Todd Thompson Phone: 657-***-****

Electronics Technician, Manufacturing & Automotive Technician Available for: Full/Part Time Work

EDUCATION/CERTIFICATION/TRAINING:

* BS, Physics, California University (GPA of 3.5 in Upper Division Course Work)

* Electronics Communications: 2 year equivalency AA with GPA of 4.0, (Circuit Theory&Labs: DC, ac, Digital, Semiconductor, AM/FM, & Design; extensive Troubleshooting with Complex Analyses)

* ASE Certification Status (A1, A6, A8) –

Passed ASE certification tests, and need more time on the job for ASE Application Requirements

* Exceptionally competent with MS Excel software, competent with MS Word, and MS Power Point

* Numerous Professional Training Certificates (Project Mgmt., Technical Writing and Communications)

* Customer Service Training Certificate of Completion

PROFESSIONAL EXPERIENCE:

Structure-Mechanical Assembly Technician (Regular Full Time): Approx.: Jun.,'15 to Present

Structure-Mechanical Assembly Technician (Temp): Approx.: Nov.,'14 to May, ‘15

Manufacturing Technician of Mechanical/Structural Parts/Equipment, Southern California

Performed preparation, modification (shape and size), and assembly of structural light weight composite panels and light weight aluminum (6061) parts, including the preparation/treatment of surface finishes and contours for clean connections, and smooth transitions between panels and parts; so that the parts fit together properly (i.e., flat and parallel/laminar as designed). Performed dry fitting of parts, and application of glue/adhesive for parts fusion/assembly, and application of bondo for filler and for shape formation. Performed the following work activities: surface/contour preparation, drilling, counter-sinking, and hole tapping for fastener attachment (parts coupling); fastened the laminar sheet metal parts/configurations to the light weight panels (for structural strength purposes), and attached decorative trim (aluminum). The mechanical/structural parts have been generally composed of machined (or molded) production parts (e.g., aluminum for sheet metal lug/brackets, aluminum rods, and light weight composite panels from structural core and fiber/resin materials). Utilized extensive hand/eye coordination with patience and fine control of hand tools. Applied protective surface films to part surfaces. Utilized material lists, drawings, specifications, and the design engineers’ technical notes, to perform intermediate structure assembly of structural equipment/products. Performed intermediate inspection of part assemblies produced, including updating/correcting the project/parts documentation drawings (when necessary). Utilized numerous powered and manual tools to attach the described parts and equipment {e.g., milling machine, drill press, pinch press, radial saw, pneumatic air tools (e.g. hand drill, router, cutting wheel), and hand tools (e.g., rivet tool, blind nut tool, ratchet and driver, coarse and fine files, knives, chisels, hammers, etc Utilized chemicals/solvents (mostly acetone, alcohol, and glues). Standing required (for long periods), bending, crouching, and moderate lifting all day long (up to 25 lbs). Very fast paced and active work environment.

Electro-Mechanical Assembly Technician Technician (Temp): Approx.: Oct.,'14 to Nov.,'14

Manufacturing Technician of Electromechanical Electronics Testing Equipment, Southern California

Performed final production inspection, testing, and check-out, final documentation photographs, digital micrographs and inspection. Worked off of material lists, drawings, specifications, and technical notes, instructions from design engineers, to perform final assembly of electronics testing equipment from machined production parts (sheet metal chassis, aluminum bars and rods, plastic spacer/shim parts), and wired boards (fiber glass and polymer). Activities included drilling, countersink, and tapping holes for fastener attachment. Performed application of adhesives/glues, silicon, and gaskets for pressure seals. Parts assembled included: support chassis, vacuum plumbing lines including vacuum gaskets, flipper safety (hand and finger protection), latching and lock-down mechanisms, hinges, air cylinders and support blocks, fiber glass composite boards, guide shafts and dowel alignment pins, aluminum brackets, lexan polymer boards, USB port equipment, DC electrical power and ground connectors, electrostatic discharge (ESD) equipment, fasteners of numerous styles, information and decorative labels. Utilized calipers and numerous powered & manual tools to attach the described parts and equipment. Moderate lifting (up to 40 lbs, 10 lbs all day long). Very fast paced and active work environment.

