Hitesh G. Panchal
Mobile: 982-***-****
E-Mail: ******@*****.***
To become a successful professional in the field of Communication by being innovative, flexible, committed and by the application of latest technologies and to realize my potential to the possible extent.
Degree
Institute/ School
University/Board
Year of passing
CPI/Percentage
E&C Engineering
GEC, BHUJ,
KUTCHCH.
GTU
June
2013
7.01(CGPA)
12th std.
(H.S.C)
Mangaldeep vidhyalay
Gujarat Higher Secondary Education Board
March 2009
58.40%
Second class
10th std.
(S.S.C)
P.C.Prajapati vidhyalay
Gujarat Secondary Education Board
March 2007
74.31%
DISTINCTION
PROJECT:1
A presentation based on Microcontroller as a part of embedded system.
Project Name : Wireless Nurse Calling System
Company Name : U.D.P
Environment : KEIL
Name
Hitesh G. Panchal
Permanent Address
107-Panchal vas,
Satun,
Ta-Radhanpur-385340
Dist-Patan
Contact no.
Gender
Male
Date of birth
20 dec 1991
Email-id
******@*****.***
Languages known
English, Hindi, Gujarati.
Hobbies
Net surfing, Exploring Wikipedia.
NO
NAME
DURATION
1.
PCB PLANET PVT(I).LTD
From 1st July to 31 January
2.
SAFAL CIRCUIT PVT.LTD
From feb. to contd.
1.I have experienced in PCB CAD CAM WORK of 6 MONTH in PCB PLANET LTD with UCAM SOFTWARE.
2.I have experienced in PCB CAD CAM WORK of 6-month in SAFAL CIRCUIT PVT LTD. with
PCB CAD CAM WORK:-
To work on files of different DATA FORMAT like GERBER, RS274-X (embedded apertures), DPF, DXF, PDF, NC drill etc files.
Micro- modifications performed with customer approval.
Build-up construction for multi-layer jobs.
Perform Pre-manufacturing Design Rule Checks on every part with merging and editing -Single Sided, Double Sided, and Multilayer jobs (up to 24 layers).
Expertise in DRC Inspection of all layers.( Component Side, Solder Side, Signal/Power Layers, Solder Mask layers, Silk layers etc., )
Good knowledge in Carbon printing, Peel-off mask, Edge Platting, Platted Holes on the board edge, Impedance Controlled jobs, Gold finger Jobs, Depth Routing, CSK(countersunk)Hole construction jobs,etc.
Good knowledge in calculation of impedance and preparing build for multi-layer impedance controlled jobs.
Penalization: Step and Repeat of individual layers, add tooling holes, add copper balancing pattern on inner/outer layers etc.
I hereby declare that above mentioned information is true to the best of my knowledge.
Place: Patan Hitesh G. Panchal