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MINKAILU A. JALLOH

Poughkeepsie, NY *****

845-***-**** acqrke@r.postjobfree.com

SUMMARY

Versatile NANOSCALE & CHEMICAL ENGINEERING PROFESSIONAL with comprehensive microelectronics technology experience focusing on manufacturing, process, and development. Exceptional skills developing plans for new or enhanced products and technologies leading to new processes, equipment, and scientific application. Recognized technology advisor providing guidance and leadership to peers. Demonstrated success managing and implementing solutions addressing enterprise-wide needs while maximizing business value from technology investment.

Areas of Expertise:

C4 Plating SemiGear & BTU Reflow Process/Tools

Flux Apply & Flux Clean Operations Laser Mask Manufacturing

Decoupling Capacitor Manufacturing (DCAP) 3D Development & Manufacturing Support

Metal Thin Films & Oxides Deposition by High Vacuum Technologies

Process Chemicals Analysis & Chemistries Distribution to Reactors/Baths PROFESSIONAL EXPERIENCE

President, Sanda Transport Company, SL, Ltd. (SATCO), Transport, Technology development and Import Company with offices in Freetown, Sierra Leone, and New York. 2013 - Sept, 2014 IBM, East Fishkill and Poughkeepsie, NY

(Systems and Technology Group)

Process / Manufacturing Engineer, Lead Engineer 2000 – 2013

(C4 Plating Engineering Sectors)

Developed C4NP processes and manufacturing support in mold cleaning operation. Supported manufacturing and controlled reflow processes in SemiGear and BTU tools. Administered Flux apply & clean operations.

Facilitated 3D development and manufacturing support operations at plating in Nexx tools, PECVD oxide and nitride deposition, wafer and glass grind operations in disco tools by producing 10 wafers daily.

Increased production capacity from 360 to 450 wafers per day by reducing C4 Steag Plating tool down- time and optimizing process recipes.

Decreased production cost and cycle time by implementing enhancements and parameters optimization at plating, resist strip, and chemical etch processes.

Facilitated switch to lead-free material use in less than 2 years by contributing to development, qualification, and alternate materials/processes implementation.

Diminished chemical source material and cycle time 25%, optimizing the mold clean process.

Outlined recipes and steps by producing manufacturing process specification documentation.

Reduced engineers per production scheduling, saving manpower costs, by controlling and supporting multiple operations including FSI-MSA oxide removal process, STI-MSA clean, vertical and horizontal electrolytic etches, and resist strip.

Analyzed plating and etch reactors Chemistries for process control and chemical distribution by employing personnel with chemical carts and pump stations.

Enhanced product yield management by improving manufacturing parameters and enhancing productivity.

Coordinated annual manufacturing line cleanroom certification and controlled cleanroom contamination by writing essential documentation and training personnel.

Improved customer satisfaction 20%, reduced critical product launch time by 3 months, by applying consistent / continuous process enhancements, and employing lean control practices.

Enabled streamlined technical transformation, simplifying non-technical terms and language by educating staff and writing process documentation. 2

IBM (Continued)

Interconnect Products Manufacturing, Lead Engineer 1989 – 2000

(Laser Mask and Decoupling Capacitor (DCAP) Manufacturing Engineering sectors) Designed and optimized chrome, copper, and lead (Pb) evaporation processes

Aided operator capabilities by writing manufacturing process specification documentation.

Sustained lead-free development by establishing alternate materials and process for lead (Pb) solder employing injection molten metal solder and paste screening operations.

Enhanced production yields 90 to 99% by influencing contamination control task forces and lean Polyimide (resist) Strip & Aluminum Chemical Etch Operations control practices. C4-Reflow Process Development and manufacturing support.

Wafer Redistribution: Metal Sputter & Chemical Etch Processes.

Mask Fab Technologies: Photolithography and Plating Processes

Lead-free Development: Development of Alternate materials and Processes for Pb Solder. Injection Molten Metal Solder & Pb-free Paste Screening Processes Pipeline Management- New Products Manufacturing Engineering: Lead Process Engineer Responsible for the following operations:

Introduction of New Products in Manufacturing Line; Yield and process responsibilities. Responded to RFI/RFS from OEM and internal customers

Nickel-Gold Electroplating and DP Nickel Technology: Design and Implementation of Plating Contact Frames. Media Blast Clean, Vapor Blast Clean and HBS Clean processes

High Vacuum Technology: Thin Films Metallization:

M.L.C Thin Films Evaporation

Process Control with Optical Emission Spectroscopy (OES tool);

X-ray Fluorescence Spectroscopy (XRF Tool); Nanospec Tool.

Process Design and Experimentation: Metal Thin Films, Pin Braze, Wire Bonding and BAT Line Operations. Pin and Braze Technologies. Adhesion of Polyimide and Metal Thin Films ADDITIONAL RELEVANT EXPERIENCE

POLAROID CORPORATION, Waltham, MA

Engineering Intern, Waltham, MA and Cambridge, MA

NORTH CAROLINA A&T STATE UNIVERSITY, Greensboro, NC Teaching Assistant (Chemical Engineering Department) Teaching / Research Assistant (Chemistry Department) BENNETT COLLEGE, Greensboro, NC

Assistant Instructor (Chemistry)

AHMADIYYA SECONDARY SCHOOL, Kissy, Freetown, Sierra Leone Instructor (Chemistry and Biology)

SIERRA LEONE PETROLEUM REFINERY COMPANY, Freetown, SL Operator (Processes in Refining Crude Oil to Petrol, Kerosene and Diesel Oil) 3

EDUCATIONAL BACKGROUND

MS, Nanoscale Engineering, University at Albany, State University of New York, College of Nanoscale Science and Engineering; Albany, NY

MS, Chemical Engineering, North Carolina A&T State University, Greensboro, NC MS, Chemistry (Analytical and Biochemistry), North Carolina A&T State University, Greensboro, NC BS, Chemistry and Zoology, Fourah Bay College, University of Sierra Leone, Freetown, SL Certification: Emergency Medical Technician (EMT), National & NY State PROFESSIONAL ASSOCIATIONS AND MEMBERSHIPS

Former Chair, National Society of Black Engineers (NSBE), Region 1 National Executive Board Member, IBM East Fishkill Diversity Council & IBM Volunteer Fire / EMS Brigade Chairman of the Board, National Organization of Sierra Leoneans in North America (NOSLINA) Member, American Chemical Society

PATENTS AND INVENTIONS

US Patent: Lead-free Solder Transfer Fixturing, 2001 US Patent: Solder Reflow Type Electrical Apparatus Packaging having Integrated Circuit and Discrete Components, 2005

US Patent: Plating Structure for a Pin Grid Array Package, 2000 Invention: Injection Molten Solder for Fluxless Lead-free Solder Bumping of Decoupling Capacitor: Package

(IPACK2001-15813)

IBM Invention Disclosure: Discolored Gold Overcoat Process, 1991 IBM Invention Disclosure: Enhanced RF Etch Process, 1990 AWARDS AND RECOGNITION

CTOPS Award

Awarded over multiple years for production cost and cycle time reduction Award, Enhanced RF Etch Process at Thin Films Evaporation

Enabled $3.5M savings by designing and implementing process. Award, Discolored Gold Overcoat process

Facilitated $5.3M saving by developing, qualifying, and executing process. TECHNICAL SKILLS

Microsoft Word, PowerPoint, Excel; BRIO, SiView

LANGUAGE SKILLS

Fluent: Temne, Mende, Krio, and English

Conversational: French and Arabic

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