Objective

Seeking position of an Electrical Hardware Engineer in a Company where I would be able to use my knowledge and expertise on Board Level Design and Test that were gained from my career experiences in mobile handsets manufacturers and industry leading wireless SoC chipsets supplier.

Skills

High-speed digital and analog board level design and verification for mobile devices based on CDMA/GSM/WCDMA/LTE architectures and chipsets.

Hardware implementation/verification/validation test with linear accelerometers (ST Micro, Bosch, Kionix), Gyroscope, Magnetometer, Luxmeter, Proximity Sensors

Solid experiences and capability of Analog/Digital audio circuits, Display/Camera with MIPI DSI/CSI-2, effective power management/distribution circuit with SMPS (DC/DC converters), LDOs, and SMBC (Switch Mode Battery Charger) for rechargeable battery powered systems.

Proficiency of PCB fabrication and design constraints (stack-up, impedance control), schematic captures, and layout tools (Cadence, Mentor Graphics, OrCAD, PADS)

Mobile handset/tablet MODEM + Application processor system designing / integration including baseband, memories (DDR, (FLASH NAND or NOR)), power management, RF transceiver ICs

Expertise of FPC (flexible printed circuit board) and Micro-coaxial cable for connectivity.

Experience

Qualcomm Inc.

June 2006 – Aug 2015 Staff Engineer San Diego, CA

Lead HW Engineer

Major role:

oLeading a cross functional individuals (RF/Digital/Power Management) for supporting internal and customers’ projects

oCreating reference design (schematics/layout) of mobile devices including handsets, tablet PC and data modules in order to evolution of Qualcomm chipsets

oAuthoring application notes such as design guide, power consumption data, layout recommendations and etc.

oProviding design reviews (schematics / PCB layouts / Thermal) to internal/external projects

oProviding PDN (power distribution network) simulation for customers’ layouts using Cadence Sigrity

oProviding technical training session to customers

oTravelling factory build supports in either local or off-shore factories with customers’ request

oTroubleshooting and hands on lab activities for HW issues on customers product

oMaintaining and track records of bugs from prototypes to production

Supported Projects

oMDM9615M (CDMA/GSM/WCDMA/LTE/TDSCDMA/TDD-LTE)

oFusion SVLTE (Simultaneous 1x Voice and LTE/DO data)

oFusion CSFB (Circuit Switch Fall Back)

oFusion MSM8655 + MDM9600

oFusion MSM8660 + MDM9600

oFusion APQ8060 + MDM9200

oQSC62x0

oMDM6270

oMSM7200/A

Nokia Inc.

January 2005 – May 2006 BB Hardware Design Engineer San Diego, CA

Design and verification CDMA2000 wireless platform of baseband subsystem in order to Nokia wireless chipsets

Implementing display and camera function on UI subsystem using FPC and micro-coaxial cable (consideration of fabrication process, mechanical, baseband and ESD/EMC/EMI)

Communication and participate with Technology Platform team for Nokia baseband engine roadmap)

Maintain multimedia peripherals (LCD, Cameras) design across all phone projects

UTI Technology Inc.

January 2004 – December 2004 Sr. Staff Engineer Vista, CA

Design and integration industrial LCD monitors (touch screen, sunlight readable)

Analog video (VGA, Composite) to Digital (LVDS, TMDS) conversion board design

Telenautics Technology LLC.

July 2002 - December 2003 Sr. Staff Engineer Vista, CA

Development of a tri-mode CDMA handset

Base-band and IF subsystem design using Qualcomm's MSM5105, IFR3000 and IFT3000

Design and implementation of evaluation jig for software and RF task

Development of external charging adapter

Cyberlane Inc.

February 2001 - May 2002 Staff. Engineer San Diego, CA

Integration of a tri-mode (CDMA 800/1900 MHz, AMPS) mobile base band subsystem

Development of accessories (travel charger, hand-free kit) with OEM vendors

Integration of a module (CDMA 800/1900 MHz) mobile base-band

Development of the evaluation equipment for verification of software and RF performance.

Cyberlane Korea Inc.

May 2000 - February 2001 Staff. Engineer Seoul, Korea

Integration of a tri-mode (CDMA 800/1900 MHz, AMPS) mobile base band subsystem

Development of accessories (travel charger, hand-free kit) with OEM vendors

Hyundai Electronics Industries Ltd., Korea (Current name: SK Hynix Semiconductor Inc.)

February 1994 - October 1999 Sr. Engineer Seoul, Korea

Integration of baseband for dual-band mobile handsets (CDMA 800MHz, 1900MHz) using MSM3K and MSM2K

Evaluation circuit board implementation and support for software regarding hardware requirements and specifications testing based on US PCS standards

PCB layout and design for device placement along with ground and power for optimal RF performance using Zuken CR1000 and Cadence Allegro

Education

UCSD

Currently Master Degree study in progress in Wireless Embedded System

Ajou University

February 1994 Bachelor of Science Electrical Engineering Korea

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