Albert Holliday

Phone: 215-***-**** Cell: 215-***-****

acunzu@r.postjobfree.com www.linkedin.com/in/alholliday

*** ***** **** *** *********, PA 19047

Senior Manufacturing/Product and Quality Engineer with global CFT experience in Research & Development, Lean Manufacturing, Product Development, Compliance Testing, Supply Chain Management and Business Transformation of a diverse product portfolio. Awarded 5 U.S. Patents. Subject Matter Expert in product design, hardware and process development, test and implementation in support of current and future product initiatives.

SUMMARY:

Engineering Program Management Quality Assurance

Research & Development Lean Manufacturing Supply Chain Management

Manufacturing & Assembly Cross-Functional Team Leader HW Compliance Testing

Circuit Pack Design/Assembly Continuous Improvement Global Teaming

Route Cause Corrective Action Complex Problem Solving Telecommunications

End-to-End Product Development LASER Electro-Optics Self-motivated

WORK EXPERIENCE:

Innovative Technology Distributors (ITD), Edison, NJ

Sr. Manufacturing Engineer, Design and Integration Services 3/2014-6/2015

-Led complete HW design verification, staging, Lean Manufacturing, assembly, Supply Chain interactions and Quality Assurance for full datacenter and telecom central office products. Customers included AT&T and ALU.

-Developed, improved and implemented Lean Manufacturing, Continuous Improvement processes and operational support for the integration of CORE transport, network resources, database and web servers.

-Lead Engineer responsible for assuring that ISO9001 requirements were met for the integration facility. This included maintaining, creating and updating process flow diagrams, monitoring and developing processes while improving them when possible. Participated in internal and external audits and resolving customer complaints.

Alcatel-Lucent, Murray Hill, NJ

Sr. Product Engineer (DMTS - Distinguished Member of Tech. Staff) 12/2006-7/2013

-Developed and implemented lower cost, higher reliability, industry standard hardware for core network elements.

HW Physical Design and Industrialization (HPDI) team member accountable for Product Rationalization and North America Region (NAR) industry requirements compliance and Continuous Improvement.

Lead Engineer responsible for Network Equipment-Building System (NEBS) environmental compliance testing. This was needed to sell equipment into the U.S. telecommunication market.

Successfully developed and executed a test plan for Pb-free Assembly Qualification and Test Requirements for Printed Wiring Board Assemblies for the ATCAv2 platform.

Compliance was required prior to signing a $20M Alcatel-Lucent product contract with AT&T.

-Lead HW Engineer for Common Cabinet Look and Feel (CCLF) initiative. Facilitated weekly team meetings with 30 Business Division (Program Management, Supply Chain, and global technical experts) to develop ALU Industrial Design Standards and Guidelines. Standardized ALU cabinet portfolio from 60 product-specific to 6 global cabinets. Reduced overall cost and time to market of new products. Authored corporate standards.

-Conducted cross-functional product design and manufacturing process reviews to maximize the use of common parts for cabinets, chassis, fan trays, circuit packs, etc. Reduced costs, waste, inventory and time-to-market.

Lucent Technologies, Holmdel, NJ

Sr. Hardware Engineer (DMTS - Distinguished Member of Tech. Staff) 1/2002-11/2006

-Pioneered the telecommunications industry-wide hardware standard, Advanced Telecommunications Compute Architecture (ATCA), within the PICMG organization. This introduced COTS HW and SW to the telecom industry.

-Member of Supply Chain Networks (SCN) - Advanced Technology and Platform Core team influencing the end-to-end (E2E) supply base and product teams with HW Make vs. Buy decisions. Supplier interactions included conducting road-mapping meetings, resolving supply related issues, evaluating HW and provided feedback.

-Coordinated, maintained and operated a centralized HW/SW interoperability, development and test lab.

Lab reduced development costs and time to market for New Product Development.

-Represented SCN on a task force that developed the Process Management Architecture (PMA) that transformed the process of how new products were developed using Lean principals and drove capital efficiency.

Hardware Systems Engineer (MTS - Member of Technical Staff) 9/1996-1/2002

-Member of the Virtual Engineering Group that had responsibilities for leading design teams in developing Lean methodologies and implementing software that enabled concurrent analysis of the impact that package selection, PWB design and assembly processes have on system size, cost, and yields.

Reduced product design time, assembly cost, time and overall product time to market.

-Process Engineer responsible for Design-For-Manufacturing (DFM) implementation within manufacturing locations for -design anywhere/build anywhere- and Continuous Improvement philosophies. Included assembly/repair process development, running DOEs, SPC, first article inspection and supplier interactions.

-Advanced Assembly team lead responsible for R&D, circuit pack design, assembly, development and implementation of new packaging technologies for production facilities worldwide.

Subject Matter Expert in Printed Wiring Board design/manufacturing that developed AT&T design rules and guidelines for BGA and CSP technologies.

Helped lead transfer of internal PCB assembly to Contract Manufacturing worldwide.

-Developed Corporate PWB design standards, validated second level attachment reliability, developed assembly processes to support and deploy the technology. Reduced cost and improved quality.

ADDITIONAL EXPERIENCES:

AT&T, Princeton, NJ

Senior Manufacturing Engineer (MTS - Member of Technical Staff)

-Flexible Manufacturing Group - Developed a SW model for simulating Kaizen production operations of high volume low mix / low volume high mix circuit pack assembly lines. Maximized assembly production.

-Worked as consultant to GE on the Strategic Defense Initiative (SDI) manufacturing assessment program.

-Served as government facility security officer in charge of clearances for local employees.

Development Engineer

-Vision Systems Facilities Development - Development and support of manufacturing equipment (Line Scan Vision System, Laser based - defect repair and welding systems) for internal deployment including final equipment setup, quality assurance, installation, customer acceptance and training.

-LASER Studies Group - Worked with all types of LASERs as a tool mainly in the area of semiconductor-processing. Other work included alloying and surface heat-treating.

EDUCATION:

M.Sc. Eng, Manufacturing Systems Eng., RPI (Rensselaer Polytechnic Institute) [Honors] Troy, NY

B.S.E.E., Drexel University [Honors] Philadelphia, PA

PROFESSIONAL ASSOCIATIONS:

-PICMG Standards, ATCA, ATCA300, AMC and MicroTCA sub-committees

-SCOPE Alliance, Alternate Board Member

-JEDEC, IPC and EIA committee member: development of Industry Standards on Ball Grid Array packages

US PATENTS:

-US6993238 B2: Routing of Optical Fiber that Exits from the Front of Circuit Boards in an Electronic Shelf

-US6043876 A: Method and Apparatus for Detecting a Solder Bridge in a Ball Grid Array

-US5955683 A: Method and Apparatus for Detecting a Solder Bridge in a Ball Grid Array

-US5417577 A: Interconnection Method and Apparatus

-US4726677 A: Autofocused Lightguide Preform Profiler

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