Jerome D. Cohen

**** ***** ***** **.

Florence, SC 29501

www.linkedin.com/in/cohenjd161 - www.indeed.com/me/cohenjd161

845-***-**** acr4mu@r.postjobfree.com

SUMMARY

Experienced Project Manager/Manufacturing Equipment Engineer with proven technical skills, leadership experience, and excellent communication and diagnostic skills. Consistently meets project requirements within given time frames and utilizes broad knowledge base to solve problems and eliminate repeat issues. Demonstrated success reducing cost by standardizing workstations, cycle time reductions, and PM standardization.

Core professional strengths:

Project Management

Technical Manager

Budget Development

Creative Innovator

Equipment Improvements

Safety Compliance

PLC Logic

Documentation / Specification

Networks

Troubleshooting

Software (C Basic

LEAN Training

AutoCAD

Microsoft Suites

Blueprints/Schematics

PROFESSIONAL EXPERIENCE

Thompson Construction - Sumter, SC

Contractor @ GE Healthcare - 3001 Radio Rd, Florence, SC

Advanced Manufacturing Engineer – Molded Coil Manufacturing 2014 – Jul 2015

Worked with Development Engineering (NPI) to streamline a new Molded Coil Process and to develop plans to reduce cycle time through more efficient ways and to introduce automated tooling.

New Mold design concepts to allow for “tool free” assembly.

Automated manipulator to eliminate the need for overhead cranes and shackling.

Oversaw the Factory Acceptance Test and installation of the Broomfield 900 Winder and worked with the Vendor to tailor the software to meet GE’s Requirements and Process Flow.

Managed the construction of two new copper shelled magnet test rooms. Coordinated vendors with manufacturing requirements.

Development of ERS and Verification and Validation procedures and equipment documentation; IQ/OQ/PQ

Development of work instructions for NPI.

IBM SYSTEM & TECHNOLOGY, Microelectronics Division, Hopewell Junction, NY

Project Manager/Equipment Engineer – Wafer Bumping Manufacturing 2010 – 2013

CVD, Dry Etch, PVD, Auto-Inspection Sectors Engineer

Managed 4 3D 300mm semiconductor Equipment toolsets from program conception to manufacturing integration (CVD & PVD Deposition, Dry Etch, and Inspection), with a total capital budget of ~$12M and expense budget of $1.5M. Each project was on time and within budget. Led day-to-day activities of 3 semiconductor equipment sectors.

Led cycle time improvement team using Lean Methodology to increase wafer production by 15 – 20% per day, allowing shipment of additional and increasing revenue by ~$1M.

Controlled costs and maintained high tool performance by standardizing maintenance procedures, spare parts identification and documentation, and establishing rework loops and kitting for reusable parts.

Contributed to LEAN program by participating on the 5S team, Writing Job Instructions Team, leading “8 Steps for Problem Solving” workshop and participating on the PQL team for 3 equipment sectors.

Reviewed equipment status, tooling performance and vendor actions with 4 vendors and 2 contractors, establishing line controls, implementing PM and meeting sector throughput goals.

Provide engineering support to manufacturing by maintaining PLC’s on line and working on several upgrade projects that monitored the equipment.

Managed 10 person team including maintenance and engineering technicians on day to day events and long term projects.

Worked with and directed facilities technicians in the field and reviewed requirements with their leads.

Jerome D. Cohen Page Two

IBM SYSTEM & TECHNOLOGY - Adv Equipment Engineer – PKG Ceramic Substrate 2008 – 2009

Bead Mixers Casting, Blanking Sectors Engineer

Managed operation and maintenance of a unique 25+ year old tool system for producing Multi-Layer Ceramic Modules. Assisted maintenance with locating obsolete parts and managed refurbishment of mechanical parts in IBM’s internal model shop. Led day-to-day activities of 3 MLC equipment toolsets, reporting and acting on events.

Managed ceramic Caster enhancement project, replacing all outdated buttons and switches with required explosion type and rewiring tool, meeting 2 month project timeline and project costs ~$75K and increasing operator productivity.

Provided ongoing project management / engineering support for semiconductor Wafer Bumping Area, maintaining synergy for tool set installation and preventing project start up delays.

IBM SYSTEM & TECHNOLOGY - Adv Equipment Engineer – Wafer Bumping 2006 – 2008

CVD, Dry Etch, and PVD, Engineer

Supported all equipment in the Metals and Dry Etch sectors for both 200 and 300mm wafer bumping, including day-to-day monitoring of equipment, working with Maintenance personnel and directing and supervising 2 Equipment Technicians and 8 Maintenance Technicians over 4 shifts.

Worked with a team reducing waste and increasing productivity, using Lean Value Stream, by standardizing operator work stations and Lean work methods for 4 tool sets, increasing work efficiency by 10%.

Developed process for repairing solder filled masks for a unique 300mm semiconductor process, reducing mask starts with cost savings of 10%. Filed and received 2 patents.

Managed 2 multi-million dollar toolset projects and supervised installation of new 3D wafer Bonder, CVD tool and conversion of Dry Silicon Etch Chamber, facilitating move into the next generation of 3D semiconductor packaging processes.

Development Mask semi-automate inspection station. Replaced PLC and reprogramed equipment in C++ to preform new inspection. Development new fixturing to hold mask.

Managed and worked with a team of maintenance and equipment technicians on day to day events. Countless troubleshooting of equipment both new and old. Responsible for specifying replacement or obsoleted parts.

IBM SYSTEM & TECH - Advisory Engineer – MLC Packaging – Inspection, Test & Repair 1995 - 2006

IBM SYSTEM & TECH - Staff Engineer – MLC Packaging - Thin Films Laser Process Tooling 1988 - 1995

IBM SYSTEM & TECH - Associate Engineer – MLC Packaging – Thin Films Laser Process Tooling 1983 - 1988

IBM SYSTEM & TECHNOLOGY - Jr Engineer – MLC Packaging - Chip Placement 1982 - 1983

EDUCATION

BA, Electrical Engineering, New York Institute of Technology, NY

PATENTS AND PAPERS

Removing Material from Defective Openings in Glass Mold – Patent #: US 200******** A1, 2012

Removing Material from Defective Openings in Glass Mold and Related Glass Mold for Injection Molded Solder, Patent Pending

Electronic Package Repair Process – Patent #: US 000******* B2, 2007

Electronic Package Repair Process – Patent #: US 000******* B2, 2005

Single Level Thin Film Structure with Novel, Routable Repair Solution Capability – Published Tech

Disclosure Bulletin, 2000

Mask Customization by Excimer Laser Ablation – Published Tech Disclosure Bulletin, 1994

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