KHORRAM SYED actof1@r.postjobfree.com

**** ********* *****, ***********, ** L5M 0H8 M: (647)448–8950 H: (289)997–0905

EXPERIENCE

Project Manager, Application Engineering October 2014 – Present

Sciemetric Instruments Inc. Windsor, Canada

Managing global team of Application Engineers to develop and commission custom software applications and data acquisition hardware (Digital/Analog IO and control) at major automotive and industrial (off highway) customers’ plants to test and validate engines, industrial and medical equipment

Delivered on 100+ Services projects worth $7-8 Million to install and commission custom software and hardware at customers include Ford, GM, Honda, Caterpillar, John Deere, HP, Medtronic, Boston Scientific

Driving technical engagement with key accounts during pre-sales cycle by leading Apps and R&D teams to demonstrate benefits of Sciemetric technology and devising profitable solutions

Grew John Deere off-highway account by $1M over the course of 9 months through successful execution of Pilot Project which led to winning exclusive agreement for Sciemetric QualityWorx data/process monitoring software at all global plants

Qualifying Software and Hardware Sales Opportunities and reviewing RFQ and RFP with Sales and customers to develop and establish project scope and to ensure technical delivery at increasing profit margins

Identifying new opportunities during project execution and selling upgraded software solutions and engineering services leading to greater customer satisfaction and increase in Sciemetric revenue

Leading overall program success, product development and customer adoption of Sciemetric hardware and software technologies for control and data acquisition test systems

Managing direct reports and in charge of hiring and coaching Application Engineers to support rapid growth in Sciemetric business

Applications Engineer February 2014 – October 2014

Arxtron Technologies Mississauga, Canada

Project lead in design of Automated Test Equipment to test, program and calibrate mission critical electronics including radar sensors, air bag control unit and other electronics for Honda, GM, Nissan and other automotive customers

Developed test applications using C/C++, LabWindows/CVI, SQL software and NI PXI test hardware in Agile environment to implement multi-threaded and parallel programmed systems to validate/test electronics

Developed bench top and platform based functional test for Electronic design verification

Designed interface hardware (HW) electronics and led integration at customer test sites for high volume production testing

Scoped, procured and integrated different test instruments to build industrial test systems in accordance with customer requirements and CSA and other industry electronics standards

Provided front-line customer support including feedback to customer project management and engineering teams to facilitate efficient product design and transition to manufacturing

Commissioned test system at customer sites and provided effective product demonstrations and customer training to facilitate smoother sales process

Product Development Engineering March 2012 – July 2013

Advanced Micro Devices (AMD) Markham, Canada

Project Manager

Coordinated overall execution of Product Roadmap including capturing product requirement and specs and creation of development plan of AMD Chipset and Discrete Graphics IC products

Interfaced with Marketing/Design/HW/SW teams to develop a system test methodology and acceptance test plan to ensure functionality and performance of IP blocks (USB, SATA, PCIE, and Memory) of AMD Chipset and Discrete Graphics products

Reported product milestones and issues to Program Management Office and executive team

Conducted a business analysis of PC/Notebook customer demand to develop and execute product launch strategy to productize AMD chipsets with feature sets as per customer requirements

Maintained a technical relationship with Assembly/Test sites in Asia to ensure seamless high volume production of AMD Chipset products including deployment of test solutions

Developed Test Plan while keeping track of ROI and Project Risk to effectively manage deliverables from different HW/SW technical teams to meet product schedule and quality

System Level Test Lead

Software design in PERL, shell scripts, ruby and C on Linux for high volume customer testing of advanced SoC on automated test equipment (ATE)

Validated new products by executing test cases on new silicon and coordinated triage activities to isolate root cause of failures and worked with HW design and SW engineers to resolve Quality issues in time to meet EVT, DVT and PVT product schedule

Supervised New Product Bring Up and NPI and contributed to FMEA to improve product/process

Reduced production test time by optimizing test coverage/reducing overlap, which resulted in $4M savings in product development cost for 2012

Team Lead, System Integration & Test Oct 2010 – Nov 2011

Flextronics – IMERJ Design (Android Handset/Tablet) Burlington, Canada

Interfaced with test and validation teams globally (US, Europe, China) to drive functional, conformance and reliability test activities of Android Smartphone-Tablet product. Worked with HW and SW platform teams to fix bugs once root cause was determined.

