Woong Ho Bang

Personal Information

Address: *** ******* ****, *****, ** 75013

Cell: 817-***-****

E-mail: acspab@r.postjobfree.com

Status: Permanent Resident

Synopsis

The applicant is a PhD in Materials Science with a major R&D background in the mechanics of materials. His specialties include finite element analysis of thermal-mechanical problems (FEA, Abaqus 15+ yrs.), fundamentals of mechanical properties, mechanical testing and product design optimization. He also has extensive experiences in R&D project managements for private and Government sectors.

Current Employment

Bailey Tool & Mfg. Company (Sep/2010 - present): Senior Research Scientist

Previous Employment

University of Texas at Arlington (Jun/2005 - Sep/2010): Post-doctor/Research associate

Research Institute of Advanced Materials (Aug/2004 - Jun/2005, Korea): Senior research engineer

Lawrence Berkeley National Laboratory/UC Berkeley (Sep/2002 - Sep/2003): Exchange Researcher

Education

PhD (2004), Materials Science and Engineering, Seoul National University (Korea)

- Dissertation: Study on the Mechanical Testing Method of a Eutectic Sn-Pb

MS (2000), Metallurgical Engineering, Seoul National University (Korea)

- Dissertation: Effect of Alloying Elements on the Wear Characteristics of Ductile Cast Iron

BS (1998), Metallurgical Engineering and Materials Science, Hongik University (Korea)

Qualifications

Finite element analysis (FEA), including linear and non-linear deformation, implicit/explicit solver, fatigue modeling, fracture mechanics, reliability assessment and product design optimization

Fundamental knowledge in materials science

Mechanical testing and metallurgical characterization of single and/or integrated structures

R&D project managements, including proposal preparation, conducting R&D and making a technical report

Technical/Knowledge Skills

Finite element analysis software (FEA): ABAQUS, LS-Dyna, CTH

3D-CAD software: SolidWorks, NX Unigraphics, PATRAN

Engineering software: Matlab, FORTRAN, Origin

Materials characterization tools: Microscopy, tensile, shear and bending machines, hardness testing

Professional documentation skills to create technical reports, R&D proposals, presentation

Work Experiences

Sep. 2010 – Present, Senior Research Scientist, Bailey Tool & Mfg. Co. (Lancaster, TX)

Common Responsibilities

- Principal Investigator to manage and support various R&D projects

- Preparation for R&D proposals and making technical reports

- Finite element analysis, experimental testing and data analysis

- Provision of a metallurgical engineering service

- Reliability assessment and product design optimization

Highlighted projects

(1) Development of a hyperelastic open-hole packer (with Halliburton)

: Finite element analysis of hydraulic expansion of a hyperelastic/steel tube

(2) Design development of a rubber injection machine (with Halliburton)

: Finite element analysis to evaluate machine stability during rubber injection process

(3) Hot stamping of a truck axle (with Schuler SMG and Tata motors)

: Coupled thermal-mechanical FEM analysis to optimize forming tooling design

(4) Design development and production of Perf & Drop Pipe (with Schlumberger)

: Shaped charge simulations to evaluate burr formation at a thread-conduit pipe

(5) Spin-necking and hydroforming to produce a superconducting accelerator (DOE, $1,150,000)

: Principal Investigator, drafting a R&D proposal and making reports, managing R&D progress

: Finite element analysis and experimentation

(6) Development of ultra-high-performance fiber-reinforced concrete (DOD, $150,000)

: Principal Investigator, drafting a R&D proposal and making reports, managing R&D progress

: Experimentation

(7) Development of a continuous concrete mixer (NSF, $75,000)

: Principal Investigator, drafting a R&D proposal and making reports, managing R&D progress

: Experimentation

Jun. 2005 – Sep. 2010, Post Doctor/Research Associate, University of Texas at Arlington

Common Responsibilities

- Finite element analysis, mechanical testing and metallurgical characterization

- Design and/or build of customized mechanical testing instruments

- Reliability assessment

- Drafting academic articles for journal publications

Highlighted projects

(1) Reliability assessment of porous low-k materials (with Intel)

: Design and build of a high-temperature indentation machine to characterize porous low-k

: Finite element analysis, indentation testing and metallurgical characterization of a low-k structure

(2) Reliability assessment of porous low-k materials (with Texas Instrument, SRC)

: Coupled thermal-mechanical finite element analysis at a Cu/porous low-k interconnects structure

