Resume of James M. Hattis
Contact information:
**********@*****.***
Phone: 612-***-****, (mobile) 952-***-**** (home)
Mailing Address: 5601 Smetana Drive, Unit 104, Minnetonka, MN 55343-9050
Summary:
Whether it may be either an Individual Contributor, Technical Field Sales, or a Technical Management role, I am an experienced Senior-Principal Engineer employed for over 35 years with a very unique skillset as an RF Circuit / Systems Design and Modeling / Field Applications Engineering and Business development with technical management experience, with focus on RF, Electromagnetic / Ferromagnetic, Static and Dynamic Thermal / Mechanical simulation and modeling, Laboratory RF Test and Measurement Lead, Materials Test, EMC Compliance, Component test, High-Speed / RF PCB simulation modeling and layout, Field Sales Applications Engineering, and Electronic Technologist. My desire is to apply my past experience to a position which can utilize my abilities in technology, people and mentoring, communication, process / project coordination and technical management skills, and use them in a senior Engineering or technology management position within a high technology industry and product line where I can bring value to an organization with my abilities to spark innovation.
Education B.S.E.E University of Illinois, Urbana, IL 1980 (GPA 4.4/5.0), Graduate credits accrued from Universities of IL, IA, and MN
Patents “Method and Apparatus for Improving Thermal Energy Dissipation in a Direct Chip Attach J. Hattis, Patent #7,817,434 B2, awarded October 19, 2010
“On Chip Over-Temperature Detection”, J. Hattis, Patent #7,734,440 B2, awarded June 8,2010
“Hard Disk Drive Fly Height Control by Thermal Sensing”, J.Hattis, LSI submitted Patent Disclosure, October, 2012
Publications "Gallium Arsenide IC's for a Digital RF Memory", Jim Hattis et. al: Government Microcircuits Applications Conference, Nov. 1985; Author and Presenter
"A Monolithic GaAs 3-bit Phase Quantization Sampler", Jim Hattis et. Al: 1987 IEEE MTT Symposium, June, 1987; Author and Speaker (Published Dec., 1987 IEEE Solid State Circuits Journal )
Societies / Awards Eta Kappa Nu Engineering Honor Society, IEEE, Hewlett-Packard Forth Bridge Award, Hewlett-Packard Instrumentation School Honors, Participant in the LSI Patent Program
Spare Time Musician (pianist), Amateur Radio, Astronomy, spending time with my kids
Experience
7/2013 - 7/2015 Electro Rent Corporation Minnetonka, MN
RF / Microwave / Millimeter-wave Field Applications Engineer
Senior Field Applications Engineer concentrating on RF/microwave/millimeter/sub-millimeter-wave electronic test equipment and solutions for Academic institutions and corporations in the western half of the USA. Concentrating on Pre-sales and post sales technical support, training, and lecturing on Keysight Network Analyzers, Signal Analyzers, Signal Generators, Impedance Analyzers used in all miscellaneous standard applications. Additional topics of concentration include Linear S-parameters, Non-linear X-parameters, Antenna test, EMI pre-compliance and compliance, Component Test, Materials Measurement, Noise Figure, Phase Noise, and TDR test techniques.
11/1999 - 11/2012 LSI Corporation/Agere Systems Mendota Heights, MN
Distinguished Member of Technical Staff
Individual contributor, and working-group director (reporting to Field Sales / Marketing) for an analog-mixed signal broadband / low noise hard disc drive preamplifier IC, performing (Ku-Ka Band) RF, Electromagnetic, Ferromagnetic, and Thermal / Mechanical system simulation and modeling (Mixed-mode s-Parameter, SPICE, X-Parameter) of high speed analog preamplifiers along with the associated RF interconnect, including parasitic loading, packaging, PCB layout, and surface mount devices, SW Tools used are ANSYS Maxwell, HFSS, and ANSYS NLT (Thermal / Mechanical) 3D FEM simulators, Agilent ADS, Cadence Design Environment, IConnect / Scope TDR, and AUTOCAD. Windows, Linux, and Agile and Sharepoint Data Bases experience also included.
