Fatima M. Seiwerth
Island Lake, Illinois 60042
Home 847-***-****
Mobile 224-***-****
Email add: act157@r.postjobfree.com
Career Summary
Experienced in Quality and Process Engineering and New Product development for almost 15 years. Support customer and process improvement and manufacturing issues. Assist and performs quality check audits on suppliers.
Semiconductor knowledgeable . Drives yield improvement, cost reduction and non-value added activity. Leads in offload of New Products to Operation.
Experienced in Electroplating process for more than 11 years with the following Chemistry : Chrome, Zinc, Electropolishing, Anodizing, Tin, Tin/Lead, Sulfamate Nickel, Electroless Nickel and Silver. Technically knowledgeable in troubleshooting plating bath. Defines and maintains quality assurance and reliability of electroplating products. Worked with Technic, Meco, Jessup, RK, Learonal and Acculabs for electroplating machine and chemical suppliers. Handle and control Wastewater treatment for electroplating process.
Knowledgeable in Engineering tools such as FMEA, SPC, DOE, 8D, MSA and APQP, defines and writes specs and documentation for quality and process control. Technical Paper author.
Experienced and a keyplayer for certifications such as TS16949, 5S, ISO1401, ISO9001, NADCAP.
Education
Chemical Technology
Manila Technician Institute, Philippines
Graduated 1990
Bachelor of Science in Chemical Engineering
Technological Institute of the Philippines
Graduated 1994
Masters of Business & Administration (MBA).
University of Baguio, Philippines
Completes 18 units
Recognition & Awards & Certification
Class K License for Waste Water Treatment – Qualified to treat waste water for plating process.
PATENTS :
1 - Patent # TI 60826 – Substrate redesign by introducing double drill process on hanging bump, improved shorted bumps from 10,000 dppm to zero dppm.
2 - NG (No Good) marking design for reject substrate – Pokayoke (foolproof) system for machines to identify the reject substrate and will skip marking.
TEXAS INSTRUMENTS MAKE Member Technical Staff (MMTS)
Awarded for Technical contribution in FCBGA devices for Texas Instruments.
TECHNICAL PAPER AWARD – ASEMEP AWARDEE (Association of Semiconductor and Electronic Manufacturing Engineers of the Philippines).
Awarded to a Filipino Engineer who has consistently formed teams that have submitted technical papers for oral presentation at the annual ASEMEP symposium for 5 consecutive years.
Performed Supplier Audit, Qualification and BENCHMARKING:
Shinko LID Supplier, JAPAN
NTK Substrate Supplier, JAPAN
KYOCERA Substate Supplier, JAPAN
IBIDEN Substrate Supplier, JAPAN
Sheldahl Substrate Supplier, Colorado USA
Benchmarking Activities - Leader for FLIPCHIP Benchmarking
KOREA: Chip Pac, KOREA - FLIPCHIP and Microstar assembly and IQC benchmark.
TAIWAN: Texas Instruments, TAIWAN - Lessons learned and fan out program to Texas Instruments Asian site.
International TRAINING:
Lachat Ionchrom Equipment Training - Milwaukee, Wisconsin, USA
Radiometer Autotitrator Equipment Training - Lyon, France, USA
CMI XRF Equipment Training - Chicago, Illinois, USA
Training & Certifications
TS16949, QS9000, ISO14001, Solder Plate, Poka-Yoke, Advance SPC, Total Preventative Maintenance, Administrative, Chemical Analysis Technical Training, DOE, Plasma Technology, FMEA.
Specialized Skills & Training
Equipment & Machine Handled
Carbon Analyzer, Autotitrator – VIT90, Ionchrom – Quick Chem 8000, Cyclic Voltametric Stripper, Ultraviolet Spectrophotometer, Atomic Absorption Spectrophotometer, Ionograph, Wetting Balance/Dip and Look, Sensadyne, IR Reflow, Hullcell, Couloscope Destructive Thickness Tester, X-Ray Fluorescent Thickness Gauge, CMI X-ray, Rack Plate Equipment with 4 Automatic Hoist, Auto dozing System, SEM/EDX.
Work Experience
Methode Electronics
Rolling Meadows, Illinois, USA Jan 2013 – Sept 2015
Plating Engineer / Lab Chemist
Defined and established SPC, work instruction documentation, productivity trend, First pass yield, XRF and AAS calibrations.
Set up Laboratory.
