Senior Principal Elecreical EngineerSales

Resume of James M. Hattis

Contact information:

acs4vh@r.postjobfree.com

Phone: 612-***-****, (mobile) 952-***-**** (home)

Mailing Address: 5601 Smetana Drive, Unit 104, Minnetonka, MN 55343-9050

Summary:

Whether it may be either an Individual Contributor, Technical Field Sales, or a Technical Management role, I am an experienced Senior-Principal Engineer employed for over 35 years with a very unique skillset as an RF Circuit / Systems Design and Modeling / Field Applications Engineering and Business development with technical management experience, with focus on RF, Electromagnetic / Ferromagnetic, Static and Dynamic Thermal / Mechanical simulation and modeling, Laboratory RF Test and Measurement Lead, Materials Test, EMC Compliance, Component test, High-Speed / RF PCB simulation modeling and layout, Field Sales Applications Engineering, and Electronic Technologist. My desire is to apply my past experience to a position which can utilize my abilities in technology, people and mentoring, communication, process / project coordination and technical management skills, and use them in a senior Engineering or technology management position within a high technology industry and product line where I can bring value to an organization with my abilities to spark innovation.

Education B.S.E.E University of Illinois, Urbana, IL 1980 (GPA 4.4/5.0), Graduate credits accrued from Universities of IL, IA, and MN

Patents “Method and Apparatus for Improving Thermal Energy Dissipation in a Direct Chip Attach J. Hattis, Patent #7,817,434 B2, awarded October 19, 2010

“On Chip Over-Temperature Detection”, J. Hattis, Patent #7,734,440 B2, awarded June 8,2010

“Hard Disk Drive Fly Height Control by Thermal Sensing”, J.Hattis, LSI submitted Patent Disclosure, October, 2012

Publications "Gallium Arsenide IC's for a Digital RF Memory", Jim Hattis et. al: Government Microcircuits Applications Conference, Nov. 1985; Author and Presenter

"A Monolithic GaAs 3-bit Phase Quantization Sampler", Jim Hattis et. Al: 1987 IEEE MTT Symposium, June, 1987; Author and Speaker (Published Dec., 1987 IEEE Solid State Circuits Journal )

Societies / Awards Eta Kappa Nu Engineering Honor Society, IEEE, Hewlett-Packard Forth Bridge Award, Hewlett-Packard Instrumentation School Honors, Participant in the LSI Patent Program

Spare Time Musician (pianist), Amateur Radio, Astronomy, spending time with my kids

Experience

7/2013 - 7/2015 Electro Rent Corporation Minnetonka, MN

RF / Microwave / Millimeter-wave Field Applications Engineer

Senior Field Applications Engineer concentrating on RF/microwave/millimeter/sub-millimeter-wave electronic test equipment and solutions for Academic institutions and corporations in the western half of the USA. Concentrating on Pre-sales and post sales technical support, training, and lecturing on Keysight Network Analyzers, Signal Analyzers, Signal Generators, Impedance Analyzers used in all miscellaneous standard applications. Additional topics of concentration include Linear S-parameters, Non-linear X-parameters, Antenna test, EMI pre-compliance and compliance, Component Test, Materials Measurement, Noise Figure, Phase Noise, and TDR test techniques.

11/1999 - 11/2012 LSI Corporation/Agere Systems Mendota Heights, MN

Distinguished Member of Technical Staff

Individual contributor, and working-group director (reporting to Field Sales / Marketing) for an analog-mixed signal broadband / low noise hard disc drive preamplifier IC, performing (Ku-Ka Band) RF, Electromagnetic, Ferromagnetic, and Thermal / Mechanical system simulation and modeling (Mixed-mode s-Parameter, SPICE, X-Parameter) of high speed analog preamplifiers along with the associated RF interconnect, including parasitic loading, packaging, PCB layout, and surface mount devices, SW Tools used are ANSYS Maxwell, HFSS, and ANSYS NLT (Thermal / Mechanical) 3D FEM simulators, Agilent ADS, Cadence Design Environment, IConnect / Scope TDR, and AUTOCAD. Windows, Linux, and Agile and Sharepoint Data Bases experience also included.

