PAUL W. STOLAR
*** ***** **** #**** 214-***-****
The Colony, TX **********@*****.***
Summary
Experienced manufacturing reliability engineer for harsh environments electronics. Very knowledgeable with materials, chemistry, and processing. Independent and creative problem finder and solver with a focus on containing costs, saving money and improving both reliability and quality. Recognized for ability to successfully train leaders and team members in leadership skills, communication, team building and performance. Succinctly and clearly presents complex issues in a readily understandable manner.
EXPERIENCE
SANMINA INC. 2013-2015
PROCESS ENGINEERING
• SET-UP HMP SOLDER LINE, TRAINED OPERATORS, QUALIFIED PROCESSES
• QUALIFIED AND BUILT 5 HIGH RELIABILITY PROJECTS
• DESIGNED TOOLING FOR CUSTOMER APPLICATIONS REDUCING PRODUCTION TIME BY 40%
• DESIGNED PACKAGING FOR PRODUCTS REDUCING COSTS BY 60%
• UPDATED ECO PROCESS
• SET-UP THERMAL GEL LINE
FORT BEND ISD 2011-2013
PHYSICS TEACHER
BANKERS LIFE AND CASUALTY 2009-2010
LICENSED AGENT
Personally identify clients, market and sell insurance products BAKER ATLAS 2002-2009
Manufacturing Reliability Engineer
Updated hand soldering methods and training to eliminate defects. Yields from suppliers increased from <80% to 90%+
Created a wire-line tool rework process which saved the company $1.5M. Received Chairman’s Award 2004.
Changed materials used in assembly of wire-line tools to save $350,000 per year.
Changed materials used in encapsulated MWD products saving $300k per year
President’s Award 2007 for improving manufacturing quality of MWD tool
Rewrote and updated the workmanship standards for harsh environments which resulted in improved contract manufacturer delivery from 60% to 90%+
Improved conformal coating processes saving $340,000/year
Developed and implemented quality and manufacturing training program which reduced defects by 5%
Developed, approved and implemented new cleaning chemistry to meet internal and national safety/environmental requirements.
Wrote manual for new hires in manufacturing engineering to speed up training from 6 months to 2 weeks.
Developed and trained the manufacturing reliability engineering group in experimental design and failure analysis techniques resulting in saving over $50,000 per year in outside consulting.
Developed and implemented methods and tooling to reduce solder cracks from 50% to less than 5%.
Replaced outdated dispensing pumps to improve through put by 20% MARLOW INDUSTRIES - Dallas, TX 1999-2000
Process Engineer
Developed new cleaning system, which saved 4 full time repair/maintenance positions, estimated savings is $12,000 per month.
Implemented ANSI/JSTD-001B Quality System saving the company $7,500 per month plus reduced cycle time by performing operation in-house.
Improved soldering operations by reducing a visual defect from 70% to 2.5%. This was executed by creating the flux through a DOE (design of experiment.) Estimated company savings is one inspector per month per line, approximately
$70,000 per year.
Developed, trained, and documented a specialized paint process saving $60,000/year
Upgraded thermo-shock system to save $100,000/year in liquid nitrogen costs XETEL CORPORATION - Austin, TX 1996-1998
Advisory Engineer, SMT Process Engineering
Implemented pre-control system on the line. Overall first pass yields have improved from 75% to 90% due to this and other quality initiatives.
Identified and solved major problems with glue dispense with design of experiments improving process time by 80%
Developed and implemented SPC system for dicing operation, meeting customer requirements and generating
$50,000/month income
Identified, justified, implemented temporary automated solder mask dispense system, eliminating 4 man months/month
(approximately $20,000 month)
Implemented conformal coating process, saving company an estimated $200,000 per year. ITRON, INC. - Waseca, MN 1995-1996
Senior Manufacturing Engineer, SMT processes
Developed Design for Manufacture procedure and standard
Implemented IPC and J-STD training improving training time from 1 month to 1 week.
Developed and implemented ESD training eliminating 10% failure rate CTS MICROELECTRONICS - West Lafayette, IN 1991-1995 Senior Process Development Engineer, Assembly Processes
Increased yields from 70% to 98% on wedge bonding processes for fiber optic assemblies.
Developed and implemented flex cable to ceramic attach methods to help capture $5M in business
Improved recovery techniques from 10% to 99% of solderability rejects to be recovered.
Developed and implemented ozone safe processes for solder paste attach and vapor phase re-flow. Identified and implemented new cleaning methods. Reduced ODC use down to 16%.
Reduced solderability rejects from greater than 25% to less than 1% through design of experiments and process changes.
Designed fiber optic assembly fixture, reducing handling loss from 5% to 1% and increasing assembly rates by 30%.
Implemented plasma cleaning as a production process, reducing scrap from foreign materials from 5% to 1% and improving wire bond pull strengths by 10%
Investigated several materials defects and discovered root causes, improving assembly yields from 10% to greater than 90% on some product lots. (cap's, IC's, and packages)
Developed encapsulation, cap attach, and other rework procedures on flex cable assemblies saving 50% of scrap
Implemented in new incoming procedures to minimize storage effects on components eliminating 5% of solderability problems.
TEXAS INSTRUMENTS, INCORPORATED - Dallas, TX 1986-1991 Process Engineer, Microwave Packaging (1988 -1991)
Defined automated vacuum re-flow chamber reducing process time from 5 minutes to 1 minute
Designed Taguchi orthogonal array experiment of vacuum solder attachment reducing voids by 25%
Trained technical staff in failure analysis techniques, permitting in house analysis saving $10,000/year Process Engineer, Surface Acoustic Wave Devices (1986 -1988)
Developed direct write phase compensation process for reflective array compressors, reducing costs by 6% and production time by 75%.
Developed negative photolithography process for compensation processes, resulting in amplitude compensation processes of surface acoustic wave devices to be investigated
Developed test software for wafer probe in production environment ensuring delivery of product to customer's specifications.
Developed two solder seal processes resulting in 95% plus yield for both water content and hermeticity. EDUCATION
M.S. Applied Physics, University of Texas at Dallas B.S. Materials Science, Rice University – Houston, TX SPECIALIZED TRAINING AND SKILLS
ANSI/IPC-610 Certified Instructor
Failure Analysis
Reliasoft Reliability s/w
Root Cause Analysis
APICS certification materials management
ANSI/J-STD-001B Instructor Training and Certification JMP SPC S/W
Close the Loop (Team building)
Arena manufacturing simulation training
ISO inspector
Shainin DOE methods
Design for Automation and Assembly
Trade secret award
Statistical Process Control
MRP II
Quality-Function-Deployment
Experimental Design
Crosby Total Quality Management
Computer Languages and Skills: Pascal, FORTRAN, BASIC, HP BASIC, AutoCAD and other drafting packages
AFFILIATIONS
Toastmaster International, Area Governor, Distinguished Toastmaster award, president (Achieved highest club award)
Landmark Education: coach, introduction leader