Project Design

RESUME

Anuradha.M Senior Specialist

e-mail : *************@*****.*** Mobile: 886*******, 080- 25605501

Career Objective : Place and Route (PD) Engineer

Educational Background : Cadence Certified PG Diplomo in VLSI – Physical Design, ITRI(Industrial Training and Research Institute) Bangalore

Batch : Feb 2016 – April 2016 ;

Completed :BE-ECE

Technical Skill Summary :

EDATools : Cadence SOC Encounter (90nm),Cadence – RTL compiler.

Vinyas Gate Array Tool 3 micron,Solo ES2,Cadence Design Systems 1 micron (Cell Ensemble).

Technology : 90nm

Scripting Languages : Shell Scripting,Perl,TCL

Software Languages : C, C++

Core Competency:

Good Knowledge of RTL to GDSii flow.

Hands on experience with Cadence SOC Encounter 90nm.

Hands on experience with Synthesis (RTL Complier),STA,DFT,,Place and Route .

Knowledge of 45nm technology.

Projects Handled:

Project 1 : DTMF Core

Physical Design implementation of DTMF Core in Cadence SOC Encounter

DTMF Core is Dual Tone Multi Frequency Receiver.In telephone network DTMF is a common in band signaling technique used in transmitting information between network entities.DTMF signals are commonly generated by touch tone telephones.

Description: Design includes 4 blocks including Macros and Standard Cells..The clock frequency is 400mHz.Complexity of the design is 50K Gates.

The Design goes through all phases of Flooplanning,Power Planning, Placement,CTS,Optimization,Routing,Parasitic Extraction,Physical Verification.

Writing Scripting(Tcl) File for P&R flow.

Physical Design is done with Cadence SOC Encounter in 90nm.

Problems Faced:

Problem 1: Macros Placed to the Corners and Std Cell as a cluster

Reports Wire Length and Congestion H&V .

Problem 2: Macros overlapping each other.

Reports- Use default delay limit to 101.

This may result in high fanout nets.

Problem 3: Reducing width and spacing Power Rings

Reports: Power Planner did not generate vertical stripes since stripes merge with rings.

Problem 4. Route (NanoRoute)

Reports:Pin does not have a physical Port.

Power Planner detected wires close to Std cell area.

Pitch- 1.00..for layer Metal 5 – Will cause routing problem for Nanoroute.

Check for the height and metal thickness value for Routability layers in Metal1

DRC Violations.

Problem 5: Detailed Routing

Reports: Stopped b’cos of to many violations.

Problem 6: No VDD VSS Rings, Vertical,Horizontal Stripes.

Report : Warnings like track is smaller than pitch,Routing issues.

DRC Viloations.

Problem 7: When design is not placed ie Empty FloorPlan

Reports: After timing Analysis .

Error:.Design is not yet place

Project 2:

Synthesis implemented using Cadence RTL - Compiler

Project : RISC Processor .

Description: RISC is a control Logic of a RISC processor.This is a small RISC core design.

The design is taken from Sourcing the Verilog file to Generating a Gate Level Netlist.

Synthesised RISC with the tcl script file with all the constraints from the input specification.

The design is synthesized for Low Power . Generated Reports on Timing, Area and Power.

Reports: Checking for Wireload Model, Total Area of RISC design,Timing slack on the critical Path

in top module and subblocks..

Project : Low Power Syntheis - RISC Processor.

The design is synthesized for Low Power with the Timing constraints in the tcl file with low power constraints.

A comparision done with the Normal synthesis and Low Power Synthesis.

Report : generatated .

Area Power Timing slack

Normal Synthesis 682 85625.3 1ps

Low power Synthesis 840 38723.2 0ps

Project 3:

Synthesis of DTMF core .

Description: DTMF Core is Dual Tone Multi Frequency Receiver.

The design is taken from Sourcing the Verilog file to Generating a Gate Level Netlist.

Synthesised RISC with the tcl script file with all the constraints from the input specification.

The design is synthesized for Low Power . Generated Reports on Timing, Area and Power.

Reports: Checking for Wireload Model, Total Area of RISC design,Timing slack on the critical Path

in top module and subblocks.