Develop, generate, and verify s-Parameter/X-Parameter/HSPICE/Spectre/IBIS models for broadband low noise preamplifiers and associated PCB media used to read/write data onto Hard Disk Drive media
Using Cadence / Agilent RFDE-Dynamic Link, Modify and translate Spectre top-level preamplifier writer and reader cell views into a model useable by Agilent ADS. Detailed knowledge of PDK’s, Spectre net listing, and device modeling techniques (linear and non-linear device models / circuit simulators)
Develop, simulate, and verify static and dynamic thermal physical models of flip chip and packaged IC's on Polyamide flexures and PCB's
Using various system, electromagnetic, and thermal modeling tools, and laboratory RF frequency and time domain test equipment (Spectrum, Network, Impedance Analyzers, Oscilloscopes, Time Domain Reflectometry, etc.), I would simulate, design, model, measure, and verify various transmission line model geometries, broadband low noise preamplifiers, and other electronic high speed signals and waveforms using mixed-mode s parameter, X parameter, and HSPICE model formats. Extensive use of time domain eye diagram analysis, waveform analysis, and TDR analysis in the time domain was also used.
Coordinate RF core competency of an Analog Design and Development team to design, simulate, and fabricate a monolithic Silicon Cable TV / wireless digital modem RF down-converter
System level RFIC design and simulation
Prototype and first silicon bench evaluation and IC characterization activities
Schedule, planning, and costing
Design, layout, and debug RF IC bench evaluation PCB s
Design Center RF Test and Measurement Resource
Familiarity with applications used in Windows XP, 7, HPUX, Cadence, and Linux
On wafer s-parameter characterization of passive and active components
Develop technical specifications and IC test plans
Define and specify IC tests for high-speed opto-electronic including 2.5 Gbps Laser drivers, Trans-impedance amplifiers, and Limiting amplifiers
Applications engineering support for laser driver and trans impedance amplifier products
4/1998 - 10/1999 Mayo Foundation Rochester, MN
Principal Project Engineer
Performed system design and simulation of a digitally modulated 60 GHz transceiver using HP Advanced Design System 1.0.
Signal Integrity Analysis on high speed PCB's
Authored white paper on De-embedding with Vector Network Analyzers
Utilized HP HFSS Electromagnetic Modeling Software and HP Circuit Design Software and most PC Productivity tool
RLC component modeling
5/1988 - 3/1998 Hewlett-Packard Company St. Paul, MN (Elk Grove Village, IL)
Senior Technical Consultant
Lead RF/mw/mmW communications applications consulting in support of the Motorola Cellular Subscriber and Infrastructure Groups production ATE test of digital cellular mobiles and base stations
Component Test: All types with emphasis on high-frequency RF components
Consulting and Training specialist for all RF / microwave products and applications
Senior applications support for all HP/Agilent RF signal generators, vector network analyzers, and spectrum analyzers
Designed Application Software in HP BASIC for customized automatic test of cellular telephones for Motorola, Inc.
Helped define the prototype Iridium production test equipment suite for Motorola, Inc
Provided oversight of third party/OEM system applications
Hoshin generation and Business Plan development and implementation
General Sales Support for the Midwest region for RF/mW/mmW Applications consulting
Areas of expertise: RF Communications test, EMI test, proposal authoring, high-speed digital electronics test, Vector Network Analyzer test, Spectrum analyzer test, TDR test, dielectric materials test (U.S. wide), Optical test, and Antenna characterization
Presented and authored Customer Seminars and Classes
10/1982 - 5/1988 Honeywell, Inc. Minneapolis, MN
Sr. RF Systems Engineer, Test Systems
Developed a high data rate GaAs A/D and D/A converted for use in Radar Jamming; Project Manager for a 40 GHz Depot-level EW Test Set; Design, Production, and Reliability engineering on Radar systems. Security Clearance required to design, develop, and test a custom RF Receiver/Spectrum Analyzer for HP's MMS modular 71000 series mainframe
Program planning, scheduling, cost matrices, statements of work (SOW), systems design and conceptual systems analysis
Preparation of System and component specifications, system software designs
Technical Paper Authoring and presentation
Subcontractor management and Gantt chart preparation
Assisted in corporate IR&D planning and proposal authoring
R&D design involved in high-speed GaAs microelectronics with focus on A/D and D/A converter development / technology
Design and test of high-speed IC packaging techniques
Product prototype development
Customer interface and presentations
Budgetary and schedule planning tasks
Author and presenter of published technical paper for IEEE Solid State Electron Device Transactions
Quality, Reliability, and Maintainability Engineering on various radar altimeter programs for missile technology
Performed FMEA, Reliability Prediction, Systems Safety Hazard Analyses
Prepared component and device test procedures
Familiarity with Government procurement and test specifications
Customer Liaison to Government Program Management Reviews
6/1980 – 9/1982 Rockwell-Collins International Cedar Rapids, IA
Electronic Circuit Design Engineer
Circuit design and development of Intel 8080-based microprocessor data communications interfaces for the Navstar Global Positioning System (GPS)
Assembly language programming
Product documentation
Hardware and software debug and test
PCB Layout