Engineer Project

**** **** *** ******* ****

Frisco, TX ***** USA

*******@****.***

+1-972-***-**** (mobile)

Nancy Gao

Strengths

10yrs of professional experience in product development and project management in lighting/semiconductor industry

Fast learner; systematic educational background specialized in material, mechanics, electronic physics, thermal, and illumination related

Designed and Launched various products to global market for LED fixtures and modules; PTC ( Polymer-switch); projector lamp (UHP); WLCSP (wafer level chip scale package)

Expertise in NPI (New Product Introduction) Process Management and program milestone tracking

Extensive skills on varied testing tools and method; Certificated GE DFSS Six Sigma Green Belt

Clear thinker; highly analytical, organized, and self-motivated; a good team player

Professional Experience

2011.7-2015.5 GE Research and Development Center Co., Ltd. (http://www.ge.com)

Technology Program Manager, GE Lighting (LED Lightings)

Achievements:

Acted as Technology Program Mgr. and/or Program Mgr., Led NPI programs from design to mass production, Launched lots of lighting products for global market (LED modules; ET and BT surface mount kits; NMM programs; a series of products extend to EMEA, LA, NA, AU, NZ)

Actively worked with global commercial team to interpret the market demand into technical requirements, especially at the scoping stage

Created/tracked/controlled programs timelines, budgets, costs, risk assessments

Led design team (including electrical driver, mechanical system, thermal and optical system designs) and resolved technical issues to new products release

Worked with supply manufacture team, sub-tier suppliers, quality, sourcing, also combined feedback from customer to ensure cross-functional team stay on the same page and on schedule, and removed barriers to project success

Utilized DFSS (Design for Six Sigma), QFR(Quality Function Deployment), DFMEA and DFR (Design for Reliability) tools in product design

Cost out programs: LEDs benchmark study and analysis to optimize design based on cost down; worked with supplier and sub-tier supplier to find cost out opportunity and figure out cost entitlement for key components.

2009.11-2011.7 TE Connectivity Co. Ltd (http://www.te.com)

Senior Product Development Engineer, R&D Department

Achievements:

Responsible for design, test, evaluate and qualify new circuit protection devices (Polymer switch) to meet customer and market requirements, and define product specification

As project leader, completed SHA plant microSMDC190LR (lower R, innovative design, “Ni+PE” instead of “C+PE”) qualification, won the certified “Compact Bonus” prize

Successfully developed and qualified almost 10 new PTC devices with low cost or high performance by structure design, material select, and qualification tests

Developed and qualified new suppliers for miniSMD fabrication with Supplier Group

Solved and improved the low Cpk and low yield issues for 8 devices for Process Department

Analyzed miniSMD family product failures and provided root cause analysis in response to quality issues and customer complaints, like delamination, cutting method, Cu-plating opening, halogen free process, dimension change design, etc

2008.4-2009.10 Philips Lighting, Philips Electronics Technology Co. Ltd (http://www.uhp.philips.com)

Product Development Engineer, Development Department

Achievements:

Systemic trainings in lamp materials, components, assembly, design, thermal/optical measurements, driver technologies, project management procedure, etc.

Based in Belgium to execute new product development for three months

Built up thermal test capability (BOE/BOT/BOM, SOP, BR/product test specification, etc.)

Responsible for all transfer lamp lifetime testing, and lifetime performance improvement by optimizing thermal/cooling design, and creating the lifetime test spreadsheet

Solved customer complaints and scrap analysis, such as narrow the brightness spread

Led/supported industrial and quality improvement projects in using different statistical tool, brainstorming, FMEA, solution tree, SPC, DOE etc. to handle each MS of project

2005.12-2008.4 Agape Package Manufacturing Ltd. (http://www.apmcn.com)

R&D Engineer (Project Leader), T&E Department

Achievements:

Acted as a team leader, built up the project of wafer level chip scale package (WLCSP)

Recommended, evaluated and procured timely all equipments, tools, and materials

Established all documents (flow chart, control plan, specification, procedure, instruction)

Performed dummy/qual wafers trials and tests, optimized technical process and equipment

Recruited and mentored team members

Worked with cross function team, pushed to resolve the open issues

Project passed the qualified process, handed over to process owner

Education

Master of Material Science and Engineering (Micro-electronic Material), Tongji university, Jan 2006

Awards

Published three research papers on Shanghai Journal of Biomedical Engineering

Won the excellent student scholarships continually for four years, and excellent leader in college

Additional

Software: Office(Word, Excel, PPT), Minitab, AutoCAD; Solidworks, DMAIC, DFSS, Six Sigma

DFSS Green Belt

Fluent in English and Mandarin

Interested in sports, travel, and technologies

Reference available upon request

Contact this candidate