Process Engineering

CURRICULAM VITAE

SIVARAMAN. G

Email : actoh4@r.postjobfree.com No: 588, Balaji Nagar,

Ammananthangal Village,

Walajapet – 632 513.

Mobile Phone : +91-954******* Vellore District.

Objective

To reach the zenith of excellence taking up challenges, working in an environment which stimulates professional growth.

Education Summary:

Degree and Year of Passing

Institute / Board

Major and Specialization

% Marks

Diploma in Electrical & Electronics Engineering – April 2005

Bakthavatchalam Polytechnic College, Kanchipuram.

Directorate of Technical Education (DOTE).

Electrical and Electronics Engineering

75% First Class

SSLC – March 2002

Matriculation

All Subjects

73.9% First Class

EXPERIENCE :

Worked as Hardware & Networking Faculty in CSC Institute From Feb 2006 to March 2007

Worked as Process Quality TECHNICIAN in SMILE ELECTRONICS Bangalore from May 2007 to March 2010

Worked as NPI / Process TECHNICIAN in SOLECTRON EMS INDIA Ltd Bangalore from April 2010 to Dec 2010

Worked as a NPI / Process SENIOR TECHNICIAN IN SANMINA-SCI in Oragadam Chennai from January 2011 to July 2013

Working as DFM ENGINEER IN FLEXTRONICS GBS in Perungudi from July 2013 to Till Now

Job Responsibilities in FLEXTRONICS GBS

Creating New Packages using VALOR Software

Using PRO-E Creo for creating New packages

Performing QC process for the New packages

Creating and releasing the Work instructions for Process, Test, Assembly, box build and Packing.

Preparing SOW & SOP for the process

Preparing FMEA and control plan

Preparing for the Internal Audits

Preparing Daily and Quarterly reports

Using 7 QC tools for analyzing the process.

Conducting CAPA(Corrective & Preventive Action) meeting for our Process.

Experience on working with ROHS, WEEE, and REACH and lead free parts.

Taking Time study for each process.

Job Responsbility in SANMINA

Solving all Surface Mount Technology (SMT) Line Issue

Taking Profile for SMT REFLOW OVEN using KIC Software.

Preparing Profile boards for various types of Printed Circuit Board’s (PCB)

Gerber reviewing and stencil modification for mass production models.

Preparing Failure Mode Effect Analysis (FMEA), Work Instructions (Stationary Instruction Chart) for mass production as well as New Product Introduction (NPI) models.

Review and update manufacturing process, procedures and specifications.

Providing TPCN (Temporary Process Change Notice) or PDR (Process Deviation Request) for any Evaluation for New vendor (PCB/New Component).

Launching of new products in assigned process areas.

Investigate problems and assist in developing solutions in order to optimize product

quality, process yield, and/or manufacturing cost.

Leading the Team of SMT & Back End Engineering Quality and Process (EQP) in carrying out daily Engineering functions and Troubleshooting Line defects in SMT & Back End Line Process.

Specialist in SMT Components FAILURE ANALYSIS PROCESS and taking SMT & Ball Grid Array (BGA) Re-work PROFILE

Specialist in Back End Components FAILURE ANALYSIS PROCESS and taking WAVE PROFILE using KIC 2000 Software.

Contact with suppliers to fabricate a JIG/TOOLS for production to avoid Quality Issue in the Line.

Responding to Complaints/Issues from Customers.

Handled “VJ SUMMIT” BGA Rework Machine.

Check Stencil Tension using SEFAR TENSOCHECK METER.

Validating the STENCILS USING PEAKLUPE METER

Generated the new product introduction (NPI) readiness report & coordinated in FMEA activities.

Create process flow charts for identifying system strengths and weakness.

Cycle time reduction done in the process.

Creating and releasing the Work instructions for Process, Assembly, box build and Packing.

Job responsiblity in SOLECTRON EMS LTD:

Running NPI models, Taking Profile for various models

Preparing SIC (Station Instruction Chart) for the NPI Models

Solving Line Issues during NPI Build.

Create process flow charts for identifying system strengths and weaknesses and corrective actions.

Job responsiblity in SMILE ELECTRONICS :

Taking Reflow Profile for All products.

Solving Line Issues.

Monitoring performance of the process flow with process control plan and statistical reports. (SPC)

Generating the Non Conformances reports to the respective departments for corrective actions by internal process quality audit.

Ensuring IPC standards & customer specifications are used to define defects in the line.

Have handled 8D reports.

Software/Tools Used:

Oracle Systems.

GC preview (Gerber File Viewer).

KIC 2000 & KIC Explorer

Valor VLM 4.2

Pro-E Creo 2.0

Machines Handled:

Stencil Printer : DEK.

Automatic Optical inspection : Agilent Technologies (SP50 Series) & DAGE

Reflow Oven : Pyramax & BTU

Rework Machines : SRT

Back End : Wave Machine

Technical Skills:

LANGUAGE : Programming in C.

HARDWARE : Assembling, Formatting, Installation and Trouble Shooting.

Additional Course

Honors Diploma in Computer Hardware and Networking

(HDCHN), CSC – Ranipet.

Cisco Certified Network Associate (CCNA), IECT –Chennai.

Program Logic Control Programming in Allen Bradley, GE Fanuc, Keyence.

ORCAD PCB Designing(Version 16.2)

PCB CAPTURE

PCB EDITOR

P SPICE SIMULATION

Personal Details

Fathers Name : A. Govindaraj

Date of Birth : 03-Mar-1986

Age : 29Years

Marital Status : Single

Language Known : English and Tamil (R&W), Kannada (Speak)

Nationality : Indian

Passport Details

Passport No : J2479207

Date of Issue : 06.12.2010

Date of Expiry : 05.12.2020

Place of Issue : Chennai

I hereby declare that the above-mentioned information is correct up to my knowledge and I bear the responsibility for the correctness of the above-mentioned particulars.

Yours sincerely

(G.Sivaraman)

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