Development of an adaptive production process for high efficient

solar cells

Screen printing of wafers and post processing to remove solvents

Fabrication of Pipejet for nanoliter dispensing of test fluids

Assistant systems Engineer

Tata Group Ltd, India

Devised the project plan, budget and risk minimization models,

executed and monitored system enhancement models in a multi project

environment

First level support for all the critical issues, Business issues,

Release and configuration issues, Browser issues.

Organize and manage customer oriented events and sales campaigns and

interacted constantly with the clients for further enhancements

Capstone projects

Cleanroom - Manufacturing of MEMS "On Chip" Micro heater device

Fabricated and characterized the micro heater chip on silicon

substrate

Worked in Cleanroom - fabrication processes like Lithography,

Etching and various techniques

PECVD, PVD, CVD, Reactive Ion Etching, Lift Off and electroplating

were used.

Measurement techniques using Profilometer, Ellipsometer for

topographic analysis

Surface Analysis Lab at Chemistry and physics of Interfaces

. Thickness of hydrogel coatings Ellipsometry and X-ray reflectometry

. Contact angle measurement - determination of surface energy using

zisman plot

. Adsorption of blood proteins on surfaces using SPR

RECENT ACHIEVEMENTS

Certificate of excellence within 3 months of joining Flex.

CONFERENCES

Fabrication of metallic nanostructures for surface plasmon induced

topography changes in polymer films, A. Geetha-Loganathan, T. Knig,

J. Rhe and S. Santer, DPG, Spring Meeting, Mar 2011, Dresden.

[pic] [pic]

Surface plasmon induced topography changes in photosensitive polymer

films, A. Geetha-Loganathan, T. Knig, J. Rhe and S. Santer, IMTEK

research day, July 2011, Freiburg

01.2013 -10.2013

03.2010 - 07.2012

09.2008 - 11.2009

12.2009 -11.2010

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