Summary of Qualifications
Natural inventor/engineer with 30+ years’ experience designing building factories for high volume fully automated assembly, test and burn-in of high-end integrated circuit packaging modules. Broad range of experience with unique perspective integrating Electrical and Mechanical Engineering. Strong speaking skills developed through giving speeches in
energy, sustainable transportation and water. High mechanical aptitude and proficient with
computer aided design tools – ProEngineer, Creo II, BobCam, CNC, FEA, UNIX, Cimcad, Cadds 4X, Mechanica, Unigraphics, SolidWorks, Cura 3D Printing
Patents that apply to thermal escape from microelectronic packages, tested die and hybrid modules:
Patent #5,367,766 - Ultra High Density Integrated Circuit Packages Method
Patent #5,369,056 - Warp-Resistant Ultra-Thin Integrated Circuit Fabrication Method
Patent #5,369,058 - Warp-Resistant Ultra-Thin Integrated Circuit Fabrication Method
Patent #5,446,620 - Ultra High Density Integrated Circuit Packages
Patent #5,592,364 - High density integrated circuit module with complex electrical interconnect rails
Patents that apply to increasing speed performance of microelectronic packages:
Patent #5,475,920 - Method Of Assembling Ultra High Density Integrated Circuit Packages
Patent #5,498,906 - Capacitive Coupling Configuration For An Integrated Circuit Package
Patent #5,550,711 - Ultra high density integrated circuit packages
Patents that apply to manufacturing techniques of microelectronic packages:
Patent #5,236,117 - Impact Solder Method.
Patent #5,475,920 - Method Of Assembling Ultra High Density Integrated Circuit Packages
Patent #5,581,121 - Ultra high density integrated circuit packages molding technique
Patent #5,588,205 - Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
Patents that apply to other than microelectronic packaging and thermal transfer:
Patent #5,873,844 - Method and Apparatus for Numbing Tissue Before Inserting a Needle
Patent #6,194,247 – Warp-Resistant Ultra-thin Integrated Circuit Package Fabrication Method
Patent #6,923,124 - TriTrack Modal Monorail Mass Transit System
Patent #7,127,999 - TriTrack System of Mass Transit
Patent Pending abandoned - Method and Apparatus for Recording Multiple Perspective Images
Patent Pending – Two more transportation inventions from an initial provisional patent for #6,924,123 and #7,1217,999
Patent #6,970,075 - Apparatus for Electronically Programmable Speed Limiting
Patent #7,334,124 - Production Vehicle for TriTrack
Patent #7,497,812 - Interactive Computer Simulation Enhanced Exercise Machine
Patent #ZL200710167087.1System of Mass Transit Cert. Number 942362 China
Others pending including ZoomHydro water delivery invention -- 20 to date
CEO and Product Development Manager : Roane Inventions Inc. and TriTrack Motors Inc. April 1996-present - overlap noted Georgetown, TX
Development of a revolutionary dual mode electric car.
Managed a team of consultants, international suppliers and contractors to develop state of the art embedded systems utilizing the latest in AMD and Intel embedded and mobile
Resume for Jerry Roane page 2
chip sets with Bluetooth connectivity. Production through automated test for the electronics of the TriTrack and ZoomHydro car and WaterBeads. Developed molds processes and tools for pilot production of 50 cars and fabrication of composite Monocoque body.
Established both companies for investment from angel and venture as well as the Texas Emerging Technology Fund. Produced business plans and countless proposals for PPP for transportation and water delivery in the Texas drought. Inventor of the technology and unique manufacturing processes. (see TriTrack.net)
Senior Engineer: Energy Xtreme April 2011 - September 2012 Austin
Development of mobile battery power management applications
Among systems developed were idle reduction units for police cars to power the police computers, light bar and cameras with the engine off for extended periods of time.
Designed circuitry to prolong battery life of the vehicle by taking the load to more advanced batteries as often as practical.
Senior Engineer: Illumitex December 2009 - June 2010 Austin
Development of LED lighting technology.
Designed and built back end set up and clean room operations to build super bright LEDs for the general lighting industry.
Responsible for processes and tooling design for this semiconductor production process. Super fast implementation was the focus
Liaison to the Austin area network of toolmaker shops and supply chain
Design Engineer: 3M July 2008 - October 2008 Austin
Development of optical fiber duct installation system for Verizon demonstration project.