(3) Reliability evaluation of a printed circuit board (with CISCO)

: Established design parameters to construct bending and shear testing equipment

: Finite element analysis, bending-shear fatigue experimentation and metallurgical characterization of a PCB structure

(4) Development of light-weight coaxial Cu interconnect (with AFRO/DOD)

: Design and build of a continuous coating machine to produce a Kapton-coated Cu wire

(5) Impurity detection in printed circuit board (with Intel)

: Cyclic voltammetry test to detect a chemical reaction and impurity in a printed circuit board

(6) Reliability assessment of Au wire-bond under electric stress (with MKE Electronics)

: Coupled electrical-thermal finite element analysis of Au wire-bond in a semi-conductor chip

(7) Directional annealing to produce large grained Cu interconnects structure (with Texas Instrument)

: Finite element analysis on thermal distribution at Cu interconnector during directional heating

Aug. 2004 – Jun. 2005, Senior Research Engineer, Research Institute of Advanced Materials (Korea)

- Finite element analysis (Abaqus, FORTRAN) and metallurgical analysis (SEM)

Sep. 2002 – Sep. 2003, Exchange Researcher, Lawrence Berkeley National Laboratory/UC Berkeley

- Fundamental theory on metal plasticity/viscoplasticity

Mar. 1998 – Aug. 2004, Research Assistant (MS and PhD), Seoul National University (Korea)

Primary R&D Subjects

- Finite element analysis at metallic/non-metallic structures

- Mechanics of materials, such as plasticity/viscoplasticity, fatigue and fracture modeling, reliability

- Physical metallurgies, microstructure characterization

Highlighted R&D projects

(1) Interface cracking and fracture mechanics at a solder joint (NRL fund)

: Finite element analysis in combination with fracture mechanics (stress intensity ‘K’ and J-integral)

(2) Plasticity and viscoplasticity (BK 21 fund)

: Fundamental of plasticity and viscoplasticity mechanisms

(3) Reliability of a continuous-casting mold system (with POSCO)

: Coupled thermal-mechanical finite element analysis at a continuous casting mold

(4) Bulging and deflection reliability of a gas pipe line buried under ground (with KO-Gas)

: Finite element analysis of a gas-pipe subjected to a hydraulic load and/or repeated impact load

Honors

Fellowship for exchange research program at Lawrence Berkeley National Laboratory/University of California at Berkeley (Brain Korea 21, 2002~2003, $20,000)

Fellowship for post-doctoral program at UTA (Korea Research Foundation, 2005~2006, $20,892)

Selected Publications

Journal Publications (Among 24 in total)

1. W. H. Bang et al., “Fracture Mechanics of Solder Bumps during Ball Shear Testing: Effect of Bump Size”, Journal of Electronic Materials, Vol. 38 (2009), pp. 1896-1905

2. W. H. Bang et al., “Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints”, Journal of Electronic Materials, Vol. 37 (2008), pp. 417-428

3. W. H. Bang et al., “The Correlation between Stress Relaxation and Steady State Creep of Eutectic Sn-Pb”, Journal of Electronic Materials, Vol. 34, (2005), pp. 1287-1300

4. W. H. Bang et al., “Rate dependence of bending fatigue failure characteristics of lead-free solder joint”, 59th Electronic Components and Technology Conference, San Diego, CA, May. 26~29 (2009) pp. 2070-2074

1.

Conference Presentations (Among 31 in total)

1. W. H. Bang et al., “Fracture Mechanics Approaches to the Interfacial Fracture of a Solder Joint and a Solder Bump”, TMS Annual Meeting, San Antonio, TX, Mar. 12~16 (2006)

2. W. H. Bang et al., “Fracture Mechanics of Solder Joint under Mechanical Fatigue: Selection and Transition of Failure Location with Microstructure”, TMS Annual Meeting, San Diego, CA, Feb. 27~Mar. 3 (2011)

3. W. H. Bang et al., “Rate dependence of bending fatigue failure characteristics of lead-free solder joint”, 59th Electronic Components and Technology Conference, San Diego, CA, May. 26~29 (2009)

4. W. H. Bang et al., “Study on the Thermal Stability of Pore Structure in a Porous Low-k in a Copper/Low-k Interconnect Pattern - Correlation with Thermal Stress”, MRS Spring Meeting, San Francisco, CA, Mar. 24~28 (2008)

References

Available upon request

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