Project management

YICONG ZHANG

Address: ** *** **** ****** ***, BROOKLYN NY 11214

Contact by: cell phone 646-***-****; e-mail: **************@*******.***

Working Experience

Summary:

* ***** *** ***** *****ng experiences involving R&D project management, APQP process for

new product development and validation, product and process development, equipment and product

validation and quality control. Succesful track record in leading project team where product cost and

speed to market have been identified as key growth and expansion opportunities. Proficient in

Design FMEA, Process FMEA, Control Plan, Lean tools (Six Sigma,SPC, MSA, GR&R )

New material research, LED performance characteristics research, LED system research, LED

driver topology (Buck, Boost, Buck/Boost) refer to the physical design, layout and capacity of the

driver power factor, dimming control for LED array(series/parallel), dimming techniques for

switch-mode LED driver: Pulse-width-modulation (PWM) dimming and analog dimming and

TRIAC dimming. Improve dimming performance (flickering effect and low THD) .

Product quotation, customer service, highly profitient in AutoCAD, SAP/ERP Programs, Microsoft

Application (Excel, Power Point, Word).

Lightning Optoelectronics Co., Ltd. (Shenzhen)

NPI Manager (September 2013-August 2014)

Responsibilities

Use APQP process for new product development( plan and define program product design and

development verification process design and development verification product &process

validation--feedback asseseement and corrective action )

Establish RFD, Design goals, Design quality &Reliability Test, Bill of Material(BOM), process

flow chart, DFMEA, PFMEA, Measurement Systems Analysis plan, pre-launch control plan,

Failure analysis(FA), Process capability study(Cp, Cpk ) Process Performance( Pp, Ppk)

Responsible for new product introduction. Successful projects: Mid-power Product 3030, 3020,

3014 2016 with EMC (Epoxy Molding Compound) lead-frame technology and High-power COB

(>10W) with ceramic & Mirror Aluminum substrate.

Lead cross-functional team through the stages of product development from R&D’s design concept

review, project kick off, planning execution, cost control, trial run and mass production.

Responsible for management of project team. Mission allocation, manpower management, overall

project management, make sure new product meet time, cost and quality requirement.

Upgrade the performance for existing product. Solve key problems which affect project process,

Define project management process, engineering change process and manufacturing process.

Organize various meeting, e.g. design review meeting, project kick off meeting, molding review

meeting, trial run review meeting and milestone review meeting etc.

Improve NPI Yield from trial run to mass production by mentoring engineers in use of lean tools

(six sigma, multiple DOEs, FEMA, MSA GRR and SPC).

Communicate with oversea important customers, convert customer requirement to internal

requirement, optimize new product kitting shipment and enhance customer satisfaction. Successful

customer project case: Obtaining PPAP approval for EMC 3030 & EMC3020 from Philips

Lumileds.

Honglitronic Optoelectronics Co., Ltd. (Guangzhou) (STOCK CODE:300219)

LED R&D Director (Sept. 2011 - Sept. 2013)

Responsibilities

Responsible for LED materials development and new product development (NPD) management.

Especially for luminescent materials like YAG phosphor and Nitrides phosphor. Establish R&D

projects and organize a R&D team, Design, develope and validate multiple process and process

equipment,set up the production line, ultimately achieve the goal from R&D process to mass

production (MP). Process capability study (Cp,Cpk)

Define, teste, standardize and implement new phosphor dispensing process, which significantly

reduced the phosphor cost and improved Lumen

Analyzes new product quotation by combining cost and competitor’s price to enhance product sales

and margins. Coordinates receipt of all required information for the preparation of final quotation

submittal. Coordinates transmittals of plans, drawings and other documents to customers.

Communicates with customers to resolve problems with projects during the bidding process. Price

estimates by computing the raw material cost, the depreciation cost from fixture, tools and

equipments to be manufactured, outside source cost, inventory availability, logistics cost (freight,

staging, handling) Establishes Price Strategy for long-term customers and Price validity.

Responsible for defining product features and product road map and competitive positioning, assist

manufacturing department in tackling technical problems from the production lines. Familiar with

advanced quality control tools (CAPA, 8D, and SOP) so as to prevent product failure and

recurrence.

Responsible for the following R&D Projects:

Research on down-conversion and up-conversion material

Research on luminescent materials :rare earth:(Y,Gd)3(Al,Ga)5O12:Ce (YAG:Ce)

wavelength(540nm-570nm), Nitrides phosphor Sr2Si5N8:Eu2+ wavelength: (600nm -680nm),

Silicate phosphorZn2SiO4: Mn 2+,Y2SiO5:Tb, Aluminate phosphor Al2Si2O8 :Eu, Sr4Al14O25:Eu,

Long afterglow phosphorescent materials ZnS:Eu2+

Opto-Core Optoelectronics Co., Ltd. (Shenzhen)

Senior Engineer (October 2009- August 2011)

Responsibilities

Develops LED packaging engineering for SMD & HIGH POWER.

Process modifications that result in better process control and improved process quality

Drives improvements in color binning and color targeting.

Assists with the resolution of manufacturing and quality issues.

Research on semiconductor and nanomaterials

LED system research for LED driver topology(Buck, Boost, Buck/Boost) refer to the physical

design, layout,and capacity of the driver,power factor, dimming control for LED

array(series/parallel)

Develops LED products for High power COB and UV LED

Develops overall system efficiency ( LPW AT CRI 110 90)

Solves the problem of non-uniform LED illumination

Minimizes LED droop attributed by an indirect Auger Recombination process

Develops the heat-sink materials: metal materials :Cu alloy( Cu Sn Al Si) and ceramic materials

Optical Design for external quantum efficiency optimization

Develops new nano luminescent materials

Develops SMD &High Power technology process.

Research for GaN-base processing technique by a specific laser whose energy band gap is between

those of GaN and Al2O3.

Internship Experience

IEMN (Institut d' Electronique de Microélectronique de Nanotechnologies) (Lille, France)- (Sept. 2008-

July 2009)

Working on "3D Simulation of Semiconductor Nanodevice for Ultra-High Speed Electronics"

funded by the French CNRS.

Gaining substantial experience in a three-dimensional ensemble Monte Carlo simulator applied for

the DC and HF study of semiconductor nanojunctions and thin-film nanostructures.

Developing the integration of a sophisticated finite-element Poisson solver in the simulator to allow

a more accurate simulation of complex geometries, such as nanowire.

The analysis of Si and - nanowire-based device attention to quantum transport in these

structures.

Education

Université des Sciences et Technologies de Lille (Lille I) (France)

Master degree in Microelectronics and Nanotechnology (Sept. 2007- July 2009)

Université des Sciences et Technologies de Lille (Lille I)(France)

Bachelor degree in Electronic Engineering, Electrical system and Automatics

(Sept. 2004 - July 2007)

Language Skills

English, Mandarin, Cantonese,French,

Patent

A high power LED package structure (CN201120146792)

A method of making the COB light source (CN 201*********)

A higher light efficiency and luminous uniformity of LED light source (CN 201*********)

A LED module substrate structure (CN201120566619)

A higher color rendering index and higher light efficiency LED and method (CN201110447446)

A light source module for improving luminous uniformity (CN201120567413)

Self-assessment

Ability to work and contribute to a team environment

Task oriented & works effectively under pressure excellent problem solving skills,Strong

interpersonal skills

Willingness to help others / share knowledge Adapt and learn quickly to new challenges

Extroverted gregarious agreeable helpful conscientious persevering

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