Craig P. Davis
Corrales, NM ****8
*********@*****.***
SUMMARY
DOD Secret Clearance. Over 25 years of experience in Quality, Aerospace Manufacturing Engineering, SCM, EVMS, Program Management, optical systems, semiconductors, MEMs and solar cell R&D and manufacturing, complex device manufacturing, and electronic materials characterization and applications. Member PMI, ASQ.
EDUCATION and QUALIFICATIONS
Masters of Business Administration, Eller College of Management, University of Arizona.
Master of Engineering in Microelectronics Manufacturing, Rochester Institute of Technology
Bachelor’s Degree in General Sciences, Chemistry, University of Rochester.
American Society for Quality (ASQ) Lean Six Sigma Master Black Belt Certification.
PMP Project Management Professional Certification from the Project Management Institute.
Safety Trained Supervisor Certification from the Board of Certified Safety Professionals.
EXPERIENCE
5/11 – 10/14. URS Corporation Program and Production Manager. I most recently worked as the Program Manager of a high volume electronic system. My program involved Design, Manufacturing, Test, and Delivery of a sensor based Force Protection System. Revenue was approximately $30M per year. The program recently ended after the DOD Army acquisition objective was attained.
1/10 – 5/11. Radiant Technology Production Manager. Research and production manager for a small semiconductor company in Albuquerque, specializing in piezoelectric devices.
7/07 – 8/09, Applied Technology Associates, Albuquerque, NM Program Manager for Electronics and Sensor Manufacturing programs. Close customer interactions resulted in $9M of new business development in a 2 year time span. I also served as corporate lead for quality and ISO program development and maintenance. Products included Aerospace qualified sensors.
12/06 – 7/07, Veeco Corp, Tucson, AZ. Technical Support Engineer for advanced interferometry capital equipment. Applications, Test and Engineering support.
04/05 - 03/06, Alliant Techsystems / Mission Research Corporation, Albuquerque, NM. Program Manager, Clock Driver MCMs. I led a group in a $15M / year Multifaceted Program involving Design, Manufacture, Test, Life Test Qualification, and Research and Development of a complex Space Qualified LTCC Multichip Module Hybrid. This Aerospace program ended abruptly due to Government order.
05/03 - 02/04, Intellite Inc, Albuquerque, NM Production Manager Optical MEMS manufacturing and process development. Responsible for Yield, Quality, Reliability Engineering.
08/98 - 10/01, Emcore Corporation, Albuquerque, NM Operations Manager I was Hired as Process Manager to select and purchase the equipment and start up the new fab for Emcore’s compound semiconductor photovoltaic solar cell division in Albuquerque. I led the manufacture of space qualified solar cells with world record solar conversion efficiencies. I was promoted to Operations Manager in 1999, and later assumed Operations Management responsibility for the MODE VCSEL Division in addition to the space qualified Solar Cell Division.
06/91 - 08/98, Intel Corporation, Albuquerque, NM Engineering and Management Roles, as follows: Defect Reduction and Yield Teams Leader in the areas of Tungsten and Oxide Polish. Discovered and proved the Root Cause of Microscratches, a problem that had plagued Intel for years. I am very strong in statistics, regression analysis and DOE using JMP SW. I possess strong organizational and planning skills and I am a team leader. From 1994 to 1997 I was an Intel Assignee to Sematech, Austin, TX During this time period, I was still an Intel employee, but was chartered to perform fundamental materials research at Sematech in Austin, TX. LKDM Low k Dielectric Constant Materials. Member of the original 4-person team studying the materials characterization and applications issues associated with several Low k dielectric materials. EPITs Equipment Productivity Improvement Teams. Defect Reduction in Leading Edge Manufacturing Equipment.
PUBLICATIONS
1.Emcore Solar Cell Growth Development DOE Screening Experiments, Emcore Internal, 1999
2.Microscratch screening experiments, Root Cause Determination, Intel internal, 1998
3.TiN Defect Reduction in the Applied Materials Endura Sputter tool, Sematech 1998
4.Low k Materials Via Etch development, Sematech FTAB report, 1996 Intel iPTC Conference;
5.Low k Dielectric Processing in Al / W integration 7/96 Sematech
6.Low k Dielectric Materials Characterization Project, MCNC, 1995
7.Several Sematech Tech Transfers in Low k Dielectrics and Equipment Productivity.
8.Genus RGA Mass Spec Development, Intel internal, 1993
9.Surfscan 4500 Interfab comparison, Intel internal publication, 1992
10.Poly-Flow Cleaning Technology, Intel internal publication, 1992
11.Gasonics Development, Intel Internal publication, 1991