Developed software tests to validate/debug hardware including TI OMAP processor functionality and connected peripherals such as camera, sensors, SAMSUNG AMOLED, HDMI, USB, audio

Led cross-functional team to integrate hardware, debug and resolving technical issues including system software of Texas Instrument OMAP mobile processor, PMIC and baseband ICs

Implemented test infrastructure for RF and power management testing for both GSM and WCDMA bands; mentored junior engineers to execute and report results on a weekly basis in order to update potential carries including AT&T, Rogers, SFR, TMobile

Contributed to hardware bring up during design and manufacturing stages and worked with Firmware, HW and RF engineering teams to improve design of HW and Android Gingerbread SW

Guided firmware team in making changes to enhance software functionality and for work-a rounds when a hardware fix was not possible

Led deployment of test hardware and software for DVT, EVT and PVT validation testing and trained test engineers on test procedure/process and to debug PCB and SMT quality issues

Travelled regularly to development/test sites (Europe and China) to resolve technical and quality issues to ensure design can be manufactured/assembled with a high yield

Supervised Test Labs and main point of contact for Systems Test Software related issues

Integrated Circuit Test Engineer Jan 2010 – Oct 2010

Fresco Microchip Toronto, Canada

Reported into the Application Engineering and Customer Support organizations to ensure customers (Panasonics, LG, SAMSUNG, Sanyo) received fully validated analog demodulator and tuner ICs and supported integration of SoC in customer design of TVs and broadcast systems

Developed RMA process to effectively test returned ICs to determine root cause of failure and taking corrective actions including changes to system software and hardware

Software design of CHARACTERIZATION test program using C, VB, PERL and data acquisition hardware. Suite used to test 12 ICs in parallel over I2C to speed up verification of new silicon to build customer confidence in the pre-sale stages

Design of tests using PERL to verify circuit blocks of mixed signal ASIC. After validating new tests, ported tests to ATE for production screening

Established good relationship with customer engineering teams by efficiently managing test and silicon debug activities and delivering resolutions to issues in a timely manner

Electrical Engineer June 2009 – Oct 2009

Kinects Solutions Inc. (Kinectrics) Toronto, Canada

Developed test plan to validate electrical design of Distribution Transformer Meter (microprocessor based power electronics) for Electrical Power Utility industry

Worked with senior engineer to design and validate circuit blocks including:

oPower Supply to convert 240Vac to 12Vdc

oFilter Design (common mode choke) to pass FCC test and to resolve EMI

Implemented Microchip PIC microprocessor firmware using C language and MPLAB

Carried out surge testing at 4KV & 6KV on prototype

Created BOM, electro-mechanical test fixtures, and test documents for manufacturing

Debugged prototype (SMT & through-hole PCB assemblies) using lab equipment and utilized LabView for running calibration tests as part of design improvements activities

B2B Wireless Sales Specialist 2007 – 2008

Rogers Inc. B2B Sales Campaign Toronto, Canada

Established relationships with new clients by cold calling businesses across Canada and presented Rogers Wireless promotional offers and marketed RIM Blackberry products

Achieved sales of 5X over the sales target with effective use of sales techniques such as up selling & cross selling along with technical knowledge of GSM wireless system

Awarded with 'Rogers B2B Achievement Award' for best in customer quality and sales

Product Engineer May 2006 – July 2007 Actel Corporation San Jose, California, U.S.A.

Improved test methodology by reducing test time on Teradyne and Agilent automated test equipment and increasing final test yield from 60 to 95% by resolving failure modes

Managed and planned Qualification milestones of the Fusion mixed signal FPGA product line (SoC) from bring up through 5 silicon revisions until product was qualified for commercial and industrial use (in accordance with JEDEC reliability specs)

Developed test benches in VERILOG RTL and simulated using Mentor Graphics and Synopsis EDA tools; implemented design in FPGA to study product reliability

Designed and implemented ATE tests to verify circuits blocks of Fusion product line (embedded ARM1 & ARM7) gaining practical experience with Boundry Scan & JTAG

Led cross-functional engineering meetings on development of PCBs for ATE load boards and DFT analysis of JEDEC standard boards (engineering qualification testing)

Performed silicon level failure analysis utilizing liquid crystal and photo emission FA techniques to locate defects at the transistor level and authored failure analysis reports for design engineering explaining root causes such as ESD and electrical overstress

Debugged root cause of PLL failures during 1000 hour Burn-in and Final Test, isolated problem to RC network of analog pins thus preventing a design review and future damage

Electronics Technologist May 2005 – Sept 2005

Mark IV Industries Mississauga, Canada

Tested 407 ETR Transponder, E-ZPass and Motorola RFID products (ICT, functional & RF testing) as part of quality control resulting in lowering of product failure in an ISO 9001 environment

Debugged and replaced PCB components including ASICs and reported errors to engineers so production and design problems can be resolved

Gained hands on experience with SMT technology, soldering and electro-mechanical assembly of PCBs in accordance with IPC and quality standards

EDUCATION

Bachelor of Applied Science and Engineering June 2008

Electrical Engineering University of Toronto, Toronto, Canada

Areas of Study:

oAnalog/Digital/RF Integrated Circuit (IC) Design, Computer Architecture (MIPS, RISC, Motorola 68K), Computer Hardware, Electro-Magnetics, Wireless Communications; Software Programming (C, C++, Java, Assembly, LINUX)

Hardware Design Project:

oDesigned F&I Analog-to-Digital Converter in 180nm CMOS – utilized Cadence Analog Artist for schematic design and simulation

Software Project:

oUsed C to extend functionality of MIPS micro-processor simulator - SimpleScalar

Tools:

oSchematic capture, PCB design, transistor design EDA, MATLAB, Oscilloscope, logic & spectrum analyzer

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