Electrical Engineering Engineer

John T. Harms

**** *. ***** **., #**** • Chandler, AZ 85224

H: 480-***-**** • C: 414-***-**** • ********@*****.***

Engineer

Problem Resolution • Troubleshooting • Non-Linear Creativity

Sharply communicative Engineer contributing to high-profile initiatives at Intel, including the transition of an inaugural 14nm production process to high production levels. Quickly learns and productively uses complex new processes, including lithography and dry etch. Seamlessly contributes to various departments through transfers while collaboratively partnering with other engineering staff and stakeholders to achieve corporate goals. Deep interest and training in electro-optics. Usable knowledge of MATLAB, VB, and C programming language. Conversant in German and Japanese (beginner).

Education

Master of Science in Electrical Engineering, May 2012

University of Wisconsin, Madison, WI

Primary area of study: Solid State Lasers

Extensive coursework in laser design, including using III-V and II-VI dopants to improve performance and modulate spectral output, using Matlab as a modeling tool.

Collaborated with the Materials Engineering department to supplement my education with courses on nano-fabrication methods, such as sputtering, ALD and other epitaxial growth methods

Bachelor of Science in Electrical Engineering, May 2009

University of Wisconsin – Milwaukee, Milwaukee, WI

Concentration: Optical Communication

Earned Cum Laude Honors

Excelled at curriculum that focused on EM wave characterization and propagation in optical media

Demonstrated exceptional understanding of fiber optic communication (NA, optical modes, etc.) to be approached for undergraduate research opportunities

Used programs like LabView and pSpice for laboratory coursework

Associate of Applied Science in Electrical Engineering Technology, May 2002

Purdue University, West Lafayette, IN

Spent extensive time in the lab learning and using various test and measurement devices

Learned Design for Test and Design for Manufacture principles as part of overall curriculum

Career History

Intel Corporation, Chandler, AZ 2012-2015

Process Engineer

Impacted the conversion of the first 14nm production process ever to high-volume production levels as a key contributor.

Transferred from the Lithography group to the Dry Etch Group in 2013, quickly becoming a highly productive independent contributor after initial training.

Teamed with maintenance technicians and group leaders to execute engineering tasks and functions.

Learned of semiconductor chip design steps to support communication with representatives from other areas and toolsets during meetings in support of increased production volume of new designs.

University of Wisconsin, Madison, WI 2009-2012

Teaching Assistant

Ranked in the top 20% of teaching assistants based on student assessments.

Fielded questions from students, ensuring their comprehension of designated material.

Performed two lectures per week to maximize student learning during lab assignments.

Select Academic Projects:

Principles and Fabrication of Distributed Feedback Lasers: Presented a lecture on the theory underlying DFB and DBR lasers, their usefulness, and construction method.

Organic Semiconductor Lasers: Explored how organic compounds behave like semiconductors, identified compounds which laze, and summarizing state of the art novel techniques at the time of presentation.

Garbage Can Protector: Design project that resulted in a possibly commercial product that can help guard garbage cans from native wildlife. Managed design, fabrication, testing, and documentation of sensor circuits.

Honors and Societies

Member of Tau Beta Pi and Golden Key Honor Societies

Member of IEEE and IEEE Photonics Society

Eagle Scout earned Feb., 1997

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