Scientific Tutor (Temporary-Seasonal Work): Approx.: Jan.,'13 to Mar.,'13

Professional Tutor of University Level Science Courses, Southern California

Performed professional tutoring of college level students in the following scientific subjects: Physics (calculus based - 1st and 2nd Year University level), Calculus (Scalar and Vector - 1st and 2nd Year University level), and Differential Equations (1st and 2nd Year University level). Other subjects available for tutoring: Electronics/Electricity ( 1st and 2nd Year University level), Chemistry (1st Year University level), Strength of Materials and Machine Design (1st Year University level), Fluid Dynamics/Mechanics (1st Year University level), Gravitation (1st Year University level), Oscillations (1st Year University level), Heat Energy (1st Year University level), Electromagnetism (1st Year University level), and Special Relativity (1st Year University level).

Independent Contractor/Mechanic (Automotive Technician) Approx.: Jan.,'08 to Sep.,'10

Independent Automotive Repair Shops, Southern California

Performed service/maintenance and mechanical repair activities on vehicles (e.g.: engine inspection and overhaul; wheel bearing and brake work - pads/shoes, fluids replacement; tune-up activities including engine oil and filter change; adjust timing and idle speed; replace timing equipment; inspect/evaluate electrical charging and starter systems; suspension system replacement; replace control components; etc.).

Additional Manufacturing Experience: responsibilities and activities –

Performed assembly (configuration planning, cleaned, and prepped) of pressure lines, hydraulic lines, grease lines, DC electrical power lines, via fittings, studs, and crimping. Utilized torque and lock wire/cabling techniques to lock down drilled fasteners. Utilized numerous powered & hand tools to attach the described lines to equipment.

Computer Languages and Software: knowledge and competency - C/C++, Pascal, Fortran, Basic, ProEngineer, AutoCad 12, MS Word, MS Excel, MS Power Point; exceptionally competent with MS Excel software with highly refined data evaluation and professional presentation techniques.

Additional Electronics Experience: responsibilities and activities -

Knowledgeable and competent with the following components, circuits and activities: resistors; capacitors; diodes; transistors; photonics (LEDs, photodiodes, phototransistors, solar cells, for motion detection and control); voltage regulators; operational amplifiers (OpAmps) to perform math functions (algebraic, scalar, and vector differential/integral calculus); integrated circuits to perform sequenced instruction to control peripheral equipment; transducers (to convert non-voltage energy signals to voltage signals); communications circuits (for signal modulation, mixing, conditioning, transmission, frequency selection, and receiving); and troubleshooting (e.g., signal trace, half split, expected DC voltage level) electronic circuit problems down to the stage, branch, and component level.

Performed data acquisition and evaluation utilizing opto-electronics and transducers via machine language programming of platform central processing unit and microcontrollers. Equipment utilized: oscilloscope, digital multi-meters, ac function/signal generators, and DC power supply. Knowledgeable and competent to perform design calculations and selections to build a lab version of the circuit/system for most purposes required. Knowledgeable and competent with microcontroller programming.

The following is a listing of Electronics and Physics course work/curriculum theory topics covered in specifics during recent and formal college coursework.

COURSE TITLE: PRINCIPLES OF AC THEORY (overall COLLEGE course test score average: 98%)

