Technician Professional Experience

Kao Saetern

Skill Summary:

*+ years experience in a technical and manufacturing environment with hardware and software installation, troubleshooting skills, reworks, repairs and assembly.

Experience in with Burn In Ovens and SMT Manufacturing

Building operating systems such as Windows XP/7/8/10 and Linux.

Proficient with networking, wired and wireless and network troubleshooting skills.

Ability to use common machinery, electronics, multi meter, manufacturing tools, soldering and other equipments.

IPC-A-610E certified.

Skilled with using measuring tools such as calipers, micrometers, microscope, and tape measures correctly.

Ability interprets and read blueprints or schematics.

Works well without direct supervision and also can performs great as a team player.

Ability to pick things up very quickly, solve problems, efficient, organized and adaptability in a fast-paced environment.

Excellent communication skills in both verbally and written.

Confident and willingness to learn new procedures and techniques.

Professional Experience:

On Semiconductor 10/2015- Present

Manufacturing Specialist

Processing 100mm 8inch wafers using automated scheme (FE/BE ASH, WET, FUR, ETH, Surfscan, Optiprobe, Lieca, and Sorter) in Etch clean room environment.

Perform weekly schedule Quals and unscheduled Quals for Etch tools.

Create a CADET (Corrective Action Defect Event Tracking System) in case an ILP (Interrupt Lot Process) happened or a miss process occur.

Being able to run high volumes of WIPs and stand for 12 hours of work.

Performing basic troubleshooting, diagnosis, and repair on workstation tools when it’s down.

Documenting any unusual defects or problems occur while on the clock and by passing down to the next shift.

Intel (Contract, ICE) 3/2013– 3/2015

Manufacturing Technician

Operating SMT line in BDL and Validating circuit boards through production floor.

Being able to distinguish between high volumes of bad/good boards with the help of AOI system.

Programming AOI (Photodynamic/Vitrox) tools to catch and place all SMT parts that run through the machine for defects before it pass onto the reflow oven and also perform rework touches if needed.

Creating data spreadsheet in Excel and documenting the built of material for defects.

Performing visual inspection for head on pillow, hand probe and make correction to the circuit boards if needed.

Use Phoenix x-ray to take images to identify sockets or batches of solder defects such as bridging and imaging captures solder voids, defect are then save onto data collection network drives.

Use Javelin Flying prober an automated circuit testing continuity within the requirements to be able to pass.

Use Aegis/SAP software primary for tracking, fixing, and closing defects. And also, uses work stream to view, locate and proc in/out of operations.

Setting up recipes and profile board for Furukawa/Heller reflow oven before and after each builds and perform weekly SPC calibration.

Providing Engineering support to resolve specific issues that may occur during the build or running the SMT Line and help writing updating specs.

Identifying and documenting defects after the components are pulled from the PCB solder ball, using optical microscope DTM/CAM in BTAC lab to record data information for engineers.

SEH America 4/2011 – 3/2013

Senior Operator

Processing 300mm silicon wafers using automated scheme (Hard Laser Mark and Etch) in clean room environment.

Using SPC methods to identify process issues and implementing in-process routine.

Trains employees in using equipments, machine, and processing operation procedures.

Troubleshooting HLM and Etch machine when alarm comes up or machine failure.

Using Proper PPE equipment when working on hazardous chemical baths, performing SG, Cleaning, and Supplying to Ager Machines (Dithionite, NaOH).

Using Microscope to perform daily checks for HLM thickness, scratches, depths, and alignment of the wafers.

Understanding all safety regulations and must be certified when working on each specific tools, machine.

Documenting events that may occur during shift and passdown to the following shift.

Intel (Contractor) 6/2009 – 6/2010

Manufacturing Technician:

Processing 200mm silicon wafers using automated scheme (NES, NVD, NVW, OCR, TG, TSB, DIS, and PHM) in Thin Films, Novellus clean room environment.

Being able to distinguish between high volumes of bad/good wafers in the Fab.

Performing basic troubleshooting, diagnosis, and repair on workstation tools when it’s down.

Documenting any unusual defects or problems occur while on the clock by passing down to the next shift.

Pacific Star Communication 6/2008 – 3/2009

Validation Technician:

Installing Windows Operating system into Pacstar products such as 6200 and 6300 Series.

Must perform and pass manual test on all hardware and software products within given dateline.

Working with Cisco product such as IP Communicator, firewall, routers and switches.

Assist in installing IT hardware, including monitors, network infrastructure peripherals and rewiring cables as required for reconfigurations.

Manually configure IQCore Software user-friendly platform to allow voice, data, and video communication system package function able.

Installing latest updates in hardware and software and make recommendations for modifications.

Flashing modems into proper setting for customers before shipping out and testing all circuit boards.

Install computer components according to the BOM and with the help of schematics.

SUN Microsystems Inc 9/2006 – 9/2007

Electronic Assembler:

Perform mechanical and hardware assembly with the help of schematics and production tools

Using production software for tracking inventory and data collection, Workstream.

Assembling, board configuring, cabling and de-kit servers.

Installing circuit boards, videos, hard drives, memory, and testing Sun’s server.

Attention to detail is a must.

Intel (Contractor) 6/2004 – 1/2006

PC Technician:

Installing desktops and laptops, monitors, and systems for Intel employees.

Imaging Windows operating system onto desktop and laptops.

Make local delivery and pick-ups for all Intel campuses according per customer request.

Complete data migration and closed all open tickets at the end of the shift.

Education:

Heald College, Associate Applied Science Degree in Computer Science.

Portland, OR

Graduated: May of 2004.

Membership in the Phi Theta Kappa Honor Society.

Achieved Dean’s List 6/6 Quarters.

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