LAKSHMI ANUSHA KONAKALLA

**** ******** *** acp7vt@r.postjobfree.com

Alpharetta, GA,30005 972-***-****

OBJECTIVE : Seeking a recent graduate full-time/Intern/contract position, in the field of RF & Microwave/ Wireless Communication Engineering.

EDUCATION :

The University of Texas at Dallas, TX GPA : 3.182/4.000

M.S in Electrical Engineering August 2013 - May 2015

Osmania University, Hyderabad, AP, India. GPA : 3.141/4.000

B.E in Electrical & Electronics Engineering August 2008 - May 2012

SKILLS : MATLAB, AWR VSS, ADS.

Wireless Technologies: LTE-OFDM Standard, Wi-Fi (802.11a/b/g/n/ac).

RF Design building block & Parameters : PA, LNA, Mixers Characterization, Filters, NF, Gain, VSWR, IMD, S-parameters. RF Matching networks (Lumped/ Distributed).

COURSE-WORK : Wireless Communication (Lab/Course), RF & Microwave Systems Engineering, RF & Microwave Circuits, RF & Microwave Amplifier Design, Microwave Design & Measurement (Lab/Course).

LAB-Experience: Software used: AWR MWO and AXIEM EM Simulators Jan 2015- April-2015

Lab Equipment: VNA, Signal Generator, SMA connectors, Soldering.

Components designed :Series and Shunt Resonators, Wilkinson power divider, Directional and Edge-coupled Microstrip Coupler, Stepped impedance (Butterworth) LP filter and Series & Shunt lines (Chebyshev) LP filter, RF single stage amplifier(with shunt feedback and gain of 10dB ), Patch Antenna.

Designed schematics of all the components and simulated in the MWO and AXIEM EM Simulators,tuning and optimization is performed to meet the design goals and specifications.

Created layouts for designed schematics with included packaged passive components like Resistors (0603 package size), Capacitors, NEC pHEMT transistor.

Gerber files are generated for designed layouts for milling the PCB board

SMA connectors and Packaged Passive components are soldered on the PCB board and tested these boards for its performance (like I/O Return losses, Insertion loss/Gain, Isolation, Coupling, Directivity, Group delay, Phase response, attenuation) using VNA .

LAB-Experience :Skills Used: LabVIEW, Math-Script . August 2014-Dec 2014

Wireless Technologies : OFDM, 802.11a/b/g.

Lab Equipment : Spectrum Analyzer, USRP, Ethernet Cable (1 GB), Antenna ( Tx / Rx).

Wi-Fi IEEE 802.11g Signal Decoding : 802.11g signal is decoded from the given raw IQ samples of ERP-OFDM packet frame by implementing frequency and phase error correction, Channel Estimation and Equalization after detecting the start of the frame, Signal-field and OFDM data decoded and found the constellation of the received packet frame.

ACADEMIC PROJECTS :

Broad-Band RF Amplifier Design: Designed a two stage broadband RF amplifier with pHEMT transistor used as front end amplifier in optical receiver Analyzed its DC and AC performance in the range of 0.1 to 2 GHz and stability of the amplifier using Rollett’s stability criterion over a range of 0.1 to 12GHz.

Low Noise Amplifier Design: Designed a two stage low noise amplifier (NEC710 transistors), for which have designed matching(I/O/Intermediate stages) and bias network. Analyzed for stability and performance for achieving NF =1.8dB and Gain =18.26 dB

Physical layer simulation of a simplified LTE-OFDM system: Implemented a simplified version of OFDM

used in LTE downlink in MATLAB software. Built an OFDM Tx/Rx and simulated for AWGN and Multi-path Channel (Indoor /Outdoor). Calculated its BER performance for SNR ranging from 3 to 11dB.

WORK AUTHORIZATION / AVAILABLITY : F-1 (OPT-EAD), 6/25/2015.

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