The following topics were covered in great depth in both lecture and implemented in laboratory circuit work: theory of alternating current and voltage (amplitude, period/frequency and phase); the sine wave voltage sources; non-sinusoidal voltage waveforms [saw-tooth, triangle, square, pulse-type (from the harmonics, also)]; practical measurements of the waveform's rise, fall time, pulse width, and duty cycle; superimposed DC and ac voltages; oscilloscope theory and waveform measurements (of up to 2 signals/channels simultaneously); the ac voltage generator (parts, operation, and theory); electronics signal generators (oscillators); effective signal values (e.g., peak-to-peak, peak, root mean square, average); angular measurement concepts (phase angle, velocity, frequency in both radians and degrees); leading and lagging waveform signals (or shifted signals); waveform fundamental frequency, harmonics (even and odd), composite waveforms; phasors, phasor diagrams, and complex numbers (rectangular and polar forms); capacitors (construction and composition, mica, ceramic, plastic film, electrolytic, and variable trimmers); inductors (construction and core materials); theory of ideal and non-ideal capacitors and inductors (series and parallel) in DC and ac circuits; charging and discharging curves and the RC time constant; current energy curves and the RL time constant; testing capacitors with analog ohmmeter; reactance (capacitive, inductive); power in capacitors and inductors; capacitors and inductors used as a filter in a power supply; the Quality factor of a coil (inductor); step-up and step-down transformers (for electrical isolation and voltage modification); mutual inductance and coupling coefficients; secondary winding loading; reflected load; matching the load and source resistances/impedances; the transformer as an isolated device; non-ideal transformer characteristics; winding resistance; core losses; magnetic flux leakage; tapped transformers, and multiple-winding transformers; transformer troubleshooting; RC, RL, and RLC circuits; impedance of parallel and series RLC circuits, including the series equivalent impedance of a parallel circuit; series and parallel resonance; bandwidth of resonant circuits; power in RLC circuits; RLC circuit applications and troubleshooting; filters (e.g., low-pass, high-pass, band-pass, band-stop); pulse response of reactive circuits; integrators and differentiators, principle of superposition; Thevinin's Theorem, Norton's Theorem; Millman's Theorem; and Maximum Power Transfer Theorem.

COURSE TITLE: ELECTRONIC PRINCIPLES (overall COL course test score average: 100%)

The following topics were covered in great depth in both lecture and implemented in laboratory circuit work: electrical energy sources (e.g., voltage and current sources) and their approximation models (i.e., ideal/perfect, second, stiff, firm); circuit equivalency theorems (further coverage of the Thevinin's and Norton's Theorems) with troubleshooting applications; semiconductor theory background (including conductors and insulators); flow types, [free electrons and holes (valence electrons)]; the pn junction and the unbiased diode; depletion layers, barrier potentials, forward and reverse biased diodes; diode breakdown voltage; other types of diode current (transient, reverse saturation, surface-leakage)); diode approximation models [ideal/1st, 2nd, 3rd, (and 4th)]; the diode curve, DC load line, and Q (quiescent/operating) point, diode power dissipation, diode bulk resistance in the p and n regions; diode circuits, use of current limiting resistors; diode usage in power supplies (the half-wave rectifier, the full wave rectifier, the bridge rectifier; the power input transformer; peak inverse voltage; the capacitor-input filter, surge current, troubleshooting, data sheet interpretation, real transformers; ripple voltage effects; design guidelines, surge and load current; RC and LC filters in