Design of the polymer duct extrusion and the powered application tools-CMD division of 3M sells to the optic fiber installation industry. Tools were fabricated in local shops and in-house machine shops.
New Product Designer: Airborn Interconnect June 2007 - July 2008 Austin
Developed high reliability circular connector series for military applications.
CEO Product Development Roane Inventions April 1996-June 2007 Georgetown
Roane Inventions has integrated its CAD design tools with its complete CNC machine shop to speed time to market. Consulting to a wide array of semiconductor and computer manufacturers around Texas.
Resume for Jerry Roane page 3
Developed embedded devices for the medical and consumer markets.
Managed a team of consultants and contractors to develop state of the art embedded systems utilizing the latest in AMD and Intel embedded and mobile chip sets with BlueTooth connectivity. Production through automated test.
Nearing completion on a real-time control system utilizing Intel style embedded processor. Consulted at Dell managing the product launch of the Bumble Bee small foot print desktop
Set up clean room procedures and equipment for seismic sensors contained in extreme vacuum ceramic hybrid packages. Processes included automatic die and on various multi-chip module and high vacuum sensors micro-machined from bulk silicon. Die bonder, wire bonder, exotic soldering processes and thermal processing profiles. All production equipment was custom designed for these unique die and automated back-end equipment was retooled to handle these die. Bare die test heads were custom designed along with a full complement of analytical diagnostic software.
Design of hard tooling to support clean room processes with extreme tolerances.
Product Development Manager Staktek Corporation August 1990 - April 1996
Designed and developed products for three dimensional memory packaging resulting in a cost-effective solution to very dense computer memory packaging. The products called Stakpaks are 3D stacked memory multi-chip modules that share several common signals. The technology addresses large-scale manufacture and deals with the thermal design problem inherent in multiple stacked memory chips.
Twelve patents cover this technology of stacking molded packages or ceramic packages for extended temperature in military-space (TRW satellite operating in vacuum) applications. Some of these patents cover stacking die inside low cost molded packages with cascading wire bonding with the key design component being how to effectively relocate the heat inside and outside the module.
As the first employee of Staktek Corporation, I was responsible for development of the product components and precision automated production tooling and product movement devices. During my tenure at Staktek we went from investment seed-money to a company of 1,000 US workers producing $15 million worth of memory modules per year. This development included automated test using tray-to-tray test handlers with full custom thermal and contact apparatus on Teradyne equipment.
Machine set up and initial production start up was part of my task because of the developmental nature of the stacked configuration and the delicate structures that the automatic test equipment had to thermally cycle and contact while under memory array testing. Designs include precision lead forming before proprietary impact solder process of my invention. The semiconductor handing and processing equipment and tooling was designed and fabricated under my direction. Precision tooling issues were resolved both on custom designed automated equipment and modifications to other equipment manufacturers machine to adapt to the delicate stacked modules.
Resume for Jerry Roane page 4
CAD Area Manager Span Instruments September 1987 - August 1990
Semiconductor instrumentation design and development
Microcard Technologies Manufacturing Engineering Manager
November 1985 - July 1987
Responsible for the building of a two million dollar manufacturing facility and the capital equipment that produced 20,000 computerized credit cards per day. Microcard was the largest producer of 8 bit microprocessors in the world at that time
Responsible for the equipment development of special flexible die bond and flexible wire bonding. Automated custom robotic test heads programmed each credit card with cardholder’s data with full bank security.
Engineering group manager for the test equipment and handlers. Test heads were designed with cosmetic damage in mind of the fragile flash gold contacts.
Senior Engineer Unidynamics Phoenix March 1984 - November 1985 Phoenix Az
Developed a 68000 system and packaging for demonstration computer to be used as an aircraft ejection seat controller.
Project Engineer Intermedics May 1982 - November 1984 Phoenix Az
Responsible for the mechanical design for manufacture of heart pacemakers and the associated programming computers. Designed the 8mm Quantum pacemaker which at the time was the world's smallest programmable pacemaker.
Product Engineer Mostek May 1980 – May 1982 Dallas Texas
Responsible for the development of microprocessor board level products to the industrial market.
Performed characterization testing of the products for electronic performance under harsh environments.
University of Texas at Arlington BS in Electrical Engineering