Engineer Sales

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Professional Summary

Five years working experience in Taiwan. Following that, I migrated to California to broaden my skillset in Silicon Valley in 2007, As of 2016, I hold over fifteen years of experience in the industry of Information Technology with a strong background in engineering and business management. Professional Experience

Super Micro Computer Inc. (USA) 2014 – 2016

Purchasing Manager

• Made improvements in the new SAP/CRM system and workflow in the team to increase efficiency

• Engaged the company’s warehouse team to control the company’s inventory and production lines to ensure safety inventory levels particularly during hot seasons

• Fostered and solidified the relationships between Asia vendors and Super Micro Computer Inc., leading to greater flexibility to meet company’s demand

• Fostered and solidified the relationship between the Taiwan and Europe branches

• Staff Recruitment and provided training for new recruits, ensuring proper assimilation into the company

• Managed the purchasing team regarding tasks such as purchasing order, sourcing, planning, cost saving, project management and product promotion. Major products include the chassis for servers, storage, and embedded systems, mechanical parts, power supply, and power distributors. Cooler Master USA Inc. (US/Taiwan) 2003 – 2014

R&D Engineer, OEM Sales Engineer (FAE), OEM Account Manager

• Obtained and managed OEM/ODM projects from customers, provided engineering and sales services at front side with customers directly. Customers are leading firms from several industries (telecommunications, Cloud storage, gaming, sever, embedded etc.), starting as early as the designing and engineering stage of the business

/NPI.

• Obtained thorough knowledge of the cultures and operations of global IT companies, EMS and component suppliers

• Achieved annual sales revenue for the USA OEM/ODM accounts to USD $10 M in total, and project hit rate more than 90%. Maintained current customer/business and found new customers with new business.

• Involved in sales and marketing for PC related retail products in the US market; achieved the highest sales rate in 2013.

• Developed professional communication skills with respect to the global business networks of Cooler Master and the company’s supply chain

Kaihsiung Chang

170 Parc Place Drive, Milpitas, CA 95035

Phone: 510-***-**** E-Mail: ***********@*****.*** 2

Chung Ting Corporation Industry (Taiwan) 2002 – 2003 Engineer in the Equipment Designing Department

• Honed professional skills with regards to the designing of industrial equipment used in power plants, incinerators and construction sites

• Designed and processed the flow analysis and simulation for both fire and air condition in traffic stations Pacific Electric Wire and Cable Co. Ltd. (Taiwan) 2001 – 2002 Engineer in the Communications Department

• Specialized in research and design for fiber optics and cables

• Research and design on mass production process

• Designed improvements for factory operation processes

• Designed more effective communication and network systems

• Prepared the bidding for public construction projects i.e. 3G mobile phone systems, SDH system, DWDM system and XDSL system

Qualifications

National Cheng Kung University (Master of Science) 1997 – 1999 Major in Engineering Science

Yuan-Ze University (Bachelor of Science) 1992 – 1997 Major in Mechanical Engineering, Minor in Industrial Engineering & Management Northwestern Polytechnic University (MBA) 2008 – April 2017 Still attending for weekend class

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Patents & Publications

Patents of Utility

Pipe Connector of Water-cooling Heat Sink Device 1 March 2005 – 20 May 2014 Country of Patent: Taiwan

Patent Number: M258335

Coupling Connector for Unify Fluid Cooling Cooler 14 July 2004 – 13 July 2014 Country of Patent: Germany

Patent Number: 202004010967.0

Water Cooling Type Heat Radiator Pipe Joint 3 June 2004 – 2 June 2014 Country of Patent: China

Patent Number: 706878ZL200420066968.6

Publications

Reliability of IC Controller National Cheng Kung University, Taiwan The purpose ofthis study is to understand the manufacturing process, structure and reliability of the IC chip and its package, focusing on the effect of high temperature on the IC chip and its package, and explore the properties of Laser, applying “The Moiré Interferometry” as an experimental method to study the distribution of thermal strain during a thermal cycle.

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