Low Power Synthesis:

The design is synthesized for Low Power with the Timing constraints in the tcl file with low power constraints.

A comparision done with the Normal synthesis and Low Power Synthesis.

Project 4:

DFT Analysis of ROM BIST .

Description:ROM – Read only Memory .

It consists of 4 Blocks. LFSR,MISR,ROM- input, Compare .Depending on the random generation of 8 bit address in LFSR, data is fetched from ROM- input. Compared with the signature bit in MISR and generates a output.Results are viewed in SimVision waveform.

Title : ASIC METHODOLOGY DESIGN

Organization: Tata Elxsi Ltd,Bangalore

Contribution : Handled RTL-GDSII

flow releases for individual technologies in TSMC .

Flow : TI Pyramid Flow. PrimeTime,Magma,Synopsys .

Organization :Tata Elxsi Client : TexasInstruments –India

Project Leader ; Period :July2001-2003

Title : Layout Design

Description:

Team consists of 15 members. Interaction with TI and team members,Project

discussion,Project allocation,Recruitment,Training in VLSI .

Problems Faced :

All Phases of Project from Member Selection to

discussion,Project allocation,Recruitment,Training in VLSI .

Contribution : Involved in Layout Design and heading the team

Organization :Tata Elxsi Client : TexasInstruments –India

Senior Specialist : Period :DEC 2000 to July2001

Title :Physical Design

Organization II - INDIAN TELEPHONE INDUSTRIES Ltd,Bangalore

Team Leader ; Period : 1991-2000 ; Client : Defence Organization

Description : Handled projects from simulation to Mask Preparation for fabrication. for Defence customers.

EDA Tool : Cadence Tool for 1 Micron Standard Cell Designs –Cell Ensemble

Contribution: As a Team Member, was responsible for the following activities:

* Involved in verification using ES2 FAST simulation.

* Generation of Estimated SDF delay Files.

* Synthesis & simulations of the Verilog modules

* Floor Planning using Cell Ensemble.

* Placement and Routing using Cell Ensemble.

* Extraction of Parasitics with and without SDF delays.

* Simulation with Back annotated Delays.

Project 1: Timetag

Application :Satellite Control Circuits

It is used in control circuits of satellite for the payload at specified intrevals.Maximun of 255 commands can be tagged .Time delay of 0 to 72 hours.On chip command and Delay memory,onchip error correction and detection.

Duration: Three months

Frequency of operation: 1 MHz

Gate Complexity : 35,000 gates

Packaging : 68L pin PGA

Foundry : One micron FAB at ITI Ltd., Bangalore, India.

Hardware operating system : Unix

Project 2:

Skill Programming for Automatic Placement of Layout for Mask shop.

Contribution :

As a Team Member, was responsible for the following activities:

* Involved in writing code in skill Language for Automatic Placement of Layout for

Mask shop.

* Involved in writing code in SKILL Language for Automatic Placement of CD's

(Critical Dimension) for Mask shop.

Project 2A: Diva Command File

Contribution :

As a Team Member, was responsible for the following activities:

* Involved in writing Diva code for biasing of 10 layers for 1micron Technology

Process.

* Sizing done using DIVA command file and generated STREAM IN/OUT.

Verification done in Virtuoso Layout Editor.

Duration : Three months.

Technology : 1 micron Standard Cell design

EDA tool : Cadence (Full suit of Cadence tools)

Foundry : One micron FAB at ITI Ltd., Bangalore, India.

Customer : ITI Limited

Language : Skill language

Project 3: SRAM 1kx4

Duration: Three months.

Frequency of operation: 5 MHz

Gate Complexity : 15 gates

Technology : 1 micron Standard Cell design

Packaging : 18L pin BCE

EDA tool used : Cadence(Full suit of Cadence tools)

Foundry : One micron FAB at ITI Ltd., Bangalore, India.

Operating Frequency : 5 Mhz

Contribution :

As a Team Member, was responsible for the following activities:

* Involved in Floor planning, Placement and Routing

* Extraction of Parasitics with Estimated Delays and back annotated delays.

* Simulation with Back annotated delays

* Generating Composite Field Layout for Mask shop.

* Tape Out in GDSII format.