diode circuits; diode voltage multipliers, voltage limiters (positive and negative); DC clampers (positive and negative); the peak-to-peak detector; unwanted clamping and the DC return; signal coupling types (capacitive, direct, and transformer); special-purpose diodes; the Zener diode, the Zener regulator (loaded and unloaded); temperature effects; optoelectronic devices and design guidelines (LEDs, seven-segment displays, photodiodes, opto-coupler/opto-isolator, the Schottky diode (for higher frequency applications); the varactor and its characteristics; varistors for power line filtering; data sheet usage; diode circuit troubleshooting; bipolar transistors (NPN and PNP) with 3 doped regions (i.e., emitter, base, and collector) and 2 pn junctions (diode type regions); the unbiased and biased transistor; transistor currents (emitter, base, and collector currents); the Base and Collector curves; regions of operation of the transistor (cutoff, saturation, active); transistor approximation models (ideal, 2nd, 3rd); DC current gain (beta) and alpha; temperature effects, derating factors, heat sinks; circuit configurations (e.g., common-emitter (CE), common-base (CB); common-collector (CC); transistor power dissipation and collector-emitter voltage; transistor fundamentals; variations in current gain due to manufacturing tolerances; the transistor load line (upper end is saturation and lower end is cutoff); the transistor operating point [ Qlow or high (VCE, IC )]; recognizing transistor saturation and cutoff; the transistor as a digital switch or as an amplifier current source; Base bias and Emitter bias; LED drivers; voltage-divider bias (VDB); VDB analysis, VDB load line and q point; two-supply emitter bias; Emitter feedback bias; Collector feedback bias; ac Models; capacitor utility for signal coupling or bypass; ac ground (for higher frequency signals); voltage superposition in amplifiers; DC and ac equivalent circuits; small-signal operations and distortion reduction; ac resistance of the emitter diode ; ac Beta; CE amplifier ac model of the CE amplifier; signal phase inversion; transistor models (the Eber-Moll model, the T model, and the II model); various input impedances (e.g., base input, stage input); ac quantities on the data sheet; h-parameters; voltage amplifiers; CE amplifier, voltage gain; predicting voltage gain; simplified analysis; swamped amplifier; cascaded stages; output impedance; negative feedback; the common base amplifier; power amplifiers; the ac load line, limits on signal swing; class A, AB, B, and C operation; transistor power rating; ac saturation and cutoff; ac output compliance; thermal resistance; Emitter Follower; CC amplifier, ac model of a CC amplifier; voltage (ac) gain; maximum unclipped output; cascading CE and CC; Darlington transistor; class B operation, class B power formulas; biasing class B amplifiers, class B drivers; output impedance; improved voltage regulation; field-effect transistors; the JFET, the biased JFET, drain curves; the trans-conductance curve; JFET approximation; the depletion-mode MOSFET; the enhancement-mode MOSFET; Op-Amp theory; integrated circuits, the differential amplifier; two input characteristics, ac analysis of a differential amplifier; output offset voltage; common-mode gain; the current mirror; small and large signal frequency response; power bandwidth; the operational amplifier; Op-Amp characteristics; popular Op-Amps; linear ICs; Op-Amp negative feedback; non-inverting voltage feedback; open-loop and closed-loop voltage gains; input and output impedances; inverting voltage feedback; Op-Amp bandwidth; linear Op-Amp circuits; inverting and non-inverting voltage amplifiers; more Op-Amp inverting circuits; the summing amplifier; current boosters for voltage amplifiers; voltage-controlled current sources; active filters; non-linear Op-Amp circuits; comparators, the Schmitt trigger; the integrator; waveform generation and conversion.

