TEJAS C KONDE

Address: **** **** ******, *** ****, Detroit, MI 48201

Mobile: 682-***-****

Email: acvp6j@r.postjobfree.com

EDUCATION:

M.S. in Mechanical Engineering (CGPA 3.5/4)

B.E. in Mechanical Engineering

Associate in Mechanical Engineering

University of Texas – Arlington

University of Pune

Maharashtra State Board of Technical Education

May 2016

May 2014

May 2010

CERTIFICATIONS:

Six Sigma Yellow Belt April 2016

ISO 9001 QMS Auditor Feb 2016

Electronic Packaging May 2016

WORK EXPERIENCE: John Deere India Aug 2010-July 2011 Technical Trainee (Engine Assembly Department)

Assembly of various major engine components.

Worked on SAP system for production planning.

Responsible for implementing 5S, Six Sigma and TPM Achievement: Instrumental in modifying the assembly line which helped in bringing down the process time and increase production rate.

PROJECTS:

Analysis of shock absorber using aluminum and copper as spring materials: Model meshing using unstructured grid with tetrahedral element, static structural analysis using ANSYS Workbench to determine the deformation and equivalent (Von Mises) stress for Shock Absorber. Different materials are used to compare the results.

Design and manufacturing of conference vendor cart: Conference Table shaped Vender cart model design using PRO-E, Static Structural analysis using ANSYS Workbench for failure. Modification of Bicycle by attaching carriage similar to conference shaped table on both side of Bicycle, Performed field testing.

Working of Transaxle and Hydraulic braking system: Fabricated a cut section of assembly of Transmission system, Differential and Front axle and gave it a drive by using electric motor through reduction gears box.

Effective cooling of Microelectronics packages-compact model: Thermal analysis of PQFP (Plastic Quad Flat Pack) packages using ANSYS Icepak to modify the board and simulation using ANSYS Icepak to reduce the temperature from 70 C to 32 C.

Fluid flow and heat transfer characteristics of cross-cut heat sinks: Flip Chip BGA package model design in ANSYS Workbench using quarter symmetry, Accelerated Thermal Cycling (ATC) test is performed for single cycle in the range -40 C to 125 C and results are obtained for stress strain distribution in Solder Balls. SEMINARS:

Stealth technology used in modern day warfare

Advanced composite materials used in aircrafts

Lead free solder joints

SKILLS:

CATIA V5

ANSYS Icepak

Auto CAD

MS Excel

MS Word

MS PowerPoint

Hyper Xtrude

PRO-E

EXTRACURRICULAR:

Organized various technical and non technical events at university level Highly motivated leader as well as a team worker

Quick learner with excellent oral communication

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