Perform wet chemistry for all Plating bath, Cleaners and Waste water treatment. (Tin, Nickel, EN, Silver and Powdercoat cleaners) and powder coat solution.
Keyplayer in Electroless Nickel and Silver Plating Setup and process control.
Define Process and technique for all Plating Analysis Solution.
Keyplayer in establishing controls and procedure in waste water system which resulted to zero violation from MWRD.
Defined procedure to ensure good quality for electroplating products. This includes Adhesion, Thickness and Porosity.
Implemented Chemical Auto dozing to replace manual chemical addition and Barcoding - to eliminate human error.
Communicate and work closely with suppliers to eliminate yield problem related to raw materials.
Instrumental in quality test and reject verification on all plating related issues for both internal and external customers.
Perform trainings and qualification for all operators in Plating area.
Treats waste water and interacts with MWRD.
Good Shepherd Hospital 2007 – 2013
Barrington, Illinois, USA
LABORATORY TECHNICIAN (Part-time – 0.5)
Performs laboratory services such as receiving and ordering specimen.
Supports Pathology doctor in performing and completing slides for analysis during open surgery.
Set up and streaks plate for microbiology specimen.
Responsible for Lab Inventory.
Performs and results test such as flu, RSV, stool WBC, hemoccult, and strep throat.
Texas Instruments Incorporated (TI) 1998 – May 2007
TI Philippines Division, Baguio City, PHILLIPINES
FLIPCHIP/GBGA - Backend Process Engineering Section Manager 2000 – May 2007
Instrumental in the Probelek cracking resolution which resulted to 98% improvement of SHORTS, equivalent to $800K (USD)/month in savings.
Championed lid popping resolution. This 100% yield improvement for specific FLIPCHIP device. Zero occurrence after implementation of corrective action
Key player on the die crack reduction for over molded FLIPCHIP package. Estimated PFO $0.48M
Reduced Customer Returns to 75% by improving quality through Quality Improvement Team (QIT).
Supported Texas Instruments FAB site (TI Dallas) to solve the damaged bumps problems; this resulted to $200M savings to TI.
Program Manager for 2 major FLIPCHIP devices for 2003 at TI Philippines, the first smallest die and the first rectangular die for FLIPCHIP.
Successfully closed and zeroed out Customer Complaint at National Panasonic SINGAPORE and in Temic PHILLIPINES.
Supported Sheldahl-Substrate supplier based in Longmont, Colorado, USA for 3 months on plating process problem for Ball Grid Array (BGA) substrate.
Automation program for lead finish process, implemented auto dozing and auto titration for chemical replenishment and analysis.
Overall Facilitator for Post Test Process Engineering Team, w/c covers the LIS and Packing materials for QFP device.
Amkor Anam Pilipinas, Inc. 1995 - 1998
Muntinlupa, PHILLIPINES
Central Lead Finish QA Engineer –Supervisor / Engineer lll
Established and set-up Preventive Maintenance Procedures for analytical equipment.
Championed Lead Finish Quality Control Area Network system to reduce non- value added activity.
A key player in the qualification of new as well as transferred plating equipment.
Key player on MRB audits to ensure a close loop system on all committed action items & to maintain zero customer & internal audit deviation.
Overall in-charge on implementing ISO14001 and QS9000 objective for Quality Assurance and Reliability department that leads to zero deviation during certification.
Nikon Industrial Corporation 1994 - 1995
Valenzuela, PHILLIPINES
Electroplating Process Engineer
Set-up Nickel-Chrome, Zinc and Electropolishing process.
Institute cost reduction by decreasing plating process cycle time without affecting the quality.
Key player on Auto dozing application on Brighteners and levelers for plating solution.
IMF Chrome Inc. 1990 - 1991
Cubao, PHILLIPINES
Quality Control Laboratory Analyst
Instrumental on research and development on clear cladding process
Monitor and control powder coating process.
Key player on converting the Chemical Laboratory into a profit section.
Troubleshoot plating solution problem.
Reference
Ruben Rolda – Texas Instruments Senior Packaging Engineer
Contact# # 469-***-****
Dr. Oliver Kim – Good Shepherd Hospital Laboratory Director
Contact # 773-***-****
Marivie Murillio – Systron Donner Sr Quality Engineer
Contact # 707-***-****
Sheldon Campbell – Methode Electronics - Supervisor
Contact # 773-***-****