Mechanical Engineer Engineering

JIAN TANG MEI

***-** **** *** ****: 516-***-**** Little Neck, NY 11362 ******@********.***

Mechanical Engineer

SUMMARY:

Product design & development of electro-mechanical components, packaging, telecommunication equipment, Simulation and Design of Fabrication and Production. Ability work with customers. Excellent interpersonal skills, Capable of performing FEA on thermal, structure with Pro/E, Creo 2.0, Solidworks 2015, AutoCad 15, ANSYS 14 and IcePak, Inventor 2015.

EXPERIENCE:

Mechanical Engineer, VJ Technologies Inc. Bohemia, NY (Contract) March 2014 – August 2014

Provided technical support, Multipurpose X-Ray detection system integrated design.

Created and developed detection instrument for Homeland Security, anti-terrorist applications, and medical scans.

Responsibilities included documentation, specifying materials for electronic control box & fabrication

Designed parts and assembly using Creo 2.0, Solidworks 2015, AutoCAD 2015 for sheet metal, plastic design, layout work and thermal analysis with heatsink, PCB on high voltage generators and control box.

Mechanical Engineer, Ellman, Hicksville, NY (Contract) July 2013 – September 2013

Medical instrument integration, modeling the details of the design, plastic injection mold, manufacturing drawings.

Supports products in terms of quality, manufacturing, material selection, supply continuity, and cost improvement.

Created proposal documentation for new parts and used Solidworks, AutoCad composite files from customers to derive manufacturing files.

Mechanical Engineer, COSA Xentaur Corp., Yaphank, NY October 2011 – June 2013

Designed engineering & integrated analytical instruments & automated test tools for petrochemicals, energy measurement equipment.

Knowledge and use of Solidworks, for FEA studies of composite parts to verify design options.

Created proposal documentation for new parts, development of sample system, mechanical /product detail drawings, composite parts & ECN.

Designed and developed the tooling fixtures, test systems, structural composite and sheet metal parts, and packaging assemblies of Optical Moisture Measurement, Portable Calorific Value Measurement for multiple suppliers.

Successfully led efforts that resulted in development of new measurement parts for major testing instrument manufacture.

Production/Mechanical Engineer, Wi-Tron, Inc., Raritan, NJ September 1997 – January 2011

In charge of prototype Wi-Max Amplifiers to production and development involving mechanical design, specifying materials for electronic packaging and enclosure, tooling assemblies for heat sink, thermal, sheet metal parts and EMI design of high power RF amplifier equipment used in the mobile communication base stations and systems. Worked with multiple vendors to bring innovative parts to market on time and budget.

Defined the manufacturing, assembly, and fabrication process and methodologies in production of RF/Amplifiers (e.g. GSM,WCDMA,CDMA) modules, semiconductor package & systems. Optimized parts and assemblies using Finite Element Analysis (FEA) and Stress, Thermal Analysis input. Used CAD tools (Pro/E 5.0, Autocad, Ansys, Icepak) composite files from customers to derive manufacturing files.

Troubleshoot components for overheating, and changed physical dimension of material for corrective actions. Developed PCB & housing assembly (solder reflow oven & SMT machine) prototyping to full production line.

Provide engineering release & R&D projects that includes AMP system layout concept, assembly drawings and parts list, such as, control board simple and complex surface mount on both sides with housing, heatsink & enclosure.

Knowledgeable of the ASME Y14.5M-1994 standard & IP ratings in a protection & controlled design environment.

EDUCATION:

M.S., Mechanical Engineering, The City College of New York, Feb. 1997

B.S., Mechanical Engineering, South China Institute of Technology, Dec. 1987

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