COURSE TITLE: DIGITAL ELECTRONICS (overall COLLEGE course test score average: 98%)

The following topics were covered in great depth in both lecture and implemented in laboratory circuit work: soldering components and IC chips to printed circuit boards (PCBs) and troubleshooting; debouncing circuits, latches; multivibrators (monostable, bistable, astable); CMOS TTL chips; Number Systems [binary, octal, decimal, hexadecimal, binary coded decimal (BCD 8421)]; other codes - ASCII, Gray, 2s complement, excess 3, 4221; Bits, nibbles, bytes, and word size; Boolean Logic Gates [AND, NAND, OR, NOR, XOR, XNOR, NOT (inverters, bubbles)], buffers/drivers; Universal Gates (NAND); input active states; extended input gates; Dependency notation (IEEE standard 91-1984); dual in-line package (DIP), surface-mount technology (SMT); IC chip label protocols; Combining Logic Gates; combinational logic circuits; Boolean expressions (minterm, AND-OR, sum-of-products; and maxterm, OR-AND, product-of-sums); DeMorgan's theorems (minterm and maxterm inter-conversions); truth tables; Karnaugh maps; multiplexer/data selector logic solutions; NAND logic; programmable array logic devices; other programmable logic devices; ROMs, PROMs, EPROMs; (PAL, GAL, ELPD, IFL, FPL, PLA, PEEL, FPGA, CPLD, SRAM); fuse maps; IC Specification and Interfacing; CMOS and TTL voltage profile diagrams; Noise margin, drive capability, fan-in & fan-out, propagation delay, power consumption; handing and design precautions; Schmitt Triggers; TTL to CMOS interface circuits; opto-isolators (4N25, 4N26); stepper motors; servo motors using PWM; Hall-effect sensor/switch; Relays; clamp diodes; current sourcing and sinking; Encoding (H2M), decoding (M2H), and seven segment displays (via LEDs, LCDs, incandescent display, gas-discharge tube, VF display); Flip-Flops (FF are wired together to form counters, shift registers, and various memory devices); Sequential logic circuits; the R-S Flip-Flop and clocked R-S Flip-Flop; the D Flip-Flop; the J-K Flip-Flop (commercial, 7476 and 74LS112 versions); IC latch; the Schmitt Trigger; Counters and their functions; ripple counters (Mod-10 and Mod-16, asynchronous and synchronous); Input/output via series and parallel load; Up and down counters; frequency dividers; Shift Registers and their functions; Arithmetic Circuits; adders (half, full); subtractors (half, full); Memory Circuits; Further Digital Systems; Digital-to-Analog and Analog-to-Digital conversion; Operational Amplifiers; numerous integrated circuit chips with the following generic chip numbers [555 timer; 741 GP OpAmp; 2N3904 GP NPN transistor; 2N3906 GP PNP transistor; LED TIL 312 Seven-Segment Display; 4N25 Opto-Isolator; 7400 NAND gate (quad 2-input); 7402 NOR gate (quad 2-input); 7404 Hex Inverter; 7408 AND gate (quad 2-input); 7410 NAND gate (triple 3-input); 7414 Hex Inverter with Schmitt trigger inputs); 7420 NAND gate (Dual 4-input); 7432 OR gate (quad 2-input); 7442 (BCD-to-decimal decoder); 7447 (BCD-to-seven-segment decoder/driver); 7474 (Dual D flip-flop - positive edge triggered with preset and clear); 7475 (Dual 2-bit transparent latch); 7476 (Dual J-K flip-flop with preset and clear); 7486 XOR gate (quad 2-input); 7489 RAM - 64-bit with 16 x 4 bit read/write memory; 74LS112 Dual J-K flip-flop; 74121 (one-shot MV - monostable multivibrator); 74147 N, BCD priority encoder (decimal-to-4-line); 74150 Multiplexor/data selector (16-input); 74154 Decoder/demultiplexor (1-of-16); 74192 BCD up/down counter (synchronous); and the 74194 Universal Shift Register (4-bit bidirectional)].

COURSE TITLE: ELECTRONIC COMMUNICATIONS: overall COLLEGE course test score average: 99%

The following topics were covered in great depth in both lecture and implemented in laboratory circuit work: AM/FM Radio theory and stages (Antenna/reception, RF amplifier, local oscillators, IF amplifier, detector/discriminator, audio amplifier Speaker output); amplifiers, oscillators, modulation; mixing & heterodyning; transmitters; receiving - including detection; transmission links; the electromagnetic spectrum allocation and usage; cabling system theory, practice, and installation (e.g., fiber optic, shielded and unshielded twisted pair, coaxial).

COURSE TITLE: PHYSICS

The following topics were covered in great depth in both lecture and implemented in laboratory experiment work: theory and practice of translational and rotational kinematics and dynamics; Newton's Laws of Motion (N-I, N-II, and N-III); work, energy, and power methods (force through space - a scalar); conservation principles [e.g., energy, momentum (translational and rotational)]; collisions; impulse (force through time - a vector); statics, or equilibrium of rigid bodies, stress, strain, and deformation; oscillation (simple harmonic motion, damped, forced, and resonance); gravitation (field, acceleration); fluid mechanics (Pascal's principle, Archimedes principle, Bernoulli's equation); waves in elastic media; sound waves; temperature and thermal energy; kinetic theory of gases; heat and the First Law of Thermodynamics; entropy and the Second Law of Thermodynamics; charge and matter; the electric field; Gauss's Law; electric potential; capacitors and dielectrics; current and resistance; electromotive forces and circuits; the magnetic field; Ampere's Law; Faraday's Law of Induction; induction; magnetic properties of matter; electromagnetic oscillations; alternating currents and voltage; Maxwell's Equations; and Electromagnetic waves.