Project 4: SRAM 2kx 8

Duration : one month.

Access time : 15ns

Gate Complexity : 440 gates

Technology : 1 micron Standard Cell design

Packaging : BCE 24S

EDA tool used : Cadence – Cell Ensemble

Foundry : One micron FAB at ITI Ltd., Bangalore, India.

Operating frequency : 5Mhz

As a Team Member, was responsible for the following activities:

* Involved in Physical Design, Place and Route, Parasitic Extraction.

* Synthesis & simulations with and without SDF delays.

* Generating Composite Field Layout for Mask shop.

* Tape Out in GDSII format.

Project 5: CAM (Comparator Associative Multiplier)

It is used to compare 16bit input data to all the stored data.

It consists of 4 blocks.

Contribution:

As a Team Member, was responsible for the following activities:

* Involved in Physical Design,Floor Planning,Place and Route,Diva parasitic

Extraction,DRC and LVS,Simulation with Back Annotated Delays.

* Generating Composite Field Layout for Mask shop.

Duration : one month.

Frequency of operation: 10 MHz

Gate Complexity : 6,127 gates

Technology : 1 micron Standard Cell Design

Packaging : BGA 120L

EDA tool : CADENCE- Cell Ensemble

* Tape Out in GDSII format.

Project 6: CMUL (Complex Multiplier)

Application : It is 16x16 bit multiplier used in data processing.

Contribution:

* Involved in Physical Design,Floor Planning,Place and Route,Diva parasitic

Extraction,DRC and LVS,Simulation with Back Annotated Delays.

* Generating Composite Field Layout for Mask shop.

* Tape Out in GDSII format.

Duration : one month.

Frequency of operation: 20MHz

Gate Complexity : 7533

Technology : 1 micron Standard Cell Design

Packaging : PGA 144s

Project 7: DFDC

Application: This chip is used in Telecommunication Equipments.

Contribution:

* Involved in Physical Design,Floor Planning,Place and Route,Diva parasitic

Extraction,DRC and LVS,Simulation with Back Annotated Delays.

* Generating Composite Field Layout for Mask shop.

* Tape Out in GDSII format.

Duration : one month.

Frequency of operation: 10 MHz

Gate Complexity : 2k

Technology : 1 micron Standard Cell Design

Packaging : DIP 14

EDA tool used: Cadence – cell Ensemble

Title : Design and development of ASICS for 3micron Gate Array Designs.

Hardware operating system : Unix

EDA Tools : Vinyas Gate Array Tool for 3 Micron

Company : ITI Ltd,Bangalore

My role : Design and Development of Asics for 3 Micron Gate Array Designs.

Project 8: codec

Application: It is an encoder Decoder in the same chip .Used for telecommunication equipments.

Contribution:

Involved in Schematic Entry,Simulation,Verification,Gate Array Place and Route.

Duration : six month.

Frequency of operation: 3mhz

Gate Complexity : 2800 gates

Technology : 3 Micron Gate array Design

Packaging : PGA 64

EDA tool used : VINYAS(Full suit of Vinyas tools)

Project 9:

ALU (8 bit Arithmetic and Logic Unit)

Contribution:

*Involved in Design, Implememtation,Simulation,Verification

Duration : six month.

Frequency of operation: 3mhz

Gate Complexity : 600gates

Technology : 3 Micron Gate array Design

EDA tool used : VINYAS(Full suit of Vinyas tools)

Personal Details :

Anuradha M : DOB : 22-03-1966

Martial Status : Married

Education Qualification:

SSLC : Alvernia Matriculation Higher Secondary School, Coimbatore

Hr Secondary : RKM Sarada Vidayalaya,Chennai

Bachelor of Engineering : Electronics and Communication Engineering

Government College of Technology – Coimbatore

Percentage of Marks : 69.7%

Year of Completion : 1989

Years of Experience : 12yrs

Working Experience : 1991 – 2003

Address For Communication:

No :35, 6 th cross Munnireddy Layout

PWD Main Road .Opp to Nirmal Jyothi Apartment

B Narayanapura,Bangalore :16

Mobile : 886*******

Declaration:

I hereby declare that all the details furnished above are true to the best of my knowledge and belief.

Anuradha m

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