Engineer Equipment

PERSONAL INFORMATION

Name Mohammad A. Dadgar

Address * **** *****, **********, ** 01545

Telephone 508-***-****

E mail *********@*****.***

SUMMARY I am a highly talented process and equipment engineer with 20+ years of experience in the semiconductor industry. I have a wide variety of experiences and skills in the field ranging from the maintenance and repair of tools for the automated equipment used for ETCH/CVD. I have experience as a team leader with great personal and management skills. I have a strong background of aligning teams to meet company objectives while minimizing costs and resources. WORK EXPERIENCE

• D ates (from – to) May, 2012 – July 2014

• N ame and address of employer Global Foundries, Malta, NY

• O ccupation or position held Principal Equipment Engineer Repaired and maintained tools used for the processing 300mm wafers: LAM 2300E5, Flex E Series, Kiyo E Series, Flex D Series, 2300 E4 BST, Mattson/Axcelis Ashers Performed preventative maintenance on tools

Performed trouble shooting activities

Responsible for the overall safety, availability, cycle time, and improvement of equipment

• D ates (from – to) July 2000 – August 2010

• N ame and address of employer Intel Corporation, Hudson, MA (and Chandler, AZ)

• O ccupation or position held Equipment/Process Engineer Maintained and repaired semiconductor equipment: LAM Research Equipment (Metal, Poly, Oxide, W Etch), Mattson Ashers, Gasonics, RCL Novellus Ashers (300mm), Applied Material

(5000/5200/5300)

Complied with duties regarding tool/module ownership: tool PM, troubleshooting, regular monitoring, defect analysis and reduction, safety monitoring, equipment performance improvement, cycle time assessment

Interacted with multiple organizations to drive integrated defect reduction Active member of equipment integration module team Organized and led weekly meetings to discuss equipment/process issues Active member of Working Groups (WG), SLF, High Performance Maintenance (HPM), an Equipment Cost Team

Performed installation and qualification activities on LAM, Gasonics, and RCL Novellus Equipment Trained and certified manufacturing technicians

Performed start up activities in ETCH for new Intel Fab in Dalian, China

• D ates (from – to) July 1997 – July 2000

• N ame and address of employer National Semiconductors, South Portland, ME

• O ccupation or position held Equipment Engineering Technician

• M ain activities and responsibilities Repaired semiconductor equipment: LAM (Metal, Poly, Oxide, W Etch), Gasonics PEP Collaborated with equipment engineering teams to optimize tool operation Implemented cost improvement projects throughout entire Fab Managed unscheduled downtime, MTBF, MTTR metrics, and SPC charts

• D ates (from – to) August 1995 – June 1997

• N ame and address of employer Analog Devices, Wilmington, MA

• O ccupation or position held Equipment Technician

• M ain activities and responsibilities Responsible for repairing ETCH equipment such as: LAM, AMAT 8300/500, Gasonics Asher, Tracks, Dry Strip, and Wet Benches

Worked with vendors to install various equipment in Fab and bring them up to manufacturing/production rates following qualification activities Assessed and implemented safety protocols for tools in the Fab.

• D ates (from – to) June 1987 – August 1995

• N ame and address of employer IBM, East Fishkill, NY

• O ccupation or position held Equipment Engineer (Microelectronics Division) EDUCATION AND TRAINING

• Graduation Year May 1993

• University/College Syracuse University, NY

• Title of qualification awarded Master’s of Science in Electrical Engineering

• Graduation Year May 1989

• University/College Institute of Technology at Utica/Rome, NY

• Title of qualification awarded Bachelor’s of Science in Electrical Technology

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