Additional Machine Shop Experience: responsibilities and activities -

Performed machining & manufacturing of parts utilizing shop tools (standard and custom), milling machines, drill presses, and lathes for the purpose of efficient and economical production of machined/manufactured parts in accordance with customer/client criteria requirements (i.e., drawings and specifications).

Performed the following: rough and fine detail milling, sanding, grinding, material stock sawing; hole drilling, reaming, and finishing; with tap and die of threaded parts. Other surface finishing included: sand blasting, tumbling, honing, lapping, blancharding, chemical wash, edge deburring and chip removal. Performed parts inspection including utilization of micrometers, calipers, balances, fabricated gauges for quick parts inspection, and other metrological methods with comparison to shop standards for size and mass criteria. Performed machine tool equipment maintenance; prevention and corrective maintenance (cleaning, lubrication, re-torqueing, and re-calibration), and reconditioning (milling machines, drill presses, and lathes).

Automotive Repair: knowledge and competency -

Automotive experience is composed of automotive repair and service/maintenance on a wide variety of vehicles (e.g., Domestic, Asian, and European). Areas of automotive excellence are in Automotive Engine Repair (A1), Engine Electrical/Electronic Systems (A6), Engine Performance (A8), and able to fix numerous electrical problems without the use of a wiring diagram.

Utilized the following troubleshooting techniques: utilization of OBD II/I scanner equipment, vehicle specific and general evaluation software; review driver complaint descriptions, visual inspection for obvious problems (e.g., loose/damaged hoses/electrical connections, and fluid/vacuum leaks); and pressure test gauge measurements. Performed the common maintenance/tune-up activities (e.g., 30k/60k/90k miles).

Utilized engine performance theory to determine general engine condition, and effectively perform inspection/test, removal/replacement/change, service/maintenance of the following systems/parts: ECCS - OBD II/I trouble codes evaluation; ECCS power supply (source high and ground); electrical systems; alternator/charging system (proper voltage range response and full load amperage output); battery (crank/non-crank voltage), cables, connections, and wiring harness (voltage drops/evaluation); starter; engine vacuum evaluation and leak inspection; ignition timing/advance; TDC positioning; engine compression testing (condition evaluation of valves, piston rings, and head gasket); cooling system; all other engine-related fluids; electronic fuel injection (EFI, MPFI, or TBI) systems; oxygen sensor voltage output response; air intake system; idle speed; and emission equipment (EGR, PCV, and EEC systems).

Effectively performed inspection/test, removal/replacement/change, service/maintenance of the following parts: filters (e.g., air, oil, fuel, PCV, AIV); fluids/oils (e.g., manual and automatic transmission, differential gear, cooing system, motor oil, brake/clutch/steering) including grease lubrication (e.g., chassis, hood/doors); exhaust system fasteners (anti-seize lubrication); hoses (e.g., coolant, vacuum lines); drive belts adjustment; all gasketry and mating surface sealants; general valves (e.g., PCV, BPT, EGR, solenoid control valve - SCV); sensors (e.g., oxygen, engine temperature, air temperature, air flow, throttle position - TPS, exhaust gas temperature); ignition/electrical system/parts (e.g., low & high tension wires; spark plug electrode interpretation; distributor cap, rotor; ignition timing; engine idle speed; battery; alternator and charging system); chassis electrical and general electrical systems (e.g., ignition switch; fuses and fusible links; bulbs; lighter; lights - head/side/rear; turn signals; horn; windshield motor/washer; and relays); timing equipment (e.g., front cover, belt/chain, chain tensioners/guides, and sprockets); fuel system (e.g., injectors; fuel pressure regulator; pump, filter/pre-filter, and gauge; fuel lines - neoprene/polyester/hypalon, feed supply/return/evaporation lines; fuel check valve; fuel rail/tube; and intake manifold); oil equipment (e.g., pump, drive spindle and gear, oil pressure switch); cooling system (e.g., water pump, radiator, fan/clutch, thermostat, freeze plugs); brackets (e.g., alternator/compressor/filter); pedals (e.g., throttle cable, height/free play of brake/clutch pedals); and brake system (e.g., disc pads/drum shoes; lines; air/fluid bleeder valves; calipers/torque member).

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