Develop, generate, and verify s-Parameter/X-Parameter/HSPICE/Spectre/IBIS models for broadband low noise preamplifiers and associated PCB media used to read/write data onto Hard Disk Drive media

Using Cadence / Agilent RFDE-Dynamic Link, Modify and translate Spectre top-level preamplifier writer and reader cell views into a model useable by Agilent ADS. Detailed knowledge of PDK’s, Spectre net listing, and device modeling techniques (linear and non-linear device models / circuit simulators)

Develop, simulate, and verify static and dynamic thermal physical models of flip chip and packaged IC's on Polyamide flexures and PCB's

Using various system, electromagnetic, and thermal modeling tools, and laboratory RF frequency and time domain test equipment (Spectrum, Network, Impedance Analyzers, Oscilloscopes, Time Domain Reflectometry, etc.), I would simulate, design, model, measure, and verify various transmission line model geometries, broadband low noise preamplifiers, and other electronic high speed signals and waveforms using mixed-mode s parameter, X parameter, and HSPICE model formats. Extensive use of time domain eye diagram analysis, waveform analysis, and TDR analysis in the time domain was also used.

Coordinate RF core competency of an Analog Design and Development team to design, simulate, and fabricate a monolithic Silicon Cable TV / wireless digital modem RF down-converter

System level RFIC design and simulation

Prototype and first silicon bench evaluation and IC characterization activities

Schedule, planning, and costing

Design, layout, and debug RF IC bench evaluation PCB s

Design Center RF Test and Measurement Resource

Familiarity with applications used in Windows XP, 7, HPUX, Cadence, and Linux

On wafer s-parameter characterization of passive and active components

Develop technical specifications and IC test plans

Define and specify IC tests for high-speed opto-electronic including 2.5 Gbps Laser drivers, Trans-impedance amplifiers, and Limiting amplifiers

Applications engineering support for laser driver and trans impedance amplifier products

4/1998 - 10/1999 Mayo Foundation Rochester, MN

Principal Project Engineer

Performed system design and simulation of a digitally modulated 60 GHz transceiver using HP Advanced Design System 1.0.

Signal Integrity Analysis on high speed PCB's

Authored white paper on De-embedding with Vector Network Analyzers

Utilized HP HFSS Electromagnetic Modeling Software and HP Circuit Design Software and most PC Productivity tool

RLC component modeling

5/1988 - 3/1998 Hewlett-Packard Company St. Paul, MN (Elk Grove Village, IL)

Senior Technical Consultant

Lead RF/mw/mmW communications applications consulting in support of the Motorola Cellular Subscriber and Infrastructure Groups production ATE test of digital cellular mobiles and base stations

Component Test: All types with emphasis on high-frequency RF components

Consulting and Training specialist for all RF / microwave products and applications

Senior applications support for all HP/Agilent RF signal generators, vector network analyzers, and spectrum analyzers

Designed Application Software in HP BASIC for customized automatic test of cellular telephones for Motorola, Inc.

Helped define the prototype Iridium production test equipment suite for Motorola, Inc

Provided oversight of third party/OEM system applications

Hoshin generation and Business Plan development and implementation

General Sales Support for the Midwest region for RF/mW/mmW Applications consulting

Areas of expertise: RF Communications test, EMI test, proposal authoring, high-speed digital electronics test, Vector Network Analyzer test, Spectrum analyzer test, TDR test, dielectric materials test (U.S. wide), Optical test, and Antenna characterization

Presented and authored Customer Seminars and Classes

10/1982 - 5/1988 Honeywell, Inc. Minneapolis, MN

Sr. RF Systems Engineer, Test Systems

Developed a high data rate GaAs A/D and D/A converted for use in Radar Jamming; Project Manager for a 40 GHz Depot-level EW Test Set; Design, Production, and Reliability engineering on Radar systems. Security Clearance required to design, develop, and test a custom RF Receiver/Spectrum Analyzer for HP's MMS modular 71000 series mainframe

Program planning, scheduling, cost matrices, statements of work (SOW), systems design and conceptual systems analysis

Preparation of System and component specifications, system software designs

Technical Paper Authoring and presentation

Subcontractor management and Gantt chart preparation

Assisted in corporate IR&D planning and proposal authoring

R&D design involved in high-speed GaAs microelectronics with focus on A/D and D/A converter development / technology

Design and test of high-speed IC packaging techniques

Product prototype development

Customer interface and presentations

Budgetary and schedule planning tasks

Author and presenter of published technical paper for IEEE Solid State Electron Device Transactions

Quality, Reliability, and Maintainability Engineering on various radar altimeter programs for missile technology

Performed FMEA, Reliability Prediction, Systems Safety Hazard Analyses

Prepared component and device test procedures

Familiarity with Government procurement and test specifications

Customer Liaison to Government Program Management Reviews

6/1980 – 9/1982 Rockwell-Collins International Cedar Rapids, IA

Electronic Circuit Design Engineer

Circuit design and development of Intel 8080-based microprocessor data communications interfaces for the Navstar Global Positioning System (GPS)

Assembly language programming

Product documentation

Hardware and software debug and test